MX2016016659A - Tintas moleculares. - Google Patents
Tintas moleculares.Info
- Publication number
- MX2016016659A MX2016016659A MX2016016659A MX2016016659A MX2016016659A MX 2016016659 A MX2016016659 A MX 2016016659A MX 2016016659 A MX2016016659 A MX 2016016659A MX 2016016659 A MX2016016659 A MX 2016016659A MX 2016016659 A MX2016016659 A MX 2016016659A
- Authority
- MX
- Mexico
- Prior art keywords
- formate
- copper
- inks
- flake
- octylamine
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/08—Printing inks based on natural resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/14—Printing inks based on carbohydrates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/364—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith using a particular conducting material, e.g. superconductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1136—Conversion of insulating material into conductive material, e.g. by pyrolysis
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Una tinta molecular sin escamas adecuada para imprimir (por ejemplo, impresion de pantalla) trazas conductoras sobre un sustrato tiene 30-60 % en peso de un carboxilato de plata C8-C12 o 5-75 % en peso de formiato de bis (2-etil-1-hexilamina) de cobre (II), formiato de bis (octilamina) de cobre (II) o formiato de tris (octilamina) de cobre (II), 0.1-10 % en peso de un aglutinante polimerico (por ejemplo etilcelulosa) y equilibrio de al menos un disolvente organico. Las trazas conductoras formadas con la tinta molecular son mas delgadas, tienen menor resistividad, tienen mayor adherencia a un sustrato que las tintas de escamas metalicas, tienen una mejor resolucion de impresion y son hasta 8 veces menos rugosas que las tintas de escamas metalicas. Ademas, la fuerza de cizallamiento requerida para eliminar los diodos emisores de luz unidos a las trazas, mediante el uso de Loctite 3880 es al menos 1.3 veces mas fuerte que para las tintas a base de escamas comercialmente disponibles.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462014360P | 2014-06-19 | 2014-06-19 | |
PCT/CA2015/050568 WO2015192248A1 (en) | 2014-06-19 | 2015-06-19 | Molecular inks |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2016016659A true MX2016016659A (es) | 2017-05-15 |
Family
ID=54934622
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2016016659A MX2016016659A (es) | 2014-06-19 | 2015-06-19 | Tintas moleculares. |
MX2021007763A MX2021007763A (es) | 2014-06-19 | 2016-12-14 | Tintas moleculares. |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2021007763A MX2021007763A (es) | 2014-06-19 | 2016-12-14 | Tintas moleculares. |
Country Status (10)
Country | Link |
---|---|
US (2) | US10883011B2 (es) |
EP (2) | EP3689984B8 (es) |
JP (1) | JP6541696B2 (es) |
KR (1) | KR102387043B1 (es) |
CN (1) | CN106574135B (es) |
CA (1) | CA2950628C (es) |
FI (1) | FI3689984T3 (es) |
MX (2) | MX2016016659A (es) |
SG (1) | SG11201610182SA (es) |
WO (1) | WO2015192248A1 (es) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3307705B1 (en) | 2015-06-11 | 2021-05-05 | National Research Council of Canada | Preparation of high conductivity copper films |
US11161996B2 (en) | 2016-10-25 | 2021-11-02 | E2Ip Technologies Inc. | Printed electronics |
TW201842088A (zh) | 2017-02-08 | 2018-12-01 | 加拿大國家研究委員會 | 可印刷分子油墨 |
TW201842087A (zh) | 2017-02-08 | 2018-12-01 | 加拿大國家研究委員會 | 具改良之熱穩定性的分子油墨 |
TW201842086A (zh) * | 2017-02-08 | 2018-12-01 | 加拿大國家研究委員會 | 加工金屬導電層之方法 |
CA3052747A1 (en) * | 2017-02-08 | 2018-08-16 | National Research Council Of Canada | Silver molecular ink with low viscosity and low processing temperature |
CA3002992C (en) | 2017-09-07 | 2021-10-26 | Her Majesty The Queen In Right Of Canada, As Represented By The Minister Of Industry, Through The Communications Research Centre Canada | Printed reconfigurable electronic circuit |
EP3749124A4 (en) * | 2018-02-13 | 2021-04-28 | Liquid X Printed Metals, Inc. | ELECTRONIC TEXTILES MANUFACTURED USING CONDUCTIVE PARTICLE-FREE INKS |
WO2019216756A1 (en) * | 2018-05-08 | 2019-11-14 | Jabil, Inc. | Stretchable conductive ink package based on dual-system polysiloxane |
EP3597707B1 (de) * | 2018-07-19 | 2021-10-06 | Heraeus Deutschland GmbH & Co. KG | Formulierung zum applizieren auf glas, porzellan, fliesen, metallen und kunststofffolien |
CN109880441A (zh) * | 2019-03-19 | 2019-06-14 | 宁波石墨烯创新中心有限公司 | 导电油墨及其制备方法、薄膜晶体管及其制备方法 |
CN110358367A (zh) * | 2019-05-31 | 2019-10-22 | 南开大学 | 一种用做可拉伸微电子电路导电油墨的弹性导体材料及其合成方法 |
TWI784320B (zh) * | 2019-09-24 | 2022-11-21 | 美商阿爾發金屬化工公司 | 燒結組成物、其製造和使用方法及其用途 |
TWI805862B (zh) * | 2019-10-17 | 2023-06-21 | 德商賀利氏德國有限責任兩合公司 | 施用於玻璃、瓷、瓦、金屬及塑料膜之調配物 |
US11970627B2 (en) | 2020-01-21 | 2024-04-30 | Heraeus Deutschland GmbH & Co. KG | Formulation for application onto glass, porcelain, tiles, metals and plastic foil |
JP7193605B1 (ja) | 2021-10-15 | 2022-12-20 | 田中貴金属工業株式会社 | 金属ペースト |
CN114255945A (zh) * | 2021-11-30 | 2022-03-29 | 福建省长汀卓尔科技股份有限公司 | 一种添加剂及其应用、2-17型钐钴磁体及其制备方法 |
Family Cites Families (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61136978A (ja) | 1984-12-06 | 1986-06-24 | アルプス電気株式会社 | 厚膜回路形成用導電ペ−スト |
JPS63278983A (ja) | 1987-05-09 | 1988-11-16 | Toyota Autom Loom Works Ltd | 金属有機物インク |
US20030148024A1 (en) | 2001-10-05 | 2003-08-07 | Kodas Toivo T. | Low viscosity precursor compositons and methods for the depositon of conductive electronic features |
JP2002040632A (ja) | 2000-07-21 | 2002-02-06 | Showa Denko Kk | レジストインキ組成物 |
US7115218B2 (en) | 2001-06-28 | 2006-10-03 | Parelec, Inc. | Low temperature method and composition for producing electrical conductors |
US7629017B2 (en) | 2001-10-05 | 2009-12-08 | Cabot Corporation | Methods for the deposition of conductive electronic features |
KR100893564B1 (ko) * | 2001-10-05 | 2009-04-17 | 캐보트 코포레이션 | 저점도 전구체 조성물 및 전도성 전자 형상의 증착 방법 |
US20030108664A1 (en) | 2001-10-05 | 2003-06-12 | Kodas Toivo T. | Methods and compositions for the formation of recessed electrical features on a substrate |
IL162005A0 (en) | 2001-12-12 | 2005-11-20 | Du Pont | Copper deposition using copper formate complexes |
DE10216078A1 (de) | 2002-04-11 | 2003-10-23 | Tesa Ag | Weiche flammwidrige Wickelfolie |
US7683107B2 (en) | 2004-02-09 | 2010-03-23 | E.I. Du Pont De Nemours And Company | Ink jet printable thick film compositions and processes |
WO2006093398A1 (en) | 2005-03-04 | 2006-09-08 | Inktec Co., Ltd. | Conductive inks and manufacturing method thereof |
DE602005025037D1 (de) | 2005-09-07 | 2011-01-05 | Exax Inc | Silber-organo-sol-farbstoff zum bilden elektrisch leitfähiger muster |
TWI312799B (en) | 2005-12-30 | 2009-08-01 | Ind Tech Res Inst | Viscosity controllable highly conductive ink composition and method for fabricating a metal conductive pattern |
KR101263003B1 (ko) | 2006-02-13 | 2013-05-09 | 주식회사 이그잭스 | 도전선 패턴 형성을 위한 은 오르가노 졸 잉크 |
JP5205717B2 (ja) | 2006-07-04 | 2013-06-05 | セイコーエプソン株式会社 | ギ酸銅錯体、銅粒子の製造方法および配線基板の製造方法 |
JP5045015B2 (ja) | 2006-07-28 | 2012-10-10 | セイコーエプソン株式会社 | ギ酸銅の製造方法、銅粒子の製造方法および配線基板の製造方法 |
US8240716B2 (en) | 2008-08-07 | 2012-08-14 | TI Group Automotive System, LLC | Quick connector coupling with pull tab verifier |
KR20100031843A (ko) | 2008-09-16 | 2010-03-25 | (주)창성 | 전도성 금속 전극 형성용 잉크조성물 및 그 제조방법 |
WO2010128107A1 (en) * | 2009-05-07 | 2010-11-11 | Neodec B.V. | Process for manufacturing conductive tracks |
US9137902B2 (en) * | 2009-08-14 | 2015-09-15 | Xerox Corporation | Process to form highly conductive feature from silver nanoparticles with reduced processing temperature |
JP5388150B2 (ja) | 2009-08-26 | 2014-01-15 | エルジー・ケム・リミテッド | 導電性金属インク組成物および導電性パターンの形成方法 |
JP5747821B2 (ja) * | 2009-09-16 | 2015-07-15 | 日立化成株式会社 | 金属銅膜及びその製造方法、金属銅パターン及びそれを用いた導体配線、金属銅バンプ、熱伝導路、接合材、並びに液状組成物 |
SG10201500985UA (en) | 2009-11-09 | 2015-04-29 | Univ Carnegie Mellon | Metal ink compositions, conductive patterns, methods, and devices |
KR20110071805A (ko) | 2009-12-21 | 2011-06-29 | 삼성전기주식회사 | 금속 박막 형성용 유기 금속 착물, 이를 포함하는 잉크 및 이를 이용한 금속 박막의 형성방법 |
JP5906027B2 (ja) | 2010-07-30 | 2016-04-20 | トッパン・フォームズ株式会社 | 装飾用又は鏡面用インク組成物、基材及び金属銀層を表面に供えた基材の製造方法 |
WO2012026791A2 (ko) | 2010-08-27 | 2012-03-01 | 주식회사 엘지화학 | 전도성 금속 잉크 조성물 및 전도성 패턴의 형성방법 |
KR20120046457A (ko) | 2010-11-02 | 2012-05-10 | 삼성전자주식회사 | 금속 잉크 조성물, 이를 이용한 전도성 금속막 형성방법 및 이를 이용한 전도성 금속막 |
WO2012135551A1 (en) | 2011-03-29 | 2012-10-04 | Sun Chemical Corporation | High-aspect ratio screen printable thick film paste compositions containing wax thixotropes |
JP6041517B2 (ja) | 2011-04-22 | 2016-12-07 | トッパン・フォームズ株式会社 | 銀インク組成物 |
CN102270514A (zh) * | 2011-05-03 | 2011-12-07 | 华中科技大学 | 一种均相导电浆料 |
KR102020914B1 (ko) * | 2011-09-06 | 2019-09-11 | 헨켈 아이피 앤드 홀딩 게엠베하 | 전도성 물질 및 방법 |
WO2013063320A1 (en) | 2011-10-28 | 2013-05-02 | Liquid X Printed Metals, Inc. | Transparent conductive- and ito-replacement materials and structures |
CN103946419B (zh) | 2011-11-15 | 2016-04-13 | 日油株式会社 | 用于形成铜图形的组合物及铜图形的制备方法 |
WO2013073331A1 (ja) | 2011-11-17 | 2013-05-23 | Jsr株式会社 | 銅膜形成方法、銅膜、回路基板および銅膜形成組成物溶液 |
US9039942B2 (en) * | 2011-12-21 | 2015-05-26 | E I Du Pont De Nemours And Company | Lead-free conductive paste composition and semiconductor devices made therewith |
KR102109390B1 (ko) | 2011-12-23 | 2020-05-12 | 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 | 전도성 은 구조체 제조용 잉크 조성물 |
JP6073613B2 (ja) | 2012-09-18 | 2017-02-01 | Necプラットフォームズ株式会社 | 電子装置、ならびに電子装置の温度制御方法 |
CN102863845A (zh) * | 2012-10-11 | 2013-01-09 | 复旦大学 | 印制电子用银有机导电油墨 |
US9283618B2 (en) | 2013-05-15 | 2016-03-15 | Xerox Corporation | Conductive pastes containing silver carboxylates |
US9198288B2 (en) | 2013-05-15 | 2015-11-24 | Xerox Corporation | Method of making silver carboxylates for conductive ink |
US20140349025A1 (en) * | 2013-05-23 | 2014-11-27 | E I Du Pont De Nemours And Company | Conductive compositions and methods relating thereto |
US9540734B2 (en) | 2013-11-13 | 2017-01-10 | Xerox Corporation | Conductive compositions comprising metal carboxylates |
US9982154B2 (en) | 2014-04-17 | 2018-05-29 | Electroninks Incorporated | Solid ink composition |
US20150298248A1 (en) | 2014-04-17 | 2015-10-22 | Electroninks Incorporated | Bonded structure including a conductive bonding layer and low-temperature method of forming a bonded structure |
US10301497B2 (en) | 2014-04-17 | 2019-05-28 | Electroninks Incorporated | Conductive ink compositions |
KR20170017908A (ko) | 2014-05-30 | 2017-02-15 | 일렉트로닌크스 라이트에이블스, 인코포레이티드 | 롤러볼펜용 전도성 잉크 및 기판 상에 형성된 전도성 트레이스 |
-
2015
- 2015-06-19 KR KR1020177001726A patent/KR102387043B1/ko active IP Right Grant
- 2015-06-19 CN CN201580032170.0A patent/CN106574135B/zh active Active
- 2015-06-19 EP EP19209067.8A patent/EP3689984B8/en active Active
- 2015-06-19 SG SG11201610182SA patent/SG11201610182SA/en unknown
- 2015-06-19 MX MX2016016659A patent/MX2016016659A/es unknown
- 2015-06-19 FI FIEP19209067.8T patent/FI3689984T3/fi active
- 2015-06-19 WO PCT/CA2015/050568 patent/WO2015192248A1/en active Application Filing
- 2015-06-19 CA CA2950628A patent/CA2950628C/en active Active
- 2015-06-19 JP JP2016573028A patent/JP6541696B2/ja active Active
- 2015-06-19 EP EP15810065.1A patent/EP3158015B1/en active Active
- 2015-06-19 US US15/319,910 patent/US10883011B2/en active Active
-
2016
- 2016-12-14 MX MX2021007763A patent/MX2021007763A/es unknown
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Also Published As
Publication number | Publication date |
---|---|
EP3689984A1 (en) | 2020-08-05 |
MX2021007763A (es) | 2021-08-05 |
WO2015192248A1 (en) | 2015-12-23 |
US11525066B2 (en) | 2022-12-13 |
KR102387043B1 (ko) | 2022-04-14 |
CA2950628A1 (en) | 2015-12-23 |
US20210079248A1 (en) | 2021-03-18 |
US20170130084A1 (en) | 2017-05-11 |
EP3158015A4 (en) | 2018-02-07 |
SG11201610182SA (en) | 2017-01-27 |
EP3158015A1 (en) | 2017-04-26 |
US10883011B2 (en) | 2021-01-05 |
JP6541696B2 (ja) | 2019-07-10 |
CN106574135B (zh) | 2021-04-06 |
EP3689984B1 (en) | 2023-06-07 |
KR20170023994A (ko) | 2017-03-06 |
JP2017524761A (ja) | 2017-08-31 |
FI3689984T3 (fi) | 2023-07-20 |
CN106574135A (zh) | 2017-04-19 |
EP3158015B1 (en) | 2019-12-04 |
EP3689984B8 (en) | 2023-07-12 |
CA2950628C (en) | 2022-11-08 |
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