SG11201600923YA - Substrate structure and method of manufacturing same - Google Patents

Substrate structure and method of manufacturing same

Info

Publication number
SG11201600923YA
SG11201600923YA SG11201600923YA SG11201600923YA SG11201600923YA SG 11201600923Y A SG11201600923Y A SG 11201600923YA SG 11201600923Y A SG11201600923Y A SG 11201600923YA SG 11201600923Y A SG11201600923Y A SG 11201600923YA SG 11201600923Y A SG11201600923Y A SG 11201600923YA
Authority
SG
Singapore
Prior art keywords
substrate structure
manufacturing same
manufacturing
same
substrate
Prior art date
Application number
SG11201600923YA
Other languages
English (en)
Inventor
Myung Mo Sung
Kyu Seok Han
Original Assignee
Iucf Hyu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iucf Hyu filed Critical Iucf Hyu
Publication of SG11201600923YA publication Critical patent/SG11201600923YA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • H01L23/3192Multilayer coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F3/00Compounds containing elements of Groups 2 or 12 of the Periodic Table
    • C07F3/06Zinc compounds
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F5/00Compounds containing elements of Groups 3 or 13 of the Periodic Table
    • C07F5/06Aluminium compounds
    • C07F5/061Aluminium compounds with C-aluminium linkage
    • C07F5/062Al linked exclusively to C
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/42Silicides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523Pulsed gas flow or change of composition over time
    • C23C16/45525Atomic layer deposition [ALD]
    • C23C16/45527Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
    • C23C16/45529Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations specially adapted for making a layer stack of alternating different compositions or gradient compositions
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523Pulsed gas flow or change of composition over time
    • C23C16/45525Atomic layer deposition [ALD]
    • C23C16/45553Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133305Flexible substrates, e.g. plastics, organic film
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0203Containers; Encapsulations, e.g. encapsulation of photodiodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10Organic polymers or oligomers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60Organic compounds having low molecular weight
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133302Rigid substrates, e.g. inorganic substrates
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133345Insulating layers
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/50Protective arrangements
    • G02F2201/501Blocking layers, e.g. against migration of ions
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00Materials and properties
    • G02F2202/02Materials and properties organic material
    • G02F2202/022Materials and properties organic material polymeric
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/10Transparent electrodes, e.g. using graphene
    • H10K2102/101Transparent electrodes, e.g. using graphene comprising transparent conductive oxides [TCO]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/10Transparent electrodes, e.g. using graphene
    • H10K2102/101Transparent electrodes, e.g. using graphene comprising transparent conductive oxides [TCO]
    • H10K2102/103Transparent electrodes, e.g. using graphene comprising transparent conductive oxides [TCO] comprising indium oxides, e.g. ITO
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/351Thickness
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
  • Photovoltaic Devices (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Oxygen, Ozone, And Oxides In General (AREA)
  • Formation Of Insulating Films (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Liquid Crystal (AREA)
SG11201600923YA 2013-08-30 2013-11-04 Substrate structure and method of manufacturing same SG11201600923YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020130104463 2013-08-30
PCT/KR2013/009910 WO2015030298A1 (ko) 2013-08-30 2013-11-04 기판 구조물 및 이의 제조 방법

Publications (1)

Publication Number Publication Date
SG11201600923YA true SG11201600923YA (en) 2016-03-30

Family

ID=52586830

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201600921XA SG11201600921XA (en) 2013-08-30 2013-11-04 Hybrid organic/inorganic thin films and method of manufacturing same
SG11201600923YA SG11201600923YA (en) 2013-08-30 2013-11-04 Substrate structure and method of manufacturing same

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG11201600921XA SG11201600921XA (en) 2013-08-30 2013-11-04 Hybrid organic/inorganic thin films and method of manufacturing same

Country Status (12)

Country Link
US (2) US10418300B2 (ja)
EP (2) EP3040443B1 (ja)
JP (2) JP6286557B2 (ja)
KR (2) KR20150026746A (ja)
CN (2) CN105745353B (ja)
BR (2) BR112016004389B1 (ja)
CA (2) CA2922615A1 (ja)
MX (2) MX2016002432A (ja)
RU (2) RU2672962C2 (ja)
SG (2) SG11201600921XA (ja)
TW (2) TWI606111B (ja)
WO (2) WO2015030297A1 (ja)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2672962C2 (ru) * 2013-08-30 2018-11-21 Июкф-Хю (Индастри-Юниверсити-Кооперейшн Фаундейшн Ханян Юниверсити) Структура подложки и способ ее изготовления
CN105431893B (zh) * 2013-09-30 2018-01-26 株式会社Lg化学 用于有机电子器件的基板及其制造方法
KR102439664B1 (ko) * 2014-06-12 2022-09-02 바스프 코팅스 게엠베하 가요성 유기물-무기물 라미네이트의 제조 방법
EP3274487A1 (en) * 2015-03-25 2018-01-31 BASF Coatings GmbH Process for producing flexible organic-inorganic laminates
US20190036077A1 (en) * 2016-02-18 2019-01-31 Sharp Kabushiki Kaisha Method for producing organic el display device, and organic el display device
KR102586045B1 (ko) * 2016-07-12 2023-10-10 삼성디스플레이 주식회사 디스플레이 장치 및 이의 제조 방법
US20190040503A1 (en) * 2017-08-03 2019-02-07 Hrl Laboratories, Llc Feedstocks for additive manufacturing, and methods of using the same
WO2019010696A1 (en) * 2017-07-14 2019-01-17 General Electric Company METHOD FOR DEPOSITION LAYERED BY GAS PHASE MOLECULAR LAYER ON A MICROPOROUS SUPPORT
US10673046B2 (en) * 2018-04-13 2020-06-02 GM Global Technology Operations LLC Separator for lithium metal based batteries
US20210269917A1 (en) * 2018-07-05 2021-09-02 Basf Coatings Gmbh Transparent conductive film
KR102224346B1 (ko) * 2019-07-11 2021-03-05 한양대학교 산학협력단 유무기 하이브리드층, 이 층을 구비하는 유무기 적층체, 및 이 적층체를 가스 배리어로 구비하는 유기전자소자
CN110508155B (zh) * 2019-08-21 2021-09-03 南京大学 一种锌基无机-有机杂化纳米多孔分离膜的制备方法
CN110635044B (zh) * 2019-11-04 2021-07-06 吉林大学 一种有机金属卤化物钙钛矿太阳能电池的复合封装薄膜及其制备方法
CN112410763A (zh) * 2020-10-28 2021-02-26 武汉华星光电半导体显示技术有限公司 一种薄膜封装层,其制备方法及可折叠显示装置
TWI824213B (zh) * 2020-12-19 2023-12-01 逢甲大學 可撓式透明導電複合膜及其製造方法
KR102558965B1 (ko) * 2021-03-18 2023-07-25 한국과학기술연구원 신축성 표시 장치 및 신축성 표시 장치 제조 방법
WO2022233992A1 (en) 2021-05-06 2022-11-10 Basf Coatings Gmbh Multilayer barrier film, its manufacture and use in photovoltaic applications
WO2023018308A1 (ko) * 2021-08-12 2023-02-16 한양대학교 산학협력단 분자선 구조를 갖는 다층 분자막 포토레지스트 및 이의 제조방법
CN115124727B (zh) * 2022-07-08 2023-07-14 中国科学院山西煤炭化学研究所 一种mof薄膜的制备方法
CN117845191A (zh) * 2022-09-30 2024-04-09 华为技术有限公司 复合薄膜及其制备方法和应用

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05220106A (ja) 1992-02-14 1993-08-31 Olympus Optical Co Ltd 内視鏡撮影システム
RU2118402C1 (ru) * 1994-05-17 1998-08-27 Виктор Васильевич Дроботенко Способ получения металлооксидных покрытий (его варианты)
JP2002053669A (ja) 2000-06-01 2002-02-19 Osaka Organic Chem Ind Ltd 多次元有機・無機複合体化合物およびその製造方法
US6866949B2 (en) 2002-03-08 2005-03-15 Dai Nippon Printing Co., Ltd. Substrate film, gas barrier film, and display using the same
TW548853B (en) * 2002-09-13 2003-08-21 Ind Tech Res Inst Method of manufacturing flexible TFT display
US7285440B2 (en) * 2002-11-25 2007-10-23 International Business Machines Corporation Organic underlayers that improve the performance of organic semiconductors
JP2004231784A (ja) * 2003-01-30 2004-08-19 Konica Minolta Holdings Inc 有機−無機ポリマーハイブリッドフィルム、その製造方法、該フィルムを用いたディスプレイ及びタッチパネル
US7229703B2 (en) 2003-03-31 2007-06-12 Dai Nippon Printing Co. Ltd. Gas barrier substrate
CN1791510B (zh) 2003-05-16 2010-10-13 凸版印刷株式会社 透明的气体屏蔽性层合薄膜、电致发光元件、电致发光显示装置以及电泳显示板
WO2005056354A2 (en) * 2003-12-03 2005-06-23 Gedeon Anthony A Method of resisting contaminant build up and oxidation of vehicle surfaces and other surfaces
JP2005289885A (ja) 2004-03-31 2005-10-20 Osaka Organic Chem Ind Ltd 多次元有機・無機複合体化合物、複合焼成体およびこれらの製造方法
JP2005297498A (ja) 2004-04-16 2005-10-27 Dainippon Printing Co Ltd 可撓性基板およびそれを用いた有機デバイス
US7378157B2 (en) 2004-06-28 2008-05-27 Dai Nippon Printing Co., Ltd. Gas barrier film, and display substrate and display using the same
KR101001441B1 (ko) * 2004-08-17 2010-12-14 삼성전자주식회사 유무기 금속 하이브리드 물질 및 이를 포함하는 유기절연체 조성물
NO20045674D0 (no) 2004-12-28 2004-12-28 Uni I Oslo Thin films prepared with gas phase deposition technique
JP2007185937A (ja) 2005-12-12 2007-07-26 Fujifilm Corp 有機−無機ハイブリッド材料、ガスバリヤーフィルム及びその製造方法
KR20070084683A (ko) * 2006-02-21 2007-08-27 국민대학교산학협력단 분자층 증착법
JP2007273094A (ja) 2006-03-30 2007-10-18 Toppan Printing Co Ltd 有機エレクトロルミネッセンス素子およびその製造方法
DE102006016280A1 (de) * 2006-04-01 2007-10-04 Pvflex Solar Gmbh Glasloser Solarstrom-Modul mit flexiblen Dünnschicht-Zellen und Verfahren zu seiner Herstellung
JP2008087163A (ja) 2006-09-29 2008-04-17 Fujifilm Corp ガスバリア性積層フィルム、およびそれを用いた画像表示素子
WO2008069894A2 (en) 2006-11-13 2008-06-12 The Regents Of The University Of Colorado, A Body Corporate Molecular layer deposition process for making organic or organic-inorganic polymers
JP2008218632A (ja) * 2007-03-02 2008-09-18 Fujifilm Corp 電子デバイス
US8197942B2 (en) 2007-03-23 2012-06-12 Dai Nippon Printing Co., Ltd. Gas barrier sheet
JP5127277B2 (ja) * 2007-04-05 2013-01-23 新日鉄住金マテリアルズ株式会社 表面平坦性絶縁膜形成用塗布溶液、表面平坦性絶縁膜被覆基材、及び表面平坦性絶縁膜被覆基材の製造方法
JP5198131B2 (ja) 2007-05-14 2013-05-15 富士フイルム株式会社 バリアフィルムおよび素子
JP5510766B2 (ja) 2007-06-20 2014-06-04 大日本印刷株式会社 イオンプレーティング用蒸発源材料の原料粉末、イオンプレーティング用蒸発源材料及びその製造方法、ガスバリア性シート及びその製造方法
JP5220106B2 (ja) * 2007-06-22 2013-06-26 ザ・リージエンツ・オブ・ザ・ユニバーシティ・オブ・コロラド 原子層堆積法及び分子層堆積法を用いて製造された有機電子デバイス用の保護被膜
US20090021797A1 (en) * 2007-07-17 2009-01-22 Luciano Joseph W All-In-One Device With Integrated Monitor
JP2010006039A (ja) 2007-09-05 2010-01-14 Fujifilm Corp ガスバリアフィルムおよびガスバリアフィルムを用いて表示素子を封止する方法。
US8067085B2 (en) 2007-09-14 2011-11-29 Fujifilm Corporation Gas barrier film, and display device comprising the same
US7858144B2 (en) * 2007-09-26 2010-12-28 Eastman Kodak Company Process for depositing organic materials
RU2462793C2 (ru) * 2007-12-28 2012-09-27 Юниверсите Де Ля Медитерране Экс-Марсель Ii Гибридные нанокомпозиционные материалы
US8776238B2 (en) * 2008-07-16 2014-07-08 International Business Machines Corporation Verifying certificate use
US8241749B2 (en) 2008-09-11 2012-08-14 Fujifilm Corporation Barrier laminate, gas barrier film, and device using the same
JP2011046060A (ja) 2009-08-26 2011-03-10 Fujifilm Corp ガスバリアフィルムおよびガスバリアフィルムの製造方法
JP4821925B2 (ja) 2009-11-27 2011-11-24 大日本印刷株式会社 ガスバリア性フィルム、装置、及びガスバリア性フィルムの製造方法
WO2011115147A1 (ja) 2010-03-17 2011-09-22 コニカミノルタホールディングス株式会社 有機電子デバイスおよびその製造方法
US20130017400A1 (en) 2010-03-25 2013-01-17 Toppan Printing Co., Ltd. Gas barrier laminate and packaging
JP5598080B2 (ja) 2010-05-17 2014-10-01 大日本印刷株式会社 ガスバリア性シートの製造方法
JP5913809B2 (ja) 2011-01-05 2016-04-27 リンテック株式会社 透明電極基板、その製造方法、該透明電極基板を有する電子デバイス及び太陽電池
JP5752438B2 (ja) 2011-02-23 2015-07-22 グンゼ株式会社 ガスバリアフィルム
WO2012157960A2 (ko) * 2011-05-16 2012-11-22 주식회사 엘지화학 다층 플라스틱 기판 및 이의 제조방법
KR101432737B1 (ko) 2011-07-28 2014-08-22 한양대학교 산학협력단 유기-무기 혼성 박막 및 이의 제조 방법
RU2672962C2 (ru) * 2013-08-30 2018-11-21 Июкф-Хю (Индастри-Юниверсити-Кооперейшн Фаундейшн Ханян Юниверсити) Структура подложки и способ ее изготовления

Also Published As

Publication number Publication date
CN105745353B (zh) 2019-07-05
EP3040442A1 (en) 2016-07-06
TWI606111B (zh) 2017-11-21
RU2672962C2 (ru) 2018-11-21
TW201508083A (zh) 2015-03-01
BR112016004389B1 (pt) 2021-11-23
EP3040443A1 (en) 2016-07-06
US20160215394A1 (en) 2016-07-28
CN105723011B (zh) 2019-05-10
RU2016111694A (ru) 2017-10-05
KR20150026746A (ko) 2015-03-11
CN105745353A (zh) 2016-07-06
EP3040442B1 (en) 2024-02-14
JP6654753B2 (ja) 2020-02-26
MX2016002432A (es) 2016-12-07
EP3040443B1 (en) 2024-03-06
EP3040443A4 (en) 2017-04-12
KR102289064B1 (ko) 2021-08-12
BR112016004389A2 (pt) 2017-09-12
SG11201600921XA (en) 2016-03-30
JP6286557B2 (ja) 2018-02-28
WO2015030298A1 (ko) 2015-03-05
JP2016537510A (ja) 2016-12-01
TW201508047A (zh) 2015-03-01
CN105723011A (zh) 2016-06-29
JP2016534231A (ja) 2016-11-04
US20160276241A1 (en) 2016-09-22
WO2015030297A1 (ko) 2015-03-05
CA2922615A1 (en) 2015-03-05
RU2016111693A (ru) 2017-10-06
CA2922612A1 (en) 2015-03-05
US10418300B2 (en) 2019-09-17
EP3040442A4 (en) 2017-04-12
KR20150026748A (ko) 2015-03-11
US9576876B2 (en) 2017-02-21
MX2016002433A (es) 2016-12-09
TWI521083B (zh) 2016-02-11
BR112016004476A2 (pt) 2017-09-12
RU2670303C2 (ru) 2018-10-22

Similar Documents

Publication Publication Date Title
SG11201600923YA (en) Substrate structure and method of manufacturing same
EP3046116A4 (en) Superconductor and method of manufacturing same
HK1202983A1 (en) Semiconductor device and manufacturing method of the same
TWI560787B (en) Interconnect structure and manufacturing method thereof
EP2922089A4 (en) MANUFACTURING METHOD AND SUBSTRATE STRUCTURE FOR A FLEXIBLE DISPLAY
EP3033767A4 (en) Semiconductor structures and methods of fabrication of same
HK1198303A1 (en) Semiconductor device and method of manufacturing the same
EP2974842A4 (en) LAMINATED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
EP3588586C0 (en) PHOTOVOLTAIC DEVICES AND METHOD OF PRODUCTION
HK1204506A1 (en) Semiconductor device and manufacturing method of semiconductor device
TWI561397B (en) Printbar and method of forming same
HK1198783A1 (en) Method of manufacturing semiconductor device and semiconductor device
EP2992556A4 (en) PHOTOVOLTAIC DEVICES AND METHOD FOR THE PRODUCTION THEREOF
GB201604505D0 (en) Pixel structure and method of manufacturing same
GB201413054D0 (en) Semiconductor assembly and method of manufacture
SG11201503368TA (en) Method of fabricating semiconductor devices
HK1201101A1 (en) Method of manufacturing semiconductor device and semiconductor device
HK1206869A1 (en) Semiconductor device and method of manufacturing the same
EP2973742A4 (en) PHOTOVOLTAIC DEVICES AND METHOD OF MAKING
HK1201990A1 (en) Semiconductor device and method of manufacturing same
EP2947975A4 (en) IN A COMPONENT EMBEDDED SUBSTRATE AND METHOD FOR THE MANUFACTURE THEREOF
SG10201408268YA (en) Integrated circuit packaging system with vialess substrate and method of manufacture thereof
GB201315841D0 (en) A substrate and a method of manufacturing a substrate
EP3016113A4 (en) Conductive substrate and manufacturing method thereof
EP2950623A4 (en) CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME