SG11201506001VA - Polishing composition, method for producing polishing composition and method for producing polished article - Google Patents
Polishing composition, method for producing polishing composition and method for producing polished articleInfo
- Publication number
- SG11201506001VA SG11201506001VA SG11201506001VA SG11201506001VA SG11201506001VA SG 11201506001V A SG11201506001V A SG 11201506001VA SG 11201506001V A SG11201506001V A SG 11201506001VA SG 11201506001V A SG11201506001V A SG 11201506001VA SG 11201506001V A SG11201506001V A SG 11201506001VA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing composition
- producing
- polished article
- article
- producing polished
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Composite Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013026020 | 2013-02-13 | ||
| PCT/JP2014/053065 WO2014126051A1 (ja) | 2013-02-13 | 2014-02-10 | 研磨用組成物、研磨用組成物製造方法および研磨物製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201506001VA true SG11201506001VA (en) | 2015-09-29 |
Family
ID=51354053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201506001VA SG11201506001VA (en) | 2013-02-13 | 2014-02-10 | Polishing composition, method for producing polishing composition and method for producing polished article |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20150376464A1 (zh) |
| EP (1) | EP2957613B1 (zh) |
| JP (2) | JP5897200B2 (zh) |
| KR (1) | KR102226441B1 (zh) |
| CN (1) | CN104995277B (zh) |
| SG (1) | SG11201506001VA (zh) |
| TW (1) | TWI624536B (zh) |
| WO (1) | WO2014126051A1 (zh) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10717899B2 (en) | 2013-03-19 | 2020-07-21 | Fujimi Incorporated | Polishing composition, method for producing polishing composition and polishing composition preparation kit |
| SG11201507438YA (en) | 2013-03-19 | 2015-10-29 | Fujimi Inc | Polishing composition, method for producing polishing composition and polishing composition preparation kit |
| JP6314019B2 (ja) * | 2014-03-31 | 2018-04-18 | ニッタ・ハース株式会社 | 半導体基板の研磨方法 |
| JP6185432B2 (ja) * | 2014-06-24 | 2017-08-23 | 株式会社フジミインコーポレーテッド | シリコンウェーハ研磨用組成物 |
| US10179870B2 (en) * | 2014-12-05 | 2019-01-15 | 3M Innovative Properties Company | Abrasive composition |
| WO2016181888A1 (ja) * | 2015-05-08 | 2016-11-17 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP6582601B2 (ja) * | 2015-06-22 | 2019-10-02 | 日立化成株式会社 | 研磨液、貯蔵液及び研磨方法 |
| WO2017002433A1 (ja) * | 2015-07-01 | 2017-01-05 | 東亞合成株式会社 | 研磨用濡れ剤及び研磨液組成物 |
| JP6906545B2 (ja) | 2016-04-28 | 2021-07-28 | ネイチャーワークス・エル・エル・シー | 耐熱性ポリマー層およびポリラクチド樹脂層を含有する多層シートの化粧面を有するポリマーフォーム断熱材構造 |
| EP3533760A4 (en) * | 2016-10-28 | 2020-12-23 | Tokuyama Corporation | PYROGENATED SILICA AND ITS PRODUCTION METHOD |
| JP6792413B2 (ja) * | 2016-10-31 | 2020-11-25 | 花王株式会社 | シリコンウェーハ用研磨液組成物 |
| WO2018096991A1 (ja) * | 2016-11-22 | 2018-05-31 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| US20200010727A1 (en) * | 2017-02-20 | 2020-01-09 | Fujimi Incorporated | Intermediate polishing composition for silicon substrate and polishing composition set for silicon substrate |
| JP6879798B2 (ja) * | 2017-03-30 | 2021-06-02 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
| JP7074525B2 (ja) | 2017-03-30 | 2022-05-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
| WO2018216733A1 (ja) * | 2017-05-26 | 2018-11-29 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびこれを用いた研磨方法 |
| EP3410236B1 (fr) * | 2017-05-29 | 2021-02-17 | The Swatch Group Research and Development Ltd | Dispositif et procede d'ajustement de marche et correction d'etat d'une montre |
| JP7227132B2 (ja) * | 2017-07-21 | 2023-02-21 | 株式会社フジミインコーポレーテッド | 基板の研磨方法および研磨用組成物セット |
| WO2019035161A1 (ja) * | 2017-08-14 | 2019-02-21 | 日立化成株式会社 | 研磨液、研磨液セット及び研磨方法 |
| JP6929239B2 (ja) * | 2018-03-30 | 2021-09-01 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
| US20210277282A1 (en) * | 2018-07-04 | 2021-09-09 | Sumitomo Seika Chemicals Co., Ltd. | Polishing composition |
| JP7424768B2 (ja) * | 2019-08-08 | 2024-01-30 | 株式会社フジミインコーポレーテッド | 研磨用添加剤含有液の濾過方法、研磨用添加剤含有液、研磨用組成物、研磨用組成物の製造方法およびフィルタ |
| EP3792327A1 (en) * | 2019-09-11 | 2021-03-17 | Fujimi Incorporated | Polishing composition, polishing method and method for manufacturing semiconductor substrate |
| CN112175524B (zh) * | 2020-09-21 | 2022-02-15 | 万华化学集团电子材料有限公司 | 一种蓝宝石抛光组合物及其应用 |
| KR102492236B1 (ko) * | 2020-12-17 | 2023-01-26 | 에스케이실트론 주식회사 | 연마장치 및 웨이퍼의 연마방법 |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001185516A (ja) * | 1999-12-24 | 2001-07-06 | Kao Corp | 研磨助剤 |
| JP2004051756A (ja) * | 2002-07-19 | 2004-02-19 | Sanyo Chem Ind Ltd | Ｃｍｐプロセス用研磨組成物 |
| JP4212861B2 (ja) * | 2002-09-30 | 2009-01-21 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いたシリコンウエハの研磨方法、並びにリンス用組成物及びそれを用いたシリコンウエハのリンス方法 |
| JP4593064B2 (ja) | 2002-09-30 | 2010-12-08 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
| JP4668528B2 (ja) | 2003-09-05 | 2011-04-13 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP2005268664A (ja) * | 2004-03-19 | 2005-09-29 | Fujimi Inc | 研磨用組成物 |
| KR20070033360A (ko) * | 2004-05-19 | 2007-03-26 | 닛산 가가쿠 고교 가부시키 가이샤 | 연마용 조성물 |
| US20060000808A1 (en) * | 2004-07-01 | 2006-01-05 | Fuji Photo Film Co., Ltd. | Polishing solution of metal and chemical mechanical polishing method |
| JP4814502B2 (ja) * | 2004-09-09 | 2011-11-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
| JP2006086462A (ja) * | 2004-09-17 | 2006-03-30 | Fujimi Inc | 研磨用組成物およびそれを用いた配線構造体の製造法 |
| JP5026665B2 (ja) * | 2004-10-15 | 2012-09-12 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
| JP4027929B2 (ja) * | 2004-11-30 | 2007-12-26 | 花王株式会社 | 半導体基板用研磨液組成物 |
| JP2006352043A (ja) * | 2005-06-20 | 2006-12-28 | Nitta Haas Inc | 半導体研磨用組成物 |
| JP2007073548A (ja) * | 2005-09-02 | 2007-03-22 | Fujimi Inc | 研磨方法 |
| JP2007095946A (ja) * | 2005-09-28 | 2007-04-12 | Fujifilm Corp | 金属用研磨液及び研磨方法 |
| TW200734436A (en) * | 2006-01-30 | 2007-09-16 | Fujifilm Corp | Metal-polishing liquid and chemical mechanical polishing method using the same |
| JP2007214205A (ja) * | 2006-02-07 | 2007-08-23 | Fujimi Inc | 研磨用組成物 |
| JP5335183B2 (ja) * | 2006-08-24 | 2013-11-06 | 株式会社フジミインコーポレーテッド | 研磨用組成物及び研磨方法 |
| JP5204960B2 (ja) * | 2006-08-24 | 2013-06-05 | 株式会社フジミインコーポレーテッド | 研磨用組成物及び研磨方法 |
| JP2008091524A (ja) * | 2006-09-29 | 2008-04-17 | Fujifilm Corp | 金属用研磨液 |
| JP5196819B2 (ja) * | 2007-03-19 | 2013-05-15 | ニッタ・ハース株式会社 | 研磨用組成物 |
| JPWO2009096495A1 (ja) * | 2008-02-01 | 2011-05-26 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
| US9202709B2 (en) * | 2008-03-19 | 2015-12-01 | Fujifilm Corporation | Polishing liquid for metal and polishing method using the same |
| JP2009231486A (ja) * | 2008-03-21 | 2009-10-08 | Kao Corp | シリコンウエハ用研磨液組成物 |
| EP2324956A4 (en) * | 2008-06-18 | 2011-08-03 | Fujimi Inc | POLISHING COMPOSITION AND THIS USE POLISHING METHOD |
| JP5474400B2 (ja) | 2008-07-03 | 2014-04-16 | 株式会社フジミインコーポレーテッド | 半導体用濡れ剤、それを用いた研磨用組成物および研磨方法 |
| JP5362319B2 (ja) * | 2008-10-21 | 2013-12-11 | 花王株式会社 | 研磨液組成物 |
| US20100164106A1 (en) * | 2008-12-31 | 2010-07-01 | Cheil Industries Inc. | CMP Slurry Composition for Barrier Polishing for Manufacturing Copper Interconnects, Polishing Method Using the Composition, and Semiconductor Device Manufactured by the Method |
| JP2011171689A (ja) * | 2009-07-07 | 2011-09-01 | Kao Corp | シリコンウエハ用研磨液組成物 |
| JP5493528B2 (ja) * | 2009-07-15 | 2014-05-14 | 日立化成株式会社 | Ｃｍｐ研磨液及びこのｃｍｐ研磨液を用いた研磨方法 |
| JP5441578B2 (ja) * | 2009-09-11 | 2014-03-12 | 花王株式会社 | 研磨液組成物 |
| JP5321430B2 (ja) * | 2009-12-02 | 2013-10-23 | 信越半導体株式会社 | シリコンウェーハ研磨用研磨剤およびシリコンウェーハの研磨方法 |
| JP5492603B2 (ja) * | 2010-03-02 | 2014-05-14 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
| JP5544244B2 (ja) * | 2010-08-09 | 2014-07-09 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
| JP2012079964A (ja) * | 2010-10-04 | 2012-04-19 | Nissan Chem Ind Ltd | 半導体ウェーハ用研磨液組成物 |
| SG192058A1 (en) * | 2011-01-26 | 2013-08-30 | Fujimi Inc | Polishing composition, polishing method using same, and substrate production method |
| TWI542678B (zh) * | 2011-05-24 | 2016-07-21 | 可樂麗股份有限公司 | 化學機械研磨用侵蝕防止劑、化學機械研磨用漿液及化學機械研磨方法 |
| JP2014041978A (ja) * | 2012-08-23 | 2014-03-06 | Fujimi Inc | 研磨用組成物、研磨用組成物の製造方法、及び研磨用組成物原液の製造方法 |
-
2014
- 2014-02-10 JP JP2015500230A patent/JP5897200B2/ja active Active
- 2014-02-10 EP EP14751996.1A patent/EP2957613B1/en active Active
- 2014-02-10 WO PCT/JP2014/053065 patent/WO2014126051A1/ja active Application Filing
- 2014-02-10 KR KR1020157024572A patent/KR102226441B1/ko active IP Right Grant
- 2014-02-10 SG SG11201506001VA patent/SG11201506001VA/en unknown
- 2014-02-10 CN CN201480008802.5A patent/CN104995277B/zh active Active
- 2014-02-10 US US14/767,494 patent/US20150376464A1/en not_active Abandoned
- 2014-02-12 TW TW103104570A patent/TWI624536B/zh active
-
2016
- 2016-03-01 JP JP2016038583A patent/JP6387032B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014126051A1 (ja) | 2014-08-21 |
| EP2957613A1 (en) | 2015-12-23 |
| CN104995277A (zh) | 2015-10-21 |
| JP5897200B2 (ja) | 2016-03-30 |
| CN104995277B (zh) | 2018-05-08 |
| TW201443212A (zh) | 2014-11-16 |
| EP2957613A4 (en) | 2016-11-09 |
| JP6387032B2 (ja) | 2018-09-05 |
| KR102226441B1 (ko) | 2021-03-12 |
| KR20150119062A (ko) | 2015-10-23 |
| US20150376464A1 (en) | 2015-12-31 |
| EP2957613B1 (en) | 2020-11-18 |
| JP2016138278A (ja) | 2016-08-04 |
| JPWO2014126051A1 (ja) | 2017-02-02 |
| TWI624536B (zh) | 2018-05-21 |
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