RU2014134641A - Многослойные интегрированные многокомпонентные устройства с подачей питания - Google Patents
Многослойные интегрированные многокомпонентные устройства с подачей питания Download PDFInfo
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- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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Abstract
1. Многослойное интегрированное многокомпонентное устройство с подачей питания, содержащее:по меньшей мере первый из наложенных друг на друга слоев (1102), содержащий электрически активные устройства, содержащие один или более компонентов, второй из наложенных друг на друга слоев (1104), содержащий электрически активные устройства, содержащие один или более компонентов, и по меньшей мере третий из наложенных друг на друга слоев (1106, 1107), содержащий одно или более устройств подачи питания;причем по меньшей мере первое электрическое соединение (1103, 1105) позволяет току протекать между по меньшей мере одним из одного или более компонентов в указанном первом и втором из наложенных друг на друга слоев и по меньшей мере одним компонентом в указанном третьем из наложенных друг на друга слоев; ипричем тип технологии первого из наложенных друг на друга слоев отличается от типа технологии второго из наложенных друг на друга слоев.2. Многослойное интегрированное многокомпонентное устройство по п. 1, в котором тип технологии первого из наложенных друг на друга слоев (1102) получают из технологического процесса, отличного от процесса, на основе которого получают второй из наложенных друг на друга слоев (1104).3. Многослойное интегрированное многокомпонентное устройство по п. 2, в котором тип технологии первого из наложенных друг на друга слоев (1102) содержит одну технологию, выбранную из КМОП, БиКМОП, биполярной, МЭМС и технологии запоминающих устройств, а тип технологии второго из наложенных друг на друга слоев (1104) содержит другую технологию, выбранную из КМОП, БиКМОП, биполярной, МЭМС технологий и технологии запоминающих устройств.4. Многослойное интегрированное многокомпонентное у
Claims (16)
1. Многослойное интегрированное многокомпонентное устройство с подачей питания, содержащее:
по меньшей мере первый из наложенных друг на друга слоев (1102), содержащий электрически активные устройства, содержащие один или более компонентов, второй из наложенных друг на друга слоев (1104), содержащий электрически активные устройства, содержащие один или более компонентов, и по меньшей мере третий из наложенных друг на друга слоев (1106, 1107), содержащий одно или более устройств подачи питания;
причем по меньшей мере первое электрическое соединение (1103, 1105) позволяет току протекать между по меньшей мере одним из одного или более компонентов в указанном первом и втором из наложенных друг на друга слоев и по меньшей мере одним компонентом в указанном третьем из наложенных друг на друга слоев; и
причем тип технологии первого из наложенных друг на друга слоев отличается от типа технологии второго из наложенных друг на друга слоев.
2. Многослойное интегрированное многокомпонентное устройство по п. 1, в котором тип технологии первого из наложенных друг на друга слоев (1102) получают из технологического процесса, отличного от процесса, на основе которого получают второй из наложенных друг на друга слоев (1104).
3. Многослойное интегрированное многокомпонентное устройство по п. 2, в котором тип технологии первого из наложенных друг на друга слоев (1102) содержит одну технологию, выбранную из КМОП, БиКМОП, биполярной, МЭМС и технологии запоминающих устройств, а тип технологии второго из наложенных друг на друга слоев (1104) содержит другую технологию, выбранную из КМОП, БиКМОП, биполярной, МЭМС технологий и технологии запоминающих устройств.
4. Многослойное интегрированное многокомпонентное устройство по п. 2, в котором тип технологии первого из наложенных друг на друга слоев (1102) получают из технологического процесса КМОП, а тип технологии второго из наложенных друг на друга слоев (1104) получают из технологического процесса БиКМОП.
5. Многослойное интегрированное многокомпонентное устройство по п. 1, в котором типы технологии первого и второго из наложенных друг на друга слоев (1102, 1104) получают на основе различных семейств в пределах одного определения требований технологии.
6. Многослойное интегрированное многокомпонентное устройство по п. 5, в котором первый из наложенных друг на друга слоев (1102) образован по технологическому процессу КМОП 0,5 микрон, а второй из наложенных друг на друга слоев (1104) образован по технологическому процессу КМОП 20 нанометров.
7. Многослойное интегрированное многокомпонентное устройство по п. 1, в котором подложка, применяемая для формирования первого из наложенных друг на друга слоев (1102), отличается от подложки, применяемой для формирования второго из наложенных друг на друга слоев (1104).
8. Многослойное интегрированное многокомпонентное устройство по п. 7, в котором первый из наложенных друг на друга слоев (1102) образован на кремниевой подложке, а второй из наложенных друг на друга слоев (1104) образован на одной из: подложки типа «кремний на диэлектрике», подложки из некремниевого полупроводника или органической подложки для электронных устройств.
9. Многослойное интегрированное многокомпонентное устройство по п. 1, в котором устройства подачи питания содержат элемент тонкопленочной аккумуляторной батареи с твердым электролитом.
10. Многослойное интегрированное многокомпонентное устройство по п. 1, в котором устройства подачи питания содержат элемент щелочной аккумуляторной батареи.
11. Многослойное интегрированное многокомпонентное устройство по п. 1, в котором устройства подачи питания содержат элемент аккумуляторной батареи на основе проволоки.
12. Многослойное интегрированное многокомпонентное устройство по п. 1, в котором устройства подачи питания содержат по меньшей мере устройство хранения энергии химического типа.
13. Многослойное интегрированное многокомпонентное устройство по п. 1, в котором устройства подачи питания содержат по меньшей мере устройство хранения энергии емкостного типа.
14. Многослойное интегрированное многокомпонентное устройство по любому из пп. 1-8, в котором пространственные ограничения первого слоя являются приблизительно прямолинейными.
15. Многослойное интегрированное многокомпонентное устройство по любому из пп. 1-8, в котором пространственные ограничения первого слоя содержат области, которые являются приблизительно криволинейными.
16. Многослойное интегрированное многокомпонентное устройство по любому из пп. 1-8, в котором пространственные ограничения первого слоя содержат области, которые являются сегментами многоугольника.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US13/358,656 | 2012-01-26 | ||
US13/358,656 US9698129B2 (en) | 2011-03-18 | 2012-01-26 | Stacked integrated component devices with energization |
PCT/US2013/023190 WO2013112868A1 (en) | 2012-01-26 | 2013-01-25 | Stacked integrated component devices with energization |
Publications (2)
Publication Number | Publication Date |
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RU2014134641A true RU2014134641A (ru) | 2016-03-20 |
RU2624606C2 RU2624606C2 (ru) | 2017-07-04 |
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RU2014134641A RU2624606C2 (ru) | 2012-01-26 | 2013-01-25 | Многослойные интегрированные многокомпонентные устройства с подачей питания |
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Country | Link |
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US (1) | US9698129B2 (ru) |
EP (1) | EP2807674A1 (ru) |
JP (1) | JP6121448B2 (ru) |
KR (1) | KR20140116952A (ru) |
CN (1) | CN104205331B (ru) |
AU (1) | AU2013211974B2 (ru) |
BR (1) | BR112014018348A8 (ru) |
CA (1) | CA2862667A1 (ru) |
HK (1) | HK1204710A1 (ru) |
RU (1) | RU2624606C2 (ru) |
SG (1) | SG11201404173UA (ru) |
TW (1) | TWI622157B (ru) |
WO (1) | WO2013112868A1 (ru) |
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US9110310B2 (en) * | 2011-03-18 | 2015-08-18 | Johnson & Johnson Vision Care, Inc. | Multiple energization elements in stacked integrated component devices |
US9804418B2 (en) | 2011-03-21 | 2017-10-31 | Johnson & Johnson Vision Care, Inc. | Methods and apparatus for functional insert with power layer |
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-
2012
- 2012-01-26 US US13/358,656 patent/US9698129B2/en active Active
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- 2013-01-25 TW TW102102985A patent/TWI622157B/zh not_active IP Right Cessation
- 2013-01-25 SG SG11201404173UA patent/SG11201404173UA/en unknown
- 2013-01-25 WO PCT/US2013/023190 patent/WO2013112868A1/en active Application Filing
- 2013-01-25 BR BR112014018348A patent/BR112014018348A8/pt not_active Application Discontinuation
- 2013-01-25 KR KR1020147023512A patent/KR20140116952A/ko active IP Right Grant
- 2013-01-25 JP JP2014554866A patent/JP6121448B2/ja active Active
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- 2013-01-25 RU RU2014134641A patent/RU2624606C2/ru not_active IP Right Cessation
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EP2807674A1 (en) | 2014-12-03 |
CN104205331B (zh) | 2017-11-14 |
RU2624606C2 (ru) | 2017-07-04 |
SG11201404173UA (en) | 2014-10-30 |
TW201349440A (zh) | 2013-12-01 |
US9698129B2 (en) | 2017-07-04 |
US20120236524A1 (en) | 2012-09-20 |
AU2013211974B2 (en) | 2016-08-11 |
AU2013211974A1 (en) | 2014-09-11 |
JP2015512142A (ja) | 2015-04-23 |
HK1204710A1 (en) | 2015-11-27 |
BR112014018348A2 (ru) | 2017-06-20 |
CA2862667A1 (en) | 2013-08-01 |
JP6121448B2 (ja) | 2017-04-26 |
WO2013112868A1 (en) | 2013-08-01 |
CN104205331A (zh) | 2014-12-10 |
KR20140116952A (ko) | 2014-10-06 |
BR112014018348A8 (pt) | 2017-07-11 |
TWI622157B (zh) | 2018-04-21 |
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