WO2010128107A1 - Procédé de fabrication de pistes conductrices - Google Patents

Procédé de fabrication de pistes conductrices Download PDF

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Publication number
WO2010128107A1
WO2010128107A1 PCT/EP2010/056189 EP2010056189W WO2010128107A1 WO 2010128107 A1 WO2010128107 A1 WO 2010128107A1 EP 2010056189 W EP2010056189 W EP 2010056189W WO 2010128107 A1 WO2010128107 A1 WO 2010128107A1
Authority
WO
WIPO (PCT)
Prior art keywords
process according
organometallic compound
compound
substrate
exposed
Prior art date
Application number
PCT/EP2010/056189
Other languages
English (en)
Inventor
Ko Hermans
Josué Jean Philippe VALETON
Original Assignee
Neodec B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neodec B.V. filed Critical Neodec B.V.
Publication of WO2010128107A1 publication Critical patent/WO2010128107A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/06—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/145—Radiation by charged particles, e.g. electron beams or ion irradiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/06—Silver salts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds

Definitions

  • the invention pertains to a process for the manufacturing of conductive tracks..
  • Conductive tracks are currently used as one of the main components in a wide variety of applications ranging from electronic circuitry (e.g. in computers and displays), and antennas to anti-static films. These tracks are made from conductive metals (e.g. copper, silver or gold), ceramics (e.g. ITO) or polymers (e.g. poly(3,4-ethylenedioxythiophene)) and can be manufactured via different methods in a wide range of sizes and shapes.
  • conductive metals e.g. copper, silver or gold
  • ceramics e.g. ITO
  • polymers e.g. poly(3,4-ethylenedioxythiophene)
  • a conventional method to create conductive tracks comprises the steps of depositing a conductive layer on a substrate by chemical or physical vapor deposition, for example.
  • a photosensitive coating is deposited on top of the conductive layer and the coating is locally exposed to light.
  • a difference in solubility is created in exposed and non-exposed areas of the photosensitive layer and the soluble areas are subsequently removed using an appropriate solvent.
  • the conductive layer is exposed to an aggressive etching fluid and the parts, which are not shielded by the remaining photosensitive coating, are removed.
  • the remaining photosensitive coating is removed by using another solvent.
  • the exposure is applied to locally decompose the compound into insoluble species and thus create a difference in solubility between the exposed and non-exposed areas.
  • the non-exposed, soluble, areas are removed by exposing the material to a suitable solvent. It is possible to improve the conductivity of the obtained pattern by applying a temperature annealing step or reducing step.
  • Another method is based on the concept of electroless plating.
  • a substrate is exposed to several subsequent baths. First the substrate is etched and neutralized to ensure good adhesion and activated to ensure the absorption of a catalyst. Next it is exposed to a catalyst to promote the deposition of the conductive layer and exposed to an accelerator, which improves the deposition of the conductive layer. Finally the substrate is exposed to a solution of conductive material to create the conductive layer.
  • This method can be used to create highly conductive tracks. However, the process is very complex and the solutions are often toxic and very aggressive. Furthermore, the method is very sensitive to the processing parameters and a slight deviation can result in spontaneous precipitation of the conductive material in non-desired areas.
  • a more convenient method to manufacture conductive tracks is based on the printing (e.g. ink-jet printing, offset printing, screen printing, or flexo printing) of conductive ink.
  • conductive inks are usually made up from polymer solutions or nano- dispersions of colloidal metal particles.
  • These methods have the advantage that the conductive tracks are created in the desired size and shape without any additional patterning steps.
  • a thermal treatment is required to make the applied materials conductive.
  • an organic coating which is applied to the metal particles to form a stable dispersion, is removed and the particles are sintered together into densely packed conductive metal tracks.
  • the heat treatment is applied to remove any remaining solvent.
  • this object is achieved by a process for the manufacturing of conductive tracks, comprising a coating step, in which an organometallic compound, defined by MX where M is metal cation and X is an organic anion, is applied from a solution onto a substrate, an exposure step, during which the organometallic compound is exposed to electromagnetic radiation, and a heating step.
  • a coating step in which an organometallic compound, defined by MX where M is metal cation and X is an organic anion
  • a part of the organometallic compound is activated via locally exposing said compound to electromagnetic radiation.
  • the manufacturing is carried out at a temperature range between 0 0 C and 350 0 C, more preferably between 20 0 C and 200 0 C. More preferably the heating step is carried out at a temperature range between 50 0 C and 350 0 C, more preferably between 70 0 C and 200 0 C.
  • a conductive track is to be understood as a pattern of a conductive material, which can be in any shape or size, with the restriction that the conductivity of the track should be more than 1000 Siemens per meter (SIm). Said track can cover the complete substrate on which it is deposited, but also only a part of it. Furthermore said track can be considered as a single feature or plurality of features.
  • an organometallic compound is to be understood as any compound consisting of a metal cation (M) and an organic anion (X).
  • M metal cation
  • X organic anion
  • M metal cation
  • X organic anion
  • the following metals (M) either alone or in combination with each other are preferred: copper, aluminum, platinum, palladium, silver or gold.
  • the organic part (X) of said compound should be large enough to allow sufficient dissolution in the preferred solvent. It should also be small enough not to have a limiting effect on the final properties of the conductive tracks.
  • the organometallic compound belongs to the class of metal carboxylates and/or metal thiolates, in which preferably the number of carbon atoms lies between 4 and 20.
  • the organometallic compound belongs to the class of metal carboxylates, in which preferably the number of carbon atoms lies between 8 and 12, and in which the carbon backbone is branched.
  • the organometallic compound is a metal neodecanoate, most preferably silver neodecanoate.
  • the film formation and/or the conductivity of the conductive tracks is improved by adding a solid organic compound to the organometallic solution.
  • Said compound can be an oligomeric or polymeric or monomeric component which can preferably be dissolved in the same solvent as the organometallic compound.
  • the molecular weight of said compound should be at least 500 gram/mol.
  • Oligomers or polymers which can be used are known to those skilled in the art, and can for example be, but are not limited to: polycarbonate (PC,) polystyrene (PS), polymethylmethacrylate (PMMA), polyethylene (PE), polypropylene (PE) or poly(ethylene terephthalate) (PET).
  • the solid organic compound is a mixture of a monomeric compound and a polymerization initiator.
  • the solid organic compound is a polymeric precursor.
  • the polymeric precursor should have at least one active group, which can react to other active groups with or without the addition of an initiator.
  • examples of these polymeric precursors are known to one skilled in the art and are understood to be any species, which can form a polymer or polymer network upon polymerization, such as, but not limited to, methylmethacrylate, ethylene, propylene or butadiene.
  • the polymerization initiator is preferably a UV initiator, which is capable of reacting with the polymeric precursors upon absorption of UV light.
  • any known UV initiator can be used like for example any Irgacure® initiator of Ciba Specialty Chemicals in a typical concentration range of about 1 to 10 wt-%.
  • the organometallic compound To apply the organometallic compound to a substrate it is dissolved in a suitable solvent.
  • the organometallic compound should be sufficiently soluble in said solvent to allow the required adjustment of processing parameters, such as viscosity and surface tension, for a desired processing method.
  • the solvent is an organic, aromatic solvent like for example toluene or xylene.
  • the organometallic compound is dissolved into an apolar solvent.
  • the organometallic compound can be applied from solution to the substrate via any known method, which can be used to apply thin layers from solution to a substrate.
  • any known method which can be used to apply thin layers from solution to a substrate.
  • Methods which can for example be used to apply the track in a desired pattern include ink-jet printing, solution casting, offset printing, screen printing, flexoprinting, spin coating, doctor blading, dip coating, capillary filling or spray coating.
  • the substrate - on which the organometallic compound is applied - is a polymeric substrate.
  • Further material for the substrates are ceramic, glassy or metallic, whereby for all substrates is the restriction essential that the substrate should not dissolve in the solution containing the organometallic compound, during the time said substrate is exposed to this solution.
  • flexible, commodity polymeric substrates such as poly(ethylene terephthalate) (PET) or comprising at least 80% of poly(ethylene terephthalate) and triacetyl cellulose (TAC) or comprising at least 80% of triacetyl cellulose, which tend to degrade and/or deform at elevated temperature.
  • the substrate on which the organometallic compound is applied can be any shape or size.
  • the substrate can for example be a sheet, slide, foil, plate, fiber or a porous membrane.
  • the required exposure step after the deposition of the organometallic compound consists of an exposure to electromagnetic radiation. Said exposure can be performed under ambient conditions or in any inert atmosphere without any significant change in the final properties of the conductive tracks.
  • the exposure occurs preferably with electromagnetic irradiation in a wavelength range between 200 - 1000 nm, more preferably between 250-450 nm.
  • the light applied for the exposure is UV light.
  • organometallic compound is activated by locally exposing said compound to electromagnetic radiation.
  • This can for example be done by using a photolithographic UV mask exposure or a holographic UV exposure.
  • a latent image is created in the organometallic film.
  • This latent image is characterized by a difference in speed of development during the heating step. During the heating step, the exposed areas are therefore more easily reduced into a conductive track than the non- exposed areas. It is preferred to remove the material remaining in the non- exposed areas by using a proper solvent such as for example toluene, xylene or isopropanol.
  • the layer comprising the organometallic and (where required the) solid organic compound is heated to preferable between 50 to 350 0 C and more preferably between 70 to 200 0 C.
  • the heating step can be carried out by any means by which the temperature of organometallic compound or the forming conductive track is increased. This does not necessarily mean that the substrate on which the organometallic compound is applied should be at the same temperature.
  • the heating can for example be done by using infra red (IR) radiation, hot gas, oxygen or argon plasma, microwave radiation or direct contact with a hot object.
  • IR infra red

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)

Abstract

L'invention concerne un procédé de fabrication de pistes conductrices qui comprend une étape de revêtement au cours de laquelle un composé organométallique, appelé MX, M étant un cation métallique et X un anion organique, est appliqué à partir d'une solution sur un substrat; une étape d'exposition au cours de laquelle le composé organométallique est exposé à un rayonnement électromagnétique, et une étape de chauffage.
PCT/EP2010/056189 2009-05-07 2010-05-06 Procédé de fabrication de pistes conductrices WO2010128107A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP09159688 2009-05-07
EP09159688.2 2009-05-07

Publications (1)

Publication Number Publication Date
WO2010128107A1 true WO2010128107A1 (fr) 2010-11-11

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Application Number Title Priority Date Filing Date
PCT/EP2010/056189 WO2010128107A1 (fr) 2009-05-07 2010-05-06 Procédé de fabrication de pistes conductrices

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015192248A1 (fr) * 2014-06-19 2015-12-23 National Research Council Of Canada Encres moléculaires
US11472980B2 (en) 2017-02-08 2022-10-18 National Research Council Of Canada Molecular ink with improved thermal stability
US11746246B2 (en) 2017-02-08 2023-09-05 National Research Council Of Canada Silver molecular ink with low viscosity and low processing temperature
US11873409B2 (en) 2017-02-08 2024-01-16 National Research Council Of Canada Printable molecular ink

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5064685A (en) * 1989-08-23 1991-11-12 At&T Laboratories Electrical conductor deposition method
US5534312A (en) * 1994-11-14 1996-07-09 Simon Fraser University Method for directly depositing metal containing patterned films
US20020076495A1 (en) * 2000-06-06 2002-06-20 Maloney David J. Method of making electronic materials
EP1293508A1 (fr) * 2001-09-11 2003-03-19 Samsung Electronics Co., Ltd. Précurseur d' un composé organometallique pour former des motifs métalliques
US20030207568A1 (en) * 2002-04-30 2003-11-06 Byun Young Hun Organometallic precursor for forming metal pattern and method of forming metal pattern using the same
US20040026258A1 (en) * 2002-06-26 2004-02-12 No Chang Ho Method for forming high reflective micropattern
US20040176623A1 (en) * 2003-03-04 2004-09-09 Son Hae Jung Organometallic precursor for forming metal film or pattern and method of forming metal film or pattern using the same
WO2004077530A2 (fr) * 2003-02-26 2004-09-10 Ekc Technology, Inc. Films de carboxylate de titane a usage dans le traitement des semiconducteurs
US20050250051A1 (en) * 2002-11-25 2005-11-10 Kim Jin Y Organometallic composition for forming a metal alloy pattern and a method of forming such a pattern using the composition
WO2009080642A2 (fr) * 2007-12-20 2009-07-02 Technische Universität Eindhoven Procédé de fabrication de pistes conductrices

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5064685A (en) * 1989-08-23 1991-11-12 At&T Laboratories Electrical conductor deposition method
US5534312A (en) * 1994-11-14 1996-07-09 Simon Fraser University Method for directly depositing metal containing patterned films
US20020076495A1 (en) * 2000-06-06 2002-06-20 Maloney David J. Method of making electronic materials
EP1293508A1 (fr) * 2001-09-11 2003-03-19 Samsung Electronics Co., Ltd. Précurseur d' un composé organometallique pour former des motifs métalliques
US20030207568A1 (en) * 2002-04-30 2003-11-06 Byun Young Hun Organometallic precursor for forming metal pattern and method of forming metal pattern using the same
US20040026258A1 (en) * 2002-06-26 2004-02-12 No Chang Ho Method for forming high reflective micropattern
US20050250051A1 (en) * 2002-11-25 2005-11-10 Kim Jin Y Organometallic composition for forming a metal alloy pattern and a method of forming such a pattern using the composition
WO2004077530A2 (fr) * 2003-02-26 2004-09-10 Ekc Technology, Inc. Films de carboxylate de titane a usage dans le traitement des semiconducteurs
US20040176623A1 (en) * 2003-03-04 2004-09-09 Son Hae Jung Organometallic precursor for forming metal film or pattern and method of forming metal film or pattern using the same
WO2009080642A2 (fr) * 2007-12-20 2009-07-02 Technische Universität Eindhoven Procédé de fabrication de pistes conductrices

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015192248A1 (fr) * 2014-06-19 2015-12-23 National Research Council Of Canada Encres moléculaires
CN106574135A (zh) * 2014-06-19 2017-04-19 加拿大国家研究委员会 分子油墨
US10883011B2 (en) 2014-06-19 2021-01-05 Groupe Graham International Inc. Molecular inks
US11525066B2 (en) 2014-06-19 2022-12-13 National Research Council Of Canada Molecular inks
US11472980B2 (en) 2017-02-08 2022-10-18 National Research Council Of Canada Molecular ink with improved thermal stability
US11746246B2 (en) 2017-02-08 2023-09-05 National Research Council Of Canada Silver molecular ink with low viscosity and low processing temperature
US11873409B2 (en) 2017-02-08 2024-01-16 National Research Council Of Canada Printable molecular ink

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