SG11201502925UA - Resin composition, prepreg, laminate and printed-wiring board - Google Patents

Resin composition, prepreg, laminate and printed-wiring board

Info

Publication number
SG11201502925UA
SG11201502925UA SG11201502925UA SG11201502925UA SG11201502925UA SG 11201502925U A SG11201502925U A SG 11201502925UA SG 11201502925U A SG11201502925U A SG 11201502925UA SG 11201502925U A SG11201502925U A SG 11201502925UA SG 11201502925U A SG11201502925U A SG 11201502925UA
Authority
SG
Singapore
Prior art keywords
prepreg
laminate
printed
resin composition
wiring board
Prior art date
Application number
SG11201502925UA
Other languages
English (en)
Inventor
Hiroshi Takahashi
Tomo Chiba
Nobuyoshi Ohnishi
Katsuya Tomizawa
Keisuke Takada
Eisuke Shiga
Takaaki Ogashiwa
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of SG11201502925UA publication Critical patent/SG11201502925UA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/024—Woven fabric
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2365/00—Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C08J2383/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2483/04—Polysiloxanes
    • C08J2483/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Textile Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Epoxy Resins (AREA)
SG11201502925UA 2012-10-19 2013-10-18 Resin composition, prepreg, laminate and printed-wiring board SG11201502925UA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012231632 2012-10-19
JP2013169894 2013-08-19
PCT/JP2013/078389 WO2014061812A1 (fr) 2012-10-19 2013-10-18 Composition de résine, pré-imprégné, stratifié, et tableau de connexions imprimé

Publications (1)

Publication Number Publication Date
SG11201502925UA true SG11201502925UA (en) 2015-06-29

Family

ID=50488367

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201502925UA SG11201502925UA (en) 2012-10-19 2013-10-18 Resin composition, prepreg, laminate and printed-wiring board

Country Status (8)

Country Link
US (1) US9902851B2 (fr)
EP (1) EP2910588B1 (fr)
JP (1) JP6314830B2 (fr)
KR (1) KR102075187B1 (fr)
CN (2) CN111393854B (fr)
SG (1) SG11201502925UA (fr)
TW (1) TWI598397B (fr)
WO (1) WO2014061812A1 (fr)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016121294A (ja) * 2014-12-25 2016-07-07 信越化学工業株式会社 半導体封止用液状アンダーフィル材組成物及びフリップチップ型半導体装置
JP6764582B2 (ja) * 2015-07-06 2020-10-07 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、レジンシート、金属箔張積層板及びプリント配線板
WO2017006897A1 (fr) 2015-07-06 2017-01-12 三菱瓦斯化学株式会社 Composition de résine, pré-imprégné, feuille de résine, plaque stratifiée recouverte d'une feuille métallique, et carte de circuit imprimé
US10721817B2 (en) 2015-07-06 2020-07-21 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them
US10869390B2 (en) 2015-07-06 2020-12-15 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, metal foil-clad laminate, and printed circuit board
CN107709452B (zh) * 2015-07-06 2021-03-02 三菱瓦斯化学株式会社 树脂组合物、预浸料、树脂片、层叠板和印刷电路板
US20180197655A1 (en) 2015-07-06 2018-07-12 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
WO2017191771A1 (fr) * 2016-05-02 2017-11-09 三菱瓦斯化学株式会社 Composition de résine, préimprégné, feuille de résine, feuille de résine stratifiée, carte stratifiée, carte stratifiée de feuille métallique, et carte de circuit imprimé
KR102117173B1 (ko) * 2016-12-07 2020-05-29 히타치가세이가부시끼가이샤 수지 바니시, 프리프레그, 적층판 및 프린트 배선판
WO2018124161A1 (fr) * 2016-12-28 2018-07-05 三菱瓦斯化学株式会社 Composition de résine de carte de circuit imprimé, préimprégné, feuille de résine, plaque stratifiée, plaque stratifiée avec gainage de feuille métallique, carte de circuit imprimé, et carte de circuit imprimé multicouche
CN110121530B (zh) * 2016-12-28 2022-02-11 三菱瓦斯化学株式会社 树脂组合物、预浸料、层叠板、覆金属箔层叠板、印刷电路板、及多层印刷电路板
TWI656151B (zh) * 2016-12-28 2019-04-11 日商三菱瓦斯化學股份有限公司 預浸體、疊層板、覆金屬箔疊層板、印刷電路板、及多層印刷電路板
JP7145586B2 (ja) * 2017-02-10 2022-10-03 旭化成株式会社 ガラスクロス、プリプレグ、及びプリント配線板
JP6784226B2 (ja) * 2017-05-19 2020-11-11 信越化学工業株式会社 シリコーン変性エポキシ樹脂組成物及び半導体装置
JP2019014858A (ja) * 2017-07-11 2019-01-31 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
JP6512328B2 (ja) * 2018-03-19 2019-05-15 味の素株式会社 樹脂組成物
KR20210124174A (ko) * 2019-02-06 2021-10-14 미츠비시 가스 가가쿠 가부시키가이샤 조성물, 프리프레그, 수지 시트, 적층판, 및 프린트 배선판
JP7314837B2 (ja) * 2020-02-28 2023-07-26 味の素株式会社 樹脂組成物
WO2021200871A1 (fr) * 2020-03-31 2021-10-07 デンカ株式会社 Complexe de produit semi-durci et son procédé de production, complexe de produit durci et son procédé de production, et composition thermodurcissable utilisée pour imprégner un corps poreux
GB202103456D0 (en) 2021-03-12 2021-04-28 Rolls Royce Plc Phenolic triazine silicon polymer resin blends
KR20240043744A (ko) * 2021-08-05 2024-04-03 미츠비시 가스 가가쿠 가부시키가이샤 프리프레그, 금속박 피복 적층판 및 프린트 배선판
WO2023013712A1 (fr) * 2021-08-05 2023-02-09 三菱瓦斯化学株式会社 Composition durcissable, préimprégné, stratifié plaqué d'une feuille métallique, et carte de circuits imprimés

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3284398A (en) * 1963-11-05 1966-11-08 Gen Dynamics Corp High temperature adhesive
US5086124A (en) * 1990-07-05 1992-02-04 General Electric Company High heat distortion temperature epoxy siloxane/organic epoxy compositions
JP2795546B2 (ja) * 1991-02-15 1998-09-10 三菱電機株式会社 半導体封止用エポキシ樹脂組成物
JPH07149952A (ja) * 1993-11-30 1995-06-13 Toray Ind Inc 熱硬化性樹脂組成物、樹脂硬化物、プリプレグおよび繊維強化プラスチック
JPH0848001A (ja) 1994-08-08 1996-02-20 Matsushita Electric Works Ltd 銅張積層板
JP3173332B2 (ja) 1995-03-13 2001-06-04 新神戸電機株式会社 金属箔張り積層板の製造法
US5863970A (en) * 1995-12-06 1999-01-26 Polyset Company, Inc. Epoxy resin composition with cycloaliphatic epoxy-functional siloxane
JPH1045872A (ja) 1996-05-31 1998-02-17 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JP2000158589A (ja) 1998-11-30 2000-06-13 Shin Kobe Electric Mach Co Ltd 金属箔張り積層板の製造法
JP2003246849A (ja) 2002-02-26 2003-09-05 Shin Kobe Electric Mach Co Ltd エポキシ樹脂組成物、ならびにそれを用いたプリプレグ、積層板及びプリント配線板
JP2003252960A (ja) * 2002-03-05 2003-09-10 Toray Ind Inc エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置
TWI398461B (zh) * 2004-03-16 2013-06-11 Sumitomo Bakelite Co 環氧樹脂組成物及半導體裝置
JP4059244B2 (ja) 2004-11-24 2008-03-12 松下電工株式会社 エポキシ樹脂組成物、並びにプリプレグ、積層板、プリント配線板
JP2007138002A (ja) 2005-11-17 2007-06-07 Yokohama Rubber Co Ltd:The 熱硬化性樹脂組成物
JP5263705B2 (ja) * 2007-02-07 2013-08-14 三菱瓦斯化学株式会社 プリプレグ及び積層板
JP5024205B2 (ja) 2007-07-12 2012-09-12 三菱瓦斯化学株式会社 プリプレグ及び積層板
JP2010024265A (ja) 2008-07-15 2010-02-04 Hitachi Chem Co Ltd エポキシ樹脂組成物及びこれを用いた電子部品装置
CN102365310B (zh) * 2009-03-27 2013-11-20 日立化成工业株式会社 热固化性树脂组合物、以及使用了该组合物的预浸料、带支撑体的绝缘膜、层叠板及印刷布线板
WO2011065365A1 (fr) * 2009-11-30 2011-06-03 ナミックス株式会社 Composition de résine époxy de scellement des semi-conducteurs et semi-conducteurs
JP2011132416A (ja) * 2009-12-25 2011-07-07 Nagase Chemtex Corp 熱硬化性樹脂組成物及び有機無機複合樹脂
JP5892340B2 (ja) * 2010-03-02 2016-03-23 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、および積層板
AU2011224691B2 (en) * 2010-03-10 2013-08-29 Elc Management Llc System for skin treatment analysis using spectral image data to generate 3D RGB model
JP5653826B2 (ja) * 2010-04-14 2015-01-14 昭和電工株式会社 エポキシ化合物、エポキシ基含有シリコーン化合物および硬化性組成物
KR101840486B1 (ko) * 2010-04-21 2018-03-20 미츠비시 가스 가가쿠 가부시키가이샤 열경화성 조성물
WO2011138865A1 (fr) 2010-05-07 2011-11-10 住友ベークライト株式会社 Composition de résine époxy pour des cartes de circuit imprimé, prépreg, stratifié, feuille de résine, stratifié pour cartes de circuit imprimé, cartes de circuit imprimé, et dispositifs à semi-conducteur
WO2011152402A1 (fr) 2010-06-02 2011-12-08 三菱瓦斯化学株式会社 Composition de résine, pré-imprégné et feuille stratifiée l'utilisant
KR20130141449A (ko) * 2010-08-31 2013-12-26 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 및 적층판
KR101832869B1 (ko) 2011-01-18 2018-04-13 히타치가세이가부시끼가이샤 수지 조성물 및 이것을 이용한 프리프레그, 적층판, 인쇄 배선판
US8735733B2 (en) * 2011-01-18 2014-05-27 Hitachi Chemical Company, Ltd. Resin composition, prepreg laminate obtained with the same and printed-wiring board
KR20140043735A (ko) 2011-05-31 2014-04-10 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 그리고 이것을 사용한 프리프레그 및 금속박 피복 적층판
JP5762876B2 (ja) * 2011-08-03 2015-08-12 株式会社Adeka エポキシ樹脂用硬化剤、及び該エポキシ樹脂用硬化剤を含有するエポキシ樹脂組成物
SG11201501112TA (en) * 2012-08-16 2015-04-29 Mitsubishi Gas Chemical Co Resin sheet, support with resin layer, laminate and metal foil-clad laminate

Also Published As

Publication number Publication date
CN104736588B (zh) 2020-03-31
KR20150072425A (ko) 2015-06-29
US9902851B2 (en) 2018-02-27
EP2910588B1 (fr) 2022-11-02
EP2910588A4 (fr) 2016-06-29
KR102075187B1 (ko) 2020-02-07
CN104736588A (zh) 2015-06-24
EP2910588A1 (fr) 2015-08-26
CN111393854B (zh) 2022-02-25
TW201434945A (zh) 2014-09-16
US20150267047A1 (en) 2015-09-24
CN111393854A (zh) 2020-07-10
TWI598397B (zh) 2017-09-11
WO2014061812A1 (fr) 2014-04-24
JPWO2014061812A1 (ja) 2016-09-05
JP6314830B2 (ja) 2018-04-25

Similar Documents

Publication Publication Date Title
SG11201502925UA (en) Resin composition, prepreg, laminate and printed-wiring board
EP2860219A4 (fr) Composition de résine, pré-imprégné, stratifié de feuille métallique-gaine et carte de circuit imprimé
SG11201406174PA (en) Resin composition, prepreg, and laminate
SG11201505058PA (en) Resin composition, prepreg, laminate, metal foil-clad laminate, and printed-wiring board
SG10201602081SA (en) Resin composition, prepreg, and laminate
EP2716676A4 (fr) Composition de résine, pré-imprégné et stratifié
EP2910587A4 (fr) Composition de résine, pré-imprégné, plaque stratifiée, plaque stratifiée enrobée d'une feuille métallique, et carte imprimée
EP2666826A4 (fr) Composition de résine et carte à circuit imprimé, feuille stratifiée et préimprégné l'utilisant
SG11201401906SA (en) Resin composition, and prepreg and laminate using the same
EP2557121A4 (fr) Composition de résine, pré-imprégné et stratifié
SG10201600443SA (en) Resin composition, and prepreg as well as laminate using the same
SG11201404727XA (en) Resin composition, prepreg, resin sheet, and metal foil-clad laminate
EP2829568A4 (fr) Préimprégné et plaque stratifiée
SG11201509672RA (en) Resin composition, prepreg, resin sheet and metal foil-clad laminate
EP2690120A4 (fr) Composition de résine, pré-imprégné et feuille de résine, et stratifié plaqué par une feuille métallique
EP2770025A4 (fr) Composition de résine à faible constante diélectrique exempte d'halogène et préimprégné obtenu à partir d'un stratifié cuivré et parties solides organiques de la composition de résine à faible constante diélectrique exempte d'halogène
EP2810971A4 (fr) Composition de résine pour une matière de carte de circuit imprimé, et préimprégné, feuille de résine, stratifié plaqué par une feuille de métal et carte de circuit imprimé les utilisant
SG11201503925QA (en) Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board
SG11201405224QA (en) Resin composition, prepreg, and metal foil-clad laminate
EP2762507A4 (fr) Composition de résine, préimprégné et stratifié plaqué par une feuille métallique
EP2918637A4 (fr) Composition de résine et laminé pour carte de circuit imprimé comprenant la composition
SG11201401958TA (en) Resin composition, prepreg, and laminate
SG10201509881VA (en) Resin composition, prepreg, and laminate
EP2896653A4 (fr) Composition de résine époxy ainsi que stratifié de pré-imprégné et de cuivre fabriqué à l'aide de la composition
SG10201600489PA (en) Resin composition, prepreg, and metal foil-clad laminate