SG11201404173UA - Stacked integrated component devices with energization - Google Patents
Stacked integrated component devices with energizationInfo
- Publication number
- SG11201404173UA SG11201404173UA SG11201404173UA SG11201404173UA SG11201404173UA SG 11201404173U A SG11201404173U A SG 11201404173UA SG 11201404173U A SG11201404173U A SG 11201404173UA SG 11201404173U A SG11201404173U A SG 11201404173UA SG 11201404173U A SG11201404173U A SG 11201404173UA
- Authority
- SG
- Singapore
- Prior art keywords
- energization
- integrated component
- component devices
- stacked integrated
- stacked
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00038—Production of contact lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
- B29D11/00807—Producing lenses combined with electronics, e.g. chips
- B29D11/00817—Producing electro-active lenses or lenses with energy receptors, e.g. batteries or antennas
- B29D11/00826—Producing electro-active lenses or lenses with energy receptors, e.g. batteries or antennas with energy receptors for wireless energy transmission
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
- G02B1/041—Lenses
- G02B1/043—Contact lenses
-
- G—PHYSICS
- G02—OPTICS
- G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
- G02C7/00—Optical parts
- G02C7/02—Lenses; Lens systems ; Methods of designing lenses
- G02C7/04—Contact lenses for the eyes
-
- G—PHYSICS
- G02—OPTICS
- G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
- G02C7/00—Optical parts
- G02C7/02—Lenses; Lens systems ; Methods of designing lenses
- G02C7/08—Auxiliary lenses; Arrangements for varying focal length
- G02C7/081—Ophthalmic lenses with variable focal length
- G02C7/083—Electrooptic lenses
-
- G—PHYSICS
- G02—OPTICS
- G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
- G02C7/00—Optical parts
- G02C7/02—Lenses; Lens systems ; Methods of designing lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Ophthalmology & Optometry (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Eyeglasses (AREA)
- Prostheses (AREA)
- Battery Mounting, Suspending (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/358,656 US9698129B2 (en) | 2011-03-18 | 2012-01-26 | Stacked integrated component devices with energization |
| PCT/US2013/023190 WO2013112868A1 (en) | 2012-01-26 | 2013-01-25 | Stacked integrated component devices with energization |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201404173UA true SG11201404173UA (en) | 2014-10-30 |
Family
ID=47750040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201404173UA SG11201404173UA (en) | 2012-01-26 | 2013-01-25 | Stacked integrated component devices with energization |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US9698129B2 (https=) |
| EP (1) | EP2807674A1 (https=) |
| JP (1) | JP6121448B2 (https=) |
| KR (1) | KR20140116952A (https=) |
| CN (1) | CN104205331B (https=) |
| AU (1) | AU2013211974B2 (https=) |
| BR (1) | BR112014018348A8 (https=) |
| CA (1) | CA2862667A1 (https=) |
| HK (1) | HK1204710A1 (https=) |
| RU (1) | RU2624606C2 (https=) |
| SG (1) | SG11201404173UA (https=) |
| TW (1) | TWI622157B (https=) |
| WO (1) | WO2013112868A1 (https=) |
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-
2012
- 2012-01-26 US US13/358,656 patent/US9698129B2/en active Active
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2013
- 2013-01-25 CN CN201380016602.XA patent/CN104205331B/zh not_active Expired - Fee Related
- 2013-01-25 HK HK15105110.7A patent/HK1204710A1/xx unknown
- 2013-01-25 SG SG11201404173UA patent/SG11201404173UA/en unknown
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- 2013-01-25 EP EP13706113.1A patent/EP2807674A1/en not_active Withdrawn
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- 2013-01-25 KR KR1020147023512A patent/KR20140116952A/ko not_active Abandoned
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| AU2013211974B2 (en) | 2016-08-11 |
| CN104205331A (zh) | 2014-12-10 |
| TWI622157B (zh) | 2018-04-21 |
| BR112014018348A2 (https=) | 2017-06-20 |
| US9698129B2 (en) | 2017-07-04 |
| KR20140116952A (ko) | 2014-10-06 |
| TW201349440A (zh) | 2013-12-01 |
| CN104205331B (zh) | 2017-11-14 |
| CA2862667A1 (en) | 2013-08-01 |
| RU2014134641A (ru) | 2016-03-20 |
| US20120236524A1 (en) | 2012-09-20 |
| JP6121448B2 (ja) | 2017-04-26 |
| BR112014018348A8 (pt) | 2017-07-11 |
| AU2013211974A1 (en) | 2014-09-11 |
| HK1204710A1 (en) | 2015-11-27 |
| JP2015512142A (ja) | 2015-04-23 |
| WO2013112868A1 (en) | 2013-08-01 |
| EP2807674A1 (en) | 2014-12-03 |
| RU2624606C2 (ru) | 2017-07-04 |
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