SG10201503091TA - Heat curable composition - Google Patents
Heat curable compositionInfo
- Publication number
- SG10201503091TA SG10201503091TA SG10201503091TA SG10201503091TA SG10201503091TA SG 10201503091T A SG10201503091T A SG 10201503091TA SG 10201503091T A SG10201503091T A SG 10201503091TA SG 10201503091T A SG10201503091T A SG 10201503091TA SG 10201503091T A SG10201503091T A SG 10201503091TA
- Authority
- SG
- Singapore
- Prior art keywords
- curable composition
- heat curable
- heat
- composition
- curable
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/04—Epoxynovolacs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/681—Metal alcoholates, phenolates or carboxylates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010097778 | 2010-04-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201503091TA true SG10201503091TA (en) | 2015-06-29 |
Family
ID=44834193
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201503091TA SG10201503091TA (en) | 2010-04-21 | 2011-04-19 | Heat curable composition |
SG2012078093A SG184967A1 (en) | 2010-04-21 | 2011-04-19 | Heat curable composition |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2012078093A SG184967A1 (en) | 2010-04-21 | 2011-04-19 | Heat curable composition |
Country Status (9)
Country | Link |
---|---|
US (1) | US20130101863A1 (en) |
EP (1) | EP2562196B1 (en) |
JP (1) | JP6085172B2 (en) |
KR (1) | KR101840486B1 (en) |
CN (1) | CN102939316B (en) |
HK (1) | HK1181796A1 (en) |
SG (2) | SG10201503091TA (en) |
TW (1) | TWI573812B (en) |
WO (1) | WO2011132674A1 (en) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG11201502604RA (en) * | 2012-10-19 | 2015-05-28 | Mitsubishi Gas Chemical Co | Resin composition, prepreg, laminate plate, metallic foil clad laminate, and printed circuit board |
KR102075187B1 (en) * | 2012-10-19 | 2020-02-07 | 미츠비시 가스 가가쿠 가부시키가이샤 | Resin composition, prepreg, laminate, and printed wiring board |
CN104837922B (en) * | 2012-11-28 | 2019-05-10 | 三菱瓦斯化学株式会社 | Resin combination, prepreg, plywood, clad with metal foil plywood and printed circuit board |
JP6249345B2 (en) * | 2013-03-22 | 2017-12-20 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, laminate and printed wiring board |
JP2015207754A (en) | 2013-12-13 | 2015-11-19 | 日亜化学工業株式会社 | light-emitting device |
JP6639072B2 (en) * | 2014-02-06 | 2020-02-05 | 三菱瓦斯化学株式会社 | Resin composition for printed wiring board, prepreg, laminated board and printed wiring board |
JP6578735B2 (en) | 2014-05-21 | 2019-09-25 | 日亜化学工業株式会社 | Semiconductor device mounting structure, backlight device, and mounting substrate |
CN104130548A (en) * | 2014-07-29 | 2014-11-05 | 深圳市惠程电气股份有限公司 | Polyimide fiber prepreg and preparation method and application thereof |
JP2016035038A (en) * | 2014-08-01 | 2016-03-17 | 日本化薬株式会社 | Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, carbon-fiber-reinforced composite material |
JP6366136B2 (en) * | 2014-08-01 | 2018-08-01 | 日本化薬株式会社 | Epoxy resin composition, resin sheet, prepreg, metal-clad laminate, printed wiring board |
JP6472073B2 (en) * | 2014-08-01 | 2019-02-20 | 日本化薬株式会社 | Epoxy resin-containing varnish, epoxy resin composition-containing varnish, prepreg, resin sheet, printed wiring board, semiconductor device |
JP6932116B2 (en) * | 2014-08-01 | 2021-09-08 | 日本化薬株式会社 | Epoxy resin-containing varnish, epoxy resin composition-containing varnish, prepreg, resin sheet, printed wiring board, semiconductor device |
JP2016034996A (en) * | 2014-08-01 | 2016-03-17 | 日本化薬株式会社 | Epoxy resin composition, prepreg, metal-clad laminate and printed wiring board |
TWI570200B (en) * | 2015-01-19 | 2017-02-11 | 巴川製紙所股份有限公司 | Thermosetting adhesive composition, thermosetting adhesive film, and composite film |
JP6010874B1 (en) * | 2015-02-03 | 2016-10-19 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board |
JP6648425B2 (en) * | 2015-06-22 | 2020-02-14 | 味の素株式会社 | Resin composition |
JP6764582B2 (en) * | 2015-07-06 | 2020-10-07 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring board |
EP3178863B1 (en) | 2015-12-11 | 2019-08-28 | Evonik Degussa GmbH | Epoxy resin compositions for the preparation of storage-stable composites |
CN107253259A (en) * | 2016-11-29 | 2017-10-17 | 上海晋运实业有限公司 | A kind of regenerated fiber plate and preparation method thereof, purposes |
WO2019065942A1 (en) * | 2017-09-29 | 2019-04-04 | パナソニックIpマネジメント株式会社 | Prepreg, and metal-clad laminated board and wiring substrate obtained using same |
CN108047718B (en) * | 2017-12-29 | 2020-07-28 | 广东生益科技股份有限公司 | Maleimide resin composition, prepreg, laminate, and printed wiring board |
JP2020050797A (en) * | 2018-09-27 | 2020-04-02 | パナソニックIpマネジメント株式会社 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board |
JP6881552B2 (en) * | 2019-11-13 | 2021-06-02 | 味の素株式会社 | Resin composition |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02286723A (en) * | 1989-04-28 | 1990-11-26 | Matsushita Electric Works Ltd | Laminating resin composition and laminate |
US5741879A (en) * | 1995-03-03 | 1998-04-21 | Minnesota Mining And Manufacturing Company | Energy-polymerizable compositions comprising a cyanate ester monomer or oligomer and a polyol |
US5847327A (en) * | 1996-11-08 | 1998-12-08 | W.L. Gore & Associates, Inc. | Dimensionally stable core for use in high density chip packages |
ATE320460T1 (en) * | 1997-07-24 | 2006-04-15 | Henkel Corp | HOME CURING RESIN COMPOSITIONS USABLE AS UNDERFILL SEALANTS |
JP2978164B1 (en) * | 1998-08-25 | 1999-11-15 | 東芝ケミカル株式会社 | Sealing resin composition and semiconductor sealing device |
KR20010101310A (en) * | 1998-12-24 | 2001-11-14 | 우찌가사끼 이사오 | Cyanate-epoxy resin composition, and prepreg, metal foil-laminated plate and printed wiring board using the same |
JP3485169B2 (en) * | 1998-12-24 | 2004-01-13 | 日立化成工業株式会社 | Cyanate / epoxy resin composition and prepreg, metal foil-clad laminate and printed wiring board using the same |
US6632893B2 (en) * | 1999-05-28 | 2003-10-14 | Henkel Loctite Corporation | Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners |
JP4783984B2 (en) * | 2001-02-15 | 2011-09-28 | 日立化成工業株式会社 | Resin composition, use thereof and production method thereof |
JP5280597B2 (en) * | 2001-03-30 | 2013-09-04 | サンスター技研株式会社 | One-component thermosetting epoxy resin composition and underfill material for semiconductor mounting |
WO2003048251A1 (en) * | 2001-12-05 | 2003-06-12 | Isola Laminate Systems Corp. | Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s) |
JP3821728B2 (en) * | 2002-03-06 | 2006-09-13 | 住友ベークライト株式会社 | Prepreg |
JP4784066B2 (en) * | 2004-10-28 | 2011-09-28 | 三菱瓦斯化学株式会社 | Resin composition and copper clad laminate |
KR101019738B1 (en) * | 2006-02-24 | 2011-03-08 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | Resin Composition, Prepreg and Metal-Foil-Clad Laminate |
US20080051524A1 (en) * | 2006-08-28 | 2008-02-28 | Henkel Corporation | Epoxy-Based Compositions Having Improved Impact Resistance |
WO2009040921A1 (en) * | 2007-09-27 | 2009-04-02 | Panasonic Electric Works Co., Ltd. | Epoxy resin composition and, produced therewith, prepreg and metal clad laminate |
US8318292B2 (en) * | 2008-03-26 | 2012-11-27 | Sumitomo Bakelite Co., Ltd. | Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device |
JP6065845B2 (en) * | 2012-01-31 | 2017-01-25 | 三菱瓦斯化学株式会社 | Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil-clad laminate and printed wiring board using the same |
-
2011
- 2011-04-19 US US13/641,985 patent/US20130101863A1/en not_active Abandoned
- 2011-04-19 WO PCT/JP2011/059627 patent/WO2011132674A1/en active Application Filing
- 2011-04-19 SG SG10201503091TA patent/SG10201503091TA/en unknown
- 2011-04-19 CN CN201180020278.XA patent/CN102939316B/en active Active
- 2011-04-19 EP EP11772009.4A patent/EP2562196B1/en active Active
- 2011-04-19 KR KR1020127026948A patent/KR101840486B1/en active IP Right Grant
- 2011-04-19 SG SG2012078093A patent/SG184967A1/en unknown
- 2011-04-19 JP JP2012511667A patent/JP6085172B2/en active Active
- 2011-04-21 TW TW100113898A patent/TWI573812B/en active
-
2013
- 2013-08-05 HK HK13109097.8A patent/HK1181796A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR20130079339A (en) | 2013-07-10 |
TW201204760A (en) | 2012-02-01 |
HK1181796A1 (en) | 2013-11-15 |
US20130101863A1 (en) | 2013-04-25 |
EP2562196B1 (en) | 2018-02-21 |
EP2562196A4 (en) | 2016-09-28 |
JPWO2011132674A1 (en) | 2013-07-18 |
CN102939316B (en) | 2016-04-27 |
SG184967A1 (en) | 2012-11-29 |
JP6085172B2 (en) | 2017-02-22 |
EP2562196A1 (en) | 2013-02-27 |
WO2011132674A1 (en) | 2011-10-27 |
CN102939316A (en) | 2013-02-20 |
TWI573812B (en) | 2017-03-11 |
KR101840486B1 (en) | 2018-03-20 |
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