SG10201500985UA - Metal ink compositions, conductive patterns, methods, and devices - Google Patents

Metal ink compositions, conductive patterns, methods, and devices

Info

Publication number
SG10201500985UA
SG10201500985UA SG10201500985UA SG10201500985UA SG10201500985UA SG 10201500985U A SG10201500985U A SG 10201500985UA SG 10201500985U A SG10201500985U A SG 10201500985UA SG 10201500985U A SG10201500985U A SG 10201500985UA SG 10201500985U A SG10201500985U A SG 10201500985UA
Authority
SG
Singapore
Prior art keywords
methods
devices
conductive patterns
ink compositions
metal ink
Prior art date
Application number
SG10201500985UA
Inventor
Richard D Mccullough
John A Belot
Anna Javier
Rebecca Potash
Original Assignee
Univ Carnegie Mellon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Carnegie Mellon filed Critical Univ Carnegie Mellon
Publication of SG10201500985UA publication Critical patent/SG10201500985UA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/06—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic System
    • C07F1/005—Compounds containing elements of Groups 1 or 11 of the Periodic System without C-Metal linkages
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic System
    • C07F9/02—Phosphorus compounds
    • C07F9/28—Phosphorus compounds with one or more P—C bonds
    • C07F9/50—Organo-phosphines
    • C07F9/5045—Complexes or chelates of phosphines with metallic compounds or metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/32—Inkjet printing inks characterised by colouring agents
    • C09D11/322—Pigment inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
SG10201500985UA 2009-11-09 2010-11-08 Metal ink compositions, conductive patterns, methods, and devices SG10201500985UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25961409P 2009-11-09 2009-11-09

Publications (1)

Publication Number Publication Date
SG10201500985UA true SG10201500985UA (en) 2015-04-29

Family

ID=43828197

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201500985UA SG10201500985UA (en) 2009-11-09 2010-11-08 Metal ink compositions, conductive patterns, methods, and devices

Country Status (11)

Country Link
US (1) US20110111138A1 (en)
EP (1) EP2499277B1 (en)
JP (1) JP5977673B2 (en)
KR (1) KR101795088B1 (en)
CN (1) CN102822385B (en)
BR (1) BR112012010962A2 (en)
CA (1) CA2780291A1 (en)
HK (1) HK1173475A1 (en)
SG (1) SG10201500985UA (en)
TW (1) TWI550042B (en)
WO (1) WO2011057218A2 (en)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103609204B (en) 2011-05-04 2017-09-12 液体X印刷金属有限公司 Metal alloy derived from molecular ink
WO2013063320A1 (en) 2011-10-28 2013-05-02 Liquid X Printed Metals, Inc. Transparent conductive- and ito-replacement materials and structures
CN103183978B (en) * 2011-12-27 2016-03-30 比亚迪股份有限公司 Goods of ink composite and application and surface selective metallization and preparation method thereof
KR101376913B1 (en) * 2011-12-27 2014-03-20 삼성전기주식회사 Copper organic metal, manufacturing mehtod for copper organic metal and copper paste
US20130236656A1 (en) * 2012-02-27 2013-09-12 Liquid X Printed Metals, Inc. Self-reduced metal complex inks soluble in polar protic solvents and improved curing methods
US10590295B2 (en) 2012-02-29 2020-03-17 Singapore Asahi Chemical & Solder Ind. Pte. Ltd Inks containing metal precursors nanoparticles
KR102009320B1 (en) * 2012-08-09 2019-08-12 엘지디스플레이 주식회사 Nano particle and manufacturing of the same
US9758688B2 (en) 2012-09-21 2017-09-12 Sumitomo Chemical Company, Limited Composition for forming conductive film
KR101288106B1 (en) * 2012-12-20 2013-07-26 (주)피이솔브 Metal precursors and their inks
KR101547622B1 (en) * 2012-12-26 2015-08-27 주식회사 두산 Metal ink composition having low viscosity and printed circuit board using the same
KR101425855B1 (en) * 2013-02-21 2014-08-14 서울대학교산학협력단 Electroconductive ink composite including metal-organic precursor and method for Forming the metal line using the same
JP2014196384A (en) * 2013-03-29 2014-10-16 富士フイルム株式会社 Conductive film-forming composition and method for producing conductive film using the same
WO2014192266A1 (en) * 2013-05-31 2014-12-04 日立化成株式会社 Etching composition
EP3158015B1 (en) 2014-06-19 2019-12-04 National Research Council of Canada Molecular inks
US9803098B2 (en) 2014-07-30 2017-10-31 Pesolve Co., Ltd. Conductive ink
US9683123B2 (en) 2014-08-05 2017-06-20 Pesolve Co., Ltd. Silver ink
US9387460B2 (en) 2014-12-16 2016-07-12 Eastman Kodak Company Metal catalytic composition with silver-oxime complex
US9624582B2 (en) 2014-12-16 2017-04-18 Eastman Kodak Company Non-aqueous metal catalytic composition with oxyazinium photoreducing agent
US9377688B1 (en) 2014-12-16 2016-06-28 Eastman Kodak Company Metal catalytic composition with silver N-heterocycle complex
US9592493B2 (en) 2014-12-16 2017-03-14 Eastman Kodak Company Forming silver catalytic sites from silver phosphite carboxylates
US9586200B2 (en) 2014-12-16 2017-03-07 Eastman Kodak Company Forming catalytic sites from reducible silver complexes
US9587315B2 (en) 2014-12-16 2017-03-07 Eastman Kodak Company Forming silver catalytic sites from reducible silver-oximes
US9586201B2 (en) 2014-12-16 2017-03-07 Eastman Kodak Company Forming catalytic sites from reducible silver-heterocyclic complexes
US9375704B1 (en) 2014-12-16 2016-06-28 Eastman Kodak Company Metal catalytic composition with silver carboxylate-trialkyl(triaryl)phosphite complex
JP6835427B2 (en) * 2015-07-08 2021-02-24 株式会社シマノ Surface decoration structure of fiber reinforced plastic parts
DE102015115549A1 (en) * 2015-09-15 2017-03-16 Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh Conductive nanocomposites
WO2017134769A1 (en) * 2016-02-03 2017-08-10 学校法人工学院大学 Metal film-forming composition and metal film-forming method
EP3416771A4 (en) 2016-02-16 2019-10-16 Arizona Board of Regents on behalf of Arizona State University Fabricating metal or ceramic components using 3d printing with dissolvable supports of a different material
WO2018013178A1 (en) 2016-07-15 2018-01-18 Arizona Board Of Regents On Behalf Of Arizona State University Dissolving metal supports in 3d printed metals and ceramics using sensitization
TW201842088A (en) 2017-02-08 2018-12-01 加拿大國家研究委員會 Printable molecular ink
TW201842087A (en) 2017-02-08 2018-12-01 加拿大國家研究委員會 Molecular ink with improved thermal stability
TW201842085A (en) 2017-02-08 2018-12-01 加拿大國家研究委員會 Silver molecular ink with low viscosity and low processing temperature
WO2018213640A1 (en) * 2017-05-17 2018-11-22 Mariana Bertoni Systems and methods for controlling the morphology and porosity of printed reactive inks for high precision printing
TW201930490A (en) * 2017-08-03 2019-08-01 美商電子墨水股份有限公司 Conductive ink compositions comprising gold and methods for making the same
US10633550B2 (en) * 2017-08-31 2020-04-28 Xerox Corporation Molecular organic reactive inks for conductive silver printing
CN112334029A (en) * 2018-02-13 2021-02-05 液体X印刷金属有限公司 Electronic textiles manufactured using particle-free conductive inks
US11724532B2 (en) * 2019-05-20 2023-08-15 Liquid X Printed Metals, Inc. Particle-free adhesive gold inks
CN110444793B (en) * 2019-08-16 2021-02-05 上海元城汽车技术有限公司 Durable proton exchange membrane, preparation method and application thereof
US20230064831A1 (en) * 2020-01-30 2023-03-02 Liquid X Printed Metals, Inc. Force sensor controlled conductive heating elements

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3702259A (en) * 1970-12-02 1972-11-07 Shell Oil Co Chemical production of metallic silver deposits
GB1517608A (en) * 1975-12-29 1978-07-12 Texaco Development Corp Silver catalyst for ethylene epoxidation
US4097414A (en) * 1976-08-30 1978-06-27 Texaco Development Corp. Modified ethylene oxide catalyst and a process for its preparation
US4758588A (en) * 1983-06-20 1988-07-19 Research Corporation Technologies Diaminocyclohexane platinum complexes
US5041640A (en) * 1990-09-20 1991-08-20 Warner-Lambert Company Process for mono-, di-, trisubstituted acetic acids
US5378508A (en) * 1992-04-01 1995-01-03 Akzo Nobel N.V. Laser direct writing
US5534312A (en) * 1994-11-14 1996-07-09 Simon Fraser University Method for directly depositing metal containing patterned films
SE513959C2 (en) * 1994-12-30 2000-12-04 Sandvik Ab Method of coating cemented carbide tool cutters
US5882722A (en) 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
JPH1072673A (en) * 1996-04-30 1998-03-17 Nippon Terupen Kagaku Kk Production of metallic paste and metallic coating
US6010969A (en) * 1996-10-02 2000-01-04 Micron Technology, Inc. Method of depositing films on semiconductor devices by using carboxylate complexes
US5846615A (en) * 1997-02-28 1998-12-08 The Whitaker Corporation Direct deposition of a gold layer
US6511936B1 (en) * 1998-02-12 2003-01-28 University Of Delaware Catalyst compounds with β-diminate anionic ligands and processes for polymerizing olefins
AU1602099A (en) * 1998-08-21 2000-03-14 Sri International Printing of electronic circuits and components
US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
CN1360643A (en) * 1999-07-14 2002-07-24 大阪市 Spectacle frame surface treatment method
DE60043359D1 (en) * 2000-01-21 2009-12-31 Midwest Research Inst METHOD FOR PRODUCING THIN FILMS BY DECOMPOSITION OF METAL CHELATES IN CONNECTION WITH METAL PARTS
US20020013487A1 (en) * 2000-04-03 2002-01-31 Norman John Anthony Thomas Volatile precursors for deposition of metals and metal-containing films
KR100807947B1 (en) * 2001-01-30 2008-02-28 삼성전자주식회사 Method for preparing Asymmetric betaketoiminate ligand compound
CN1247297C (en) * 2001-04-30 2006-03-29 学校法人浦项工科大学校 Colloid solution of metal nanoparticles, metal-polymer nanocompositions and method for preparation thereof
KR20030022911A (en) * 2001-09-11 2003-03-19 삼성전자주식회사 Organic metal precursors for metal patterning and metal patterning method using the same
US20030216246A1 (en) * 2001-09-21 2003-11-20 Cook Jessica A Transition metal complexes containing sulfur ligands, and polylefin production processes using them
US7629017B2 (en) * 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
US6951666B2 (en) 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
US7524528B2 (en) * 2001-10-05 2009-04-28 Cabot Corporation Precursor compositions and methods for the deposition of passive electrical components on a substrate
US7553512B2 (en) * 2001-11-02 2009-06-30 Cabot Corporation Method for fabricating an inorganic resistor
KR20030057133A (en) * 2001-12-28 2003-07-04 삼성전자주식회사 Organic Metal Precursor for Forming Metal Pattern and Method for Forming Metal Pattern Using the Same
KR100772790B1 (en) * 2002-04-30 2007-11-01 삼성전자주식회사 Organometallic Precursors for Forming Metal Pattern and Method for Forming Metal Pattern Using The Same
KR100765684B1 (en) 2002-07-03 2007-10-11 삼성전자주식회사 Organometallic Precursors for Forming Metal Alloy Pattern and Method for Forming Metal Alloy Pattern Using The Same
JP4069809B2 (en) * 2003-06-12 2008-04-02 富士ゼロックス株式会社 Ink set for inkjet recording and inkjet recording method
US20050081907A1 (en) * 2003-10-20 2005-04-21 Lewis Larry N. Electro-active device having metal-containing layer
US6991894B2 (en) 2003-11-03 2006-01-31 Eastman Kodak Company Thermally developable imaging materials with barrier layer
US20050129843A1 (en) * 2003-12-11 2005-06-16 Xerox Corporation Nanoparticle deposition process
US7445884B2 (en) * 2004-06-09 2008-11-04 Konica Minolta Medical & Graphic, Inc. Photothermographic material, development method and thermal development device thereof
US7550179B2 (en) * 2004-08-30 2009-06-23 E.I Du Pont De Nemours And Company Method of copper deposition from a supercritical fluid solution containing copper (I) complexes with monoanionic bidentate and neutral monodentate ligands
US7270694B2 (en) 2004-10-05 2007-09-18 Xerox Corporation Stabilized silver nanoparticles and their use
US20060130700A1 (en) 2004-12-16 2006-06-22 Reinartz Nicole M Silver-containing inkjet ink
US7153635B1 (en) 2005-09-23 2006-12-26 Eastman Kodak Company Thermally developable materials processable at lower temperatures
KR101159073B1 (en) * 2005-09-23 2012-06-25 삼성전자주식회사 New metal-organic precursor material and fabrication method of metal thin film using the same
CN101479065B (en) * 2006-04-12 2012-07-18 美国纳麦斯科技公司 Nanoparticles, methods of making, and applications using same
US20080003364A1 (en) 2006-06-28 2008-01-03 Ginley David S Metal Inks
US7491646B2 (en) 2006-07-20 2009-02-17 Xerox Corporation Electrically conductive feature fabrication process
US8143431B2 (en) * 2007-06-05 2012-03-27 Air Products And Chemicals, Inc. Low temperature thermal conductive inks
US7524621B2 (en) 2007-09-21 2009-04-28 Carestream Health, Inc. Method of preparing silver carboxylate soaps

Also Published As

Publication number Publication date
WO2011057218A2 (en) 2011-05-12
KR101795088B1 (en) 2017-11-07
BR112012010962A2 (en) 2020-09-08
TW201124492A (en) 2011-07-16
WO2011057218A3 (en) 2012-04-19
CA2780291A1 (en) 2011-05-12
TWI550042B (en) 2016-09-21
EP2499277A2 (en) 2012-09-19
US20110111138A1 (en) 2011-05-12
JP5977673B2 (en) 2016-08-24
CN102822385A (en) 2012-12-12
EP2499277B1 (en) 2017-09-27
KR20120096499A (en) 2012-08-30
CN102822385B (en) 2016-09-07
JP2013510241A (en) 2013-03-21
HK1173475A1 (en) 2013-05-16

Similar Documents

Publication Publication Date Title
HK1173475A1 (en) Metal ink compositions, conductive patterns, methods, and devices
SG10201709677PA (en) Organic electronic devices, compositions, and methods
EP2414109A4 (en) Metallic ink
IL209943A0 (en) Conductive inks and pastes
IL206989A0 (en) Conductive inks
EP2513233A4 (en) Aqueous-triggered color-appearing inks
EP2301043A4 (en) Metallic pastes and inks
EP2488593A4 (en) Electronic inks
EP2395541A4 (en) Conductive pattern and manufacturing method thereof
GB201114417D0 (en) Nanorough alloy substrate
EP2435522A4 (en) Magnetisable ink
IL217287A0 (en) Metallic nanoparticles, preparation and uses therefor
EP2488592A4 (en) Electronic inks
EP2278748A4 (en) Interface circuit
EP2315813A4 (en) Metal nanoparticle ink compositions
GB0921707D0 (en) Electronic devices
HK1153851A1 (en) Antenna circuit
EP2381538A4 (en) Electroconductive component
EP2461432A4 (en) Chain terminal
EP2511350A4 (en) Ink
EP2472668A4 (en) Method for realizing terminal antenna, terminal antenna and terminal thereof
EP2505616A4 (en) Conductive inks obtained by combining aqcs and metal nanoparticles
EP2383313A4 (en) Marking ink
PL2163998T3 (en) Cooperation circuit
EP2460788A4 (en) Metal complex, composition comprising same and light-emitting element using same