MX2020005718A - Métodos para adhesivos conductores a base de grafeno y sus aplicaciones. - Google Patents

Métodos para adhesivos conductores a base de grafeno y sus aplicaciones.

Info

Publication number
MX2020005718A
MX2020005718A MX2020005718A MX2020005718A MX2020005718A MX 2020005718 A MX2020005718 A MX 2020005718A MX 2020005718 A MX2020005718 A MX 2020005718A MX 2020005718 A MX2020005718 A MX 2020005718A MX 2020005718 A MX2020005718 A MX 2020005718A
Authority
MX
Mexico
Prior art keywords
graphene
methods
conductive adhesives
conductive
applications
Prior art date
Application number
MX2020005718A
Other languages
English (en)
Inventor
Richard B Kaner
Maher F El-Kady
Nahla Mohamed
Jack Kavanaugh
Original Assignee
Univ California
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ California filed Critical Univ California
Publication of MX2020005718A publication Critical patent/MX2020005718A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/32—Inkjet printing inks characterised by colouring agents
    • C09D11/322—Pigment inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

La presente divulgación se refiere a adhesivos y tintas conductoras. Los adhesivos conductores descritos incluyen colas y epoxis, a base de grafeno y compuestos de grafeno/carbono y los métodos de fabricación de los mismos, tales adhesivos conductores que exhiben una excelente conductividad, propiedades térmicas, durabilidad, bajas temperaturas de curado, flexibilidad mecánica y un impacto ambiental reducido. Además, los adhesivos con aditivos conductores tales como nanocables de plata y los métodos de producción de los mismos se describen en este documento.
MX2020005718A 2017-12-01 2018-11-29 Métodos para adhesivos conductores a base de grafeno y sus aplicaciones. MX2020005718A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762593506P 2017-12-01 2017-12-01
US201862680615P 2018-06-05 2018-06-05
PCT/US2018/062960 WO2019108732A1 (en) 2017-12-01 2018-11-29 Methods for conductive adhesives based on graphene and applications thereof

Publications (1)

Publication Number Publication Date
MX2020005718A true MX2020005718A (es) 2020-12-09

Family

ID=66658865

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2020005718A MX2020005718A (es) 2017-12-01 2018-11-29 Métodos para adhesivos conductores a base de grafeno y sus aplicaciones.

Country Status (10)

Country Link
US (2) US10982119B2 (es)
EP (1) EP3717558A4 (es)
JP (1) JP2021504907A (es)
KR (1) KR20200105828A (es)
CN (1) CN111655775A (es)
AU (1) AU2018374215A1 (es)
CA (1) CA3083254C (es)
MX (1) MX2020005718A (es)
TW (1) TWI791697B (es)
WO (1) WO2019108732A1 (es)

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CN110364628A (zh) * 2019-07-15 2019-10-22 上海大学 一种混合维度柔性透明电极及其制备方法和应用
CN110655755A (zh) * 2019-10-09 2020-01-07 荆楚理工学院 一种银纳米粒子负载的石墨烯基环氧树脂复合材料的制备方法
EP3876251A1 (en) * 2020-03-02 2021-09-08 Holy Stone Enterprise Co., Ltd. Leadless stack comprising ceramic capacitors
US11371319B2 (en) * 2020-03-12 2022-06-28 Saudi Arabian Oil Company Robotic pigging tool
CN111826081A (zh) * 2020-08-06 2020-10-27 苏州世沃电子科技有限公司 一种高性能石墨烯导电防腐涂料及其制备方法
CN113004829A (zh) * 2021-03-05 2021-06-22 常州烯奇新材料有限公司 一种石墨烯基半导体芯片封装用电子胶粘剂及制备方法
CN113274499B (zh) * 2021-06-25 2022-06-24 中国药科大学 一种仿生型铋纳米花及其制备方法和应用
CN116288052A (zh) * 2021-12-10 2023-06-23 东莞市逸昊金属材料科技有限公司 精密制件用粉末冶金材料、粉末冶金加工方法及制件
CN114574041A (zh) * 2022-04-15 2022-06-03 云南巨晶新材料有限公司 一种可喷印纳米银石墨烯导电墨水
CN116239973B (zh) * 2023-03-02 2024-04-16 鸿基创能科技(广州)有限公司 一种用于膜电极的粘接浆料、单边框膜电极及其制备方法

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Also Published As

Publication number Publication date
US20210253915A1 (en) 2021-08-19
EP3717558A4 (en) 2021-11-17
AU2018374215A1 (en) 2020-06-18
US10982119B2 (en) 2021-04-20
CA3083254C (en) 2023-10-03
TWI791697B (zh) 2023-02-11
KR20200105828A (ko) 2020-09-09
TW201925402A (zh) 2019-07-01
CA3083254A1 (en) 2019-06-06
US20190169472A1 (en) 2019-06-06
CN111655775A (zh) 2020-09-11
EP3717558A1 (en) 2020-10-07
WO2019108732A1 (en) 2019-06-06
JP2021504907A (ja) 2021-02-15

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