SG107114A1 - Fluid material filling apparatus and related filling method - Google Patents
Fluid material filling apparatus and related filling methodInfo
- Publication number
- SG107114A1 SG107114A1 SG200205836A SG200205836A SG107114A1 SG 107114 A1 SG107114 A1 SG 107114A1 SG 200205836 A SG200205836 A SG 200205836A SG 200205836 A SG200205836 A SG 200205836A SG 107114 A1 SG107114 A1 SG 107114A1
- Authority
- SG
- Singapore
- Prior art keywords
- fluid material
- filling
- filling apparatus
- material filling
- filling method
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Screen Printers (AREA)
- Sealing Devices (AREA)
- Basic Packing Technique (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001313120 | 2001-10-10 | ||
JP2002174069A JP3952872B2 (ja) | 2001-10-10 | 2002-06-14 | 流動状物質の充填装置および充填方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG107114A1 true SG107114A1 (en) | 2004-11-29 |
Family
ID=26623837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200205836A SG107114A1 (en) | 2001-10-10 | 2002-09-25 | Fluid material filling apparatus and related filling method |
Country Status (8)
Country | Link |
---|---|
US (1) | US6695020B2 (ja) |
EP (1) | EP1303172B1 (ja) |
JP (1) | JP3952872B2 (ja) |
KR (1) | KR100498778B1 (ja) |
CN (1) | CN1188020C (ja) |
MX (1) | MXPA02009975A (ja) |
SG (1) | SG107114A1 (ja) |
TW (1) | TW551007B (ja) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3900114B2 (ja) * | 2003-05-29 | 2007-04-04 | 株式会社デンソー | 流動状物質の充填方法および充填装置 |
FR2858255A1 (fr) * | 2003-07-30 | 2005-02-04 | Novatec | Procede de remplissage de zones situees en creux par entrainement de l'air et remplacement par du produit en mouvement |
FR2858253A1 (fr) * | 2003-07-30 | 2005-02-04 | Novatec | Procede et dispositif de remplissage par un produit visqueux de zones situees en creux ou interpistes sur un circut imprime |
FR2858254B1 (fr) * | 2003-07-30 | 2007-10-05 | Novatec | Procede et dispositif de remplissage par un produit visqueux de zones situees en creux ou interpistes sur un circuit imprime, et equipement utilisant un tel dispositif |
US6858466B1 (en) * | 2003-11-03 | 2005-02-22 | Hewlett-Packard Development Company, L.P. | System and a method for fluid filling wafer level packages |
US7449067B2 (en) * | 2003-11-03 | 2008-11-11 | International Business Machines Corporation | Method and apparatus for filling vias |
JP2005317899A (ja) * | 2004-03-29 | 2005-11-10 | Denso Corp | 充填物質のレベリング方法およびレベリング装置 |
JP2006167991A (ja) * | 2004-12-13 | 2006-06-29 | Denso Corp | スクリーン印刷装置及びその印刷方法 |
JP5061534B2 (ja) * | 2006-08-29 | 2012-10-31 | 株式会社日立プラントテクノロジー | スクリーン印刷装置とその印刷方法 |
US9314864B2 (en) * | 2007-07-09 | 2016-04-19 | International Business Machines Corporation | C4NP compliant solder fill head seals |
CN101374390B (zh) * | 2007-08-24 | 2011-03-30 | 富葵精密组件(深圳)有限公司 | 用于电路板导电胶填充的导气板及导电胶填充方法 |
JP5034836B2 (ja) * | 2007-09-28 | 2012-09-26 | 東京応化工業株式会社 | 充填装置 |
KR100961656B1 (ko) | 2008-01-14 | 2010-06-09 | 주식회사 고려반도체시스템 | 기판에 솔더를 주입하는 중에 캐비티의 생성을 방지하는용융솔더 주입장치 및 그 주입 방법. |
US7980445B2 (en) * | 2008-01-23 | 2011-07-19 | International Business Machines Corporation | Fill head for full-field solder coverage with a rotatable member |
TWI433627B (zh) * | 2010-03-08 | 2014-04-01 | Denso Corp | A method for manufacturing a multilayer circuit board in which a conductive material is inserted through a through hole, a conductive material filling device for a through hole, and a method of using the same |
JP2013171862A (ja) * | 2012-02-17 | 2013-09-02 | Tokyo Electron Ltd | 金属ペースト充填方法及び金属ペースト充填装置及びビアプラグ作製方法 |
JP6138026B2 (ja) | 2013-11-12 | 2017-05-31 | 日本メクトロン株式会社 | 導電ペーストの充填方法、および多層プリント配線板の製造方法 |
JP6201149B2 (ja) * | 2014-02-27 | 2017-09-27 | パナソニックIpマネジメント株式会社 | 部品実装ライン及び部品実装方法 |
WO2016002642A1 (ja) * | 2014-07-04 | 2016-01-07 | 日立造船株式会社 | 静電スクリーン印刷装置 |
CN104135830B (zh) * | 2014-08-08 | 2017-03-29 | 中国电子科技集团公司第二十九研究所 | 一种将金属浆料填入生瓷通孔的填充方法及装置 |
CN105034553B (zh) * | 2015-08-27 | 2018-03-27 | 昆山晟丰精密机械有限公司 | 一种树脂油墨真空塞孔印刷装置及其印刷方法 |
US20170266948A1 (en) * | 2016-03-16 | 2017-09-21 | Intel Corporation | Modular squeegee head apparatus for printing materials |
WO2020160545A1 (en) * | 2019-02-01 | 2020-08-06 | Averatek Corporation | Coating of nano-scaled cavities |
CN112188733A (zh) * | 2019-07-03 | 2021-01-05 | 深圳碳森科技有限公司 | 一种真空塞孔方法 |
CN111559524B (zh) * | 2020-06-18 | 2021-04-20 | 彗晶新材料科技(杭州)有限公司 | 一种高导热膏状材料真空灌装方法、装置及系统 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06234204A (ja) * | 1993-02-09 | 1994-08-23 | Matsushita Electric Ind Co Ltd | クリーム半田のスクリーン印刷装置 |
FR2803227A1 (fr) * | 2000-01-03 | 2001-07-06 | Novatec Sa Soc | Dispositif de remplissage collectif de cavites borgnes |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITVR940050A1 (it) * | 1994-05-27 | 1995-11-27 | Sovema Srl | Macchina spalmatrice di griglie di piombo per la realizzazione di placche per accumulatori elettrici. |
JPH08108519A (ja) * | 1994-10-08 | 1996-04-30 | Sony Corp | 印刷用スキージ |
US6231333B1 (en) * | 1995-08-24 | 2001-05-15 | International Business Machines Corporation | Apparatus and method for vacuum injection molding |
US5813444A (en) * | 1996-12-26 | 1998-09-29 | Cashion; Donald P. | Apparatus and method for filling a plurality of containers with particulate matter |
JPH11186731A (ja) | 1997-12-22 | 1999-07-09 | Nippon Avionics Co Ltd | ブラインドビアホールの形成方法および多層プリント配線板の製造方法 |
JP2000133937A (ja) | 1998-10-26 | 2000-05-12 | Ibiden Co Ltd | 有底ビアホールの穴埋め方法 |
JP2001111221A (ja) | 1999-10-06 | 2001-04-20 | Ngk Spark Plug Co Ltd | ビアを有するセラミックグリーンシート及びそれを含むセラミック多層配線基板の製造方法 |
FR2803228B1 (fr) * | 2000-01-03 | 2002-02-08 | Novatec Sa Soc | Dispositif de remplissage collectif de cavites borgnes |
US6506332B2 (en) * | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
-
2002
- 2002-06-14 JP JP2002174069A patent/JP3952872B2/ja not_active Expired - Fee Related
- 2002-09-23 EP EP02021126.4A patent/EP1303172B1/en not_active Expired - Fee Related
- 2002-09-25 SG SG200205836A patent/SG107114A1/en unknown
- 2002-09-27 TW TW091122379A patent/TW551007B/zh active
- 2002-10-09 US US10/267,714 patent/US6695020B2/en not_active Expired - Lifetime
- 2002-10-09 MX MXPA02009975A patent/MXPA02009975A/es active IP Right Grant
- 2002-10-10 CN CNB021475105A patent/CN1188020C/zh not_active Expired - Fee Related
- 2002-10-10 KR KR10-2002-0061682A patent/KR100498778B1/ko not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06234204A (ja) * | 1993-02-09 | 1994-08-23 | Matsushita Electric Ind Co Ltd | クリーム半田のスクリーン印刷装置 |
FR2803227A1 (fr) * | 2000-01-03 | 2001-07-06 | Novatec Sa Soc | Dispositif de remplissage collectif de cavites borgnes |
Also Published As
Publication number | Publication date |
---|---|
US6695020B2 (en) | 2004-02-24 |
JP3952872B2 (ja) | 2007-08-01 |
EP1303172A3 (en) | 2004-04-07 |
KR20030030943A (ko) | 2003-04-18 |
EP1303172B1 (en) | 2015-07-08 |
MXPA02009975A (es) | 2004-10-15 |
JP2003182023A (ja) | 2003-07-03 |
EP1303172A2 (en) | 2003-04-16 |
KR100498778B1 (ko) | 2005-07-01 |
TW551007B (en) | 2003-09-01 |
CN1188020C (zh) | 2005-02-02 |
CN1411331A (zh) | 2003-04-16 |
US20030066572A1 (en) | 2003-04-10 |
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