SG11201610182SA - Molecular inks - Google Patents
Molecular inksInfo
- Publication number
- SG11201610182SA SG11201610182SA SG11201610182SA SG11201610182SA SG11201610182SA SG 11201610182S A SG11201610182S A SG 11201610182SA SG 11201610182S A SG11201610182S A SG 11201610182SA SG 11201610182S A SG11201610182S A SG 11201610182SA SG 11201610182S A SG11201610182S A SG 11201610182SA
- Authority
- SG
- Singapore
- Prior art keywords
- molecular inks
- inks
- molecular
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/08—Printing inks based on natural resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/14—Printing inks based on carbohydrates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/364—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith using a particular conducting material, e.g. superconductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1136—Conversion of insulating material into conductive material, e.g. by pyrolysis
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462014360P | 2014-06-19 | 2014-06-19 | |
PCT/CA2015/050568 WO2015192248A1 (fr) | 2014-06-19 | 2015-06-19 | Encres moléculaires |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201610182SA true SG11201610182SA (en) | 2017-01-27 |
Family
ID=54934622
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201610182SA SG11201610182SA (en) | 2014-06-19 | 2015-06-19 | Molecular inks |
Country Status (10)
Country | Link |
---|---|
US (2) | US10883011B2 (fr) |
EP (2) | EP3689984B8 (fr) |
JP (1) | JP6541696B2 (fr) |
KR (1) | KR102387043B1 (fr) |
CN (1) | CN106574135B (fr) |
CA (1) | CA2950628C (fr) |
FI (1) | FI3689984T3 (fr) |
MX (2) | MX2016016659A (fr) |
SG (1) | SG11201610182SA (fr) |
WO (1) | WO2015192248A1 (fr) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6775531B2 (ja) | 2015-06-11 | 2020-10-28 | ナショナル リサーチ カウンシル オブ カナダ | 高導電性銅フィルムの調製 |
JP7186709B2 (ja) * | 2016-10-25 | 2022-12-09 | イー2アイピー テクノロジーズ インコーポレイテッド | プリンテッド・エレクトロニクス |
TW201842088A (zh) | 2017-02-08 | 2018-12-01 | 加拿大國家研究委員會 | 可印刷分子油墨 |
TW201842086A (zh) * | 2017-02-08 | 2018-12-01 | 加拿大國家研究委員會 | 加工金屬導電層之方法 |
TW201842087A (zh) | 2017-02-08 | 2018-12-01 | 加拿大國家研究委員會 | 具改良之熱穩定性的分子油墨 |
TWI842668B (zh) * | 2017-02-08 | 2024-05-21 | 加拿大國家研究委員會 | 具低黏度與低加工溫度之銀分子油墨 |
US10797108B2 (en) * | 2017-09-07 | 2020-10-06 | Her Majesty the Queen in the Right of Canada, as represented by the Minister of Industry, through the Communication Research Centre Canada | Printed reconfigurable electronic circuit |
CA3080219A1 (fr) | 2017-10-27 | 2019-05-02 | National Research Council Of Canada | Substrats revetus de nanotubes de nitrure de bore destines au frittage de traces metalliques par une lumiere pulsee intense |
US11680180B2 (en) * | 2018-02-13 | 2023-06-20 | Liquid X Printed Metals, Inc. | E-textiles fabricated using particle-free conductive inks |
US20210360781A1 (en) * | 2018-05-08 | 2021-11-18 | Jabil Inc. | Stretchable conductive ink package based on dual-system polysiloxane |
EP3597707B1 (fr) * | 2018-07-19 | 2021-10-06 | Heraeus Deutschland GmbH & Co. KG | Formulation destinée à être appliquée sur le verre, la porcelaine, les carreaux, les métaux et les feuilles en matière plastique |
CN112772003A (zh) | 2018-08-07 | 2021-05-07 | 加拿大国家研究委员会 | 包覆模制的印刷电子部件及用于制造其的方法 |
CN109880441A (zh) * | 2019-03-19 | 2019-06-14 | 宁波石墨烯创新中心有限公司 | 导电油墨及其制备方法、薄膜晶体管及其制备方法 |
CN110358367A (zh) * | 2019-05-31 | 2019-10-22 | 南开大学 | 一种用做可拉伸微电子电路导电油墨的弹性导体材料及其合成方法 |
TWI815706B (zh) * | 2019-09-24 | 2023-09-11 | 美商阿爾發金屬化工公司 | 燒結組成物 |
TWI805862B (zh) * | 2019-10-17 | 2023-06-21 | 德商賀利氏德國有限責任兩合公司 | 施用於玻璃、瓷、瓦、金屬及塑料膜之調配物 |
JP7193605B1 (ja) * | 2021-10-15 | 2022-12-20 | 田中貴金属工業株式会社 | 金属ペースト |
CN114255945A (zh) * | 2021-11-30 | 2022-03-29 | 福建省长汀卓尔科技股份有限公司 | 一种添加剂及其应用、2-17型钐钴磁体及其制备方法 |
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US20150298248A1 (en) | 2014-04-17 | 2015-10-22 | Electroninks Incorporated | Bonded structure including a conductive bonding layer and low-temperature method of forming a bonded structure |
US9982154B2 (en) | 2014-04-17 | 2018-05-29 | Electroninks Incorporated | Solid ink composition |
US10703924B2 (en) | 2014-05-30 | 2020-07-07 | Electroninks Writeables, Inc. | Conductive ink for a rollerball pen and conductive trace formed on a substrate |
-
2015
- 2015-06-19 US US15/319,910 patent/US10883011B2/en active Active
- 2015-06-19 EP EP19209067.8A patent/EP3689984B8/fr active Active
- 2015-06-19 EP EP15810065.1A patent/EP3158015B1/fr active Active
- 2015-06-19 CA CA2950628A patent/CA2950628C/fr active Active
- 2015-06-19 CN CN201580032170.0A patent/CN106574135B/zh active Active
- 2015-06-19 FI FIEP19209067.8T patent/FI3689984T3/fi active
- 2015-06-19 WO PCT/CA2015/050568 patent/WO2015192248A1/fr active Application Filing
- 2015-06-19 JP JP2016573028A patent/JP6541696B2/ja active Active
- 2015-06-19 KR KR1020177001726A patent/KR102387043B1/ko active IP Right Grant
- 2015-06-19 SG SG11201610182SA patent/SG11201610182SA/en unknown
- 2015-06-19 MX MX2016016659A patent/MX2016016659A/es unknown
-
2016
- 2016-12-14 MX MX2021007763A patent/MX2021007763A/es unknown
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2020
- 2020-11-24 US US17/102,661 patent/US11525066B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP3158015A4 (fr) | 2018-02-07 |
US20170130084A1 (en) | 2017-05-11 |
EP3689984A1 (fr) | 2020-08-05 |
US10883011B2 (en) | 2021-01-05 |
EP3689984B8 (fr) | 2023-07-12 |
CN106574135A (zh) | 2017-04-19 |
MX2021007763A (es) | 2021-08-05 |
US11525066B2 (en) | 2022-12-13 |
KR20170023994A (ko) | 2017-03-06 |
WO2015192248A1 (fr) | 2015-12-23 |
KR102387043B1 (ko) | 2022-04-14 |
US20210079248A1 (en) | 2021-03-18 |
EP3158015A1 (fr) | 2017-04-26 |
EP3158015B1 (fr) | 2019-12-04 |
CA2950628A1 (fr) | 2015-12-23 |
JP2017524761A (ja) | 2017-08-31 |
CN106574135B (zh) | 2021-04-06 |
EP3689984B1 (fr) | 2023-06-07 |
FI3689984T3 (fi) | 2023-07-20 |
CA2950628C (fr) | 2022-11-08 |
JP6541696B2 (ja) | 2019-07-10 |
MX2016016659A (es) | 2017-05-15 |
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