SG10202112738PA - Substrate with multilayer reflective film, reflective mask blank, reflective mask, and method of manufacturing semiconductor device - Google Patents

Substrate with multilayer reflective film, reflective mask blank, reflective mask, and method of manufacturing semiconductor device

Info

Publication number
SG10202112738PA
SG10202112738PA SG10202112738PA SG10202112738PA SG10202112738PA SG 10202112738P A SG10202112738P A SG 10202112738PA SG 10202112738P A SG10202112738P A SG 10202112738PA SG 10202112738P A SG10202112738P A SG 10202112738PA SG 10202112738P A SG10202112738P A SG 10202112738PA
Authority
SG
Singapore
Prior art keywords
reflective mask
reflective
substrate
semiconductor device
manufacturing semiconductor
Prior art date
Application number
SG10202112738PA
Other languages
English (en)
Inventor
Hirofumi Kozakai
Takahiro Onoue
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of SG10202112738PA publication Critical patent/SG10202112738PA/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • G03F1/24Reflection masks; Preparation thereof
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/08Mirrors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/52Reflectors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54Absorbers, e.g. of opaque materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54Absorbers, e.g. of opaque materials
    • G03F1/58Absorbers, e.g. of opaque materials having two or more different absorber layers, e.g. stacked multilayer absorbers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0332Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their composition, e.g. multilayer masks, materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Physical Vapour Deposition (AREA)
SG10202112738PA 2017-06-21 2018-06-14 Substrate with multilayer reflective film, reflective mask blank, reflective mask, and method of manufacturing semiconductor device SG10202112738PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017121485 2017-06-21

Publications (1)

Publication Number Publication Date
SG10202112738PA true SG10202112738PA (en) 2021-12-30

Family

ID=64735657

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10202112738PA SG10202112738PA (en) 2017-06-21 2018-06-14 Substrate with multilayer reflective film, reflective mask blank, reflective mask, and method of manufacturing semiconductor device
SG11201911415VA SG11201911415VA (en) 2017-06-21 2018-06-14 Substrate with multilayer reflective film, reflective mask blank, reflective mask, and method of manufacturing semiconductor device

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201911415VA SG11201911415VA (en) 2017-06-21 2018-06-14 Substrate with multilayer reflective film, reflective mask blank, reflective mask, and method of manufacturing semiconductor device

Country Status (6)

Country Link
US (1) US11454878B2 (fr)
JP (2) JP7118962B2 (fr)
KR (2) KR20240046292A (fr)
SG (2) SG10202112738PA (fr)
TW (2) TW202309649A (fr)
WO (1) WO2018235721A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7484826B2 (ja) 2021-06-18 2024-05-16 信越化学工業株式会社 反射型マスクブランク、及び反射型マスクの製造方法
US20230032950A1 (en) * 2021-07-30 2023-02-02 Taiwan Semiconductor Manufacturing Company, Ltd. Euv photo masks and manufacturing method thereof

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6110607A (en) 1998-02-20 2000-08-29 The Regents Of The University Of California High reflectance-low stress Mo-Si multilayer reflective coatings
JP2004331998A (ja) * 2003-04-30 2004-11-25 Nikon Corp 多層膜成膜方法、反射鏡及び露光装置
ATE538491T1 (de) * 2003-10-15 2012-01-15 Nikon Corp Mehrschichtiger filmreflexionsspiegel, herstellungsverfahren für einen mehrschichtigen filmreflexionsspiegel und belichtungssystem
JP2005250187A (ja) * 2004-03-05 2005-09-15 Nikon Corp 多層膜ミラー及びeuv露光装置
KR100699858B1 (ko) * 2005-08-03 2007-03-27 삼성전자주식회사 극자외선 리소그래피용 반사 디바이스 및 그 제조 방법 및이를 적용한 극자외선 리소그래피용 마스크, 프로젝션광학계 및 리소그래피 장치
US7504185B2 (en) 2005-10-03 2009-03-17 Asahi Glass Company, Limited Method for depositing multi-layer film of mask blank for EUV lithography and method for producing mask blank for EUV lithography
JP5233321B2 (ja) 2008-02-27 2013-07-10 凸版印刷株式会社 極端紫外線露光用マスクブランク、極端紫外線露光用マスク、極端紫外線露光用マスクの製造方法及び極端紫外線露光用マスクを用いたパターン転写方法
JP5616265B2 (ja) * 2011-03-25 2014-10-29 Hoya株式会社 薄膜の成膜方法、マスクブランクの製造方法及び転写用マスクの製造方法
JP6460617B2 (ja) 2012-02-10 2019-01-30 Hoya株式会社 反射型マスクブランク、反射型マスクの製造方法、及び反射型マスクブランクの製造方法
US9274411B2 (en) * 2012-06-05 2016-03-01 SK Hynix Inc. Reflection type blank masks, methods of fabricating the same, and methods of fabricating reflection type photo masks using the same
JP2014229825A (ja) * 2013-05-24 2014-12-08 旭硝子株式会社 Euvリソグラフィ用反射型マスクブランクの製造方法および、該マスクブランク用の反射層付基板の製造方法
WO2015037564A1 (fr) * 2013-09-11 2015-03-19 Hoya株式会社 Substrat ayant un film réfléchissant multicouche, ébauche de masque réfléchissant pour lithographie euv, masque réfléchissant pour lithographie euv, procédé de fabrication de masque réfléchissant pour lithographie euv, et procédé de fabrication de dispositif à semi-conducteurs
US9798050B2 (en) 2013-09-27 2017-10-24 Hoya Corporation Substrate with multilayer reflective film, mask blank, transfer mask and method of manufacturing semiconductor device
US10347485B2 (en) * 2014-09-17 2019-07-09 Hoya Corporation Reflective mask blank, method for manufacturing same, reflective mask, method for manufacturing same, and method for manufacturing semiconductor device
JP2017116931A (ja) * 2015-12-17 2017-06-29 Hoya株式会社 多層反射膜付き基板、反射型マスクブランク、反射型マスク及び半導体装置の製造方法
CN109643056B (zh) * 2016-08-26 2022-05-03 Hoya株式会社 掩模坯料、相移掩模、相移掩模的制造方法及半导体器件的制造方法

Also Published As

Publication number Publication date
KR20200018428A (ko) 2020-02-19
KR102653352B1 (ko) 2024-04-02
TWI784012B (zh) 2022-11-21
KR20240046292A (ko) 2024-04-08
TW201905580A (zh) 2019-02-01
JPWO2018235721A1 (ja) 2020-04-23
JP2022159362A (ja) 2022-10-17
SG11201911415VA (en) 2020-01-30
JP7118962B2 (ja) 2022-08-16
US20210247688A1 (en) 2021-08-12
WO2018235721A1 (fr) 2018-12-27
US11454878B2 (en) 2022-09-27
JP7368564B2 (ja) 2023-10-24
TW202309649A (zh) 2023-03-01

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