SG10202002515QA - Substrate with a multilayer reflective film, reflective mask blank, reflective mask, and semiconductor device manufacturing method - Google Patents

Substrate with a multilayer reflective film, reflective mask blank, reflective mask, and semiconductor device manufacturing method

Info

Publication number
SG10202002515QA
SG10202002515QA SG10202002515QA SG10202002515QA SG10202002515QA SG 10202002515Q A SG10202002515Q A SG 10202002515QA SG 10202002515Q A SG10202002515Q A SG 10202002515QA SG 10202002515Q A SG10202002515Q A SG 10202002515QA SG 10202002515Q A SG10202002515Q A SG 10202002515QA
Authority
SG
Singapore
Prior art keywords
reflective mask
reflective
substrate
semiconductor device
device manufacturing
Prior art date
Application number
SG10202002515QA
Inventor
Nakagawa Masanori
Kozakai Hirofumi
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of SG10202002515QA publication Critical patent/SG10202002515QA/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84Inspecting
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/52Reflectors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • G03F1/24Reflection masks; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/48Protective coatings
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54Absorbers, e.g. of opaque materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7095Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
    • G03F7/70958Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
    • GPHYSICS
    • G21NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21KTECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K1/00Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
    • G21K1/06Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
    • G21K1/062Devices having a multilayer structure
    • GPHYSICS
    • G21NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21KTECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K2201/00Arrangements for handling radiation or particles
    • G21K2201/06Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
    • G21K2201/067Construction details

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
SG10202002515QA 2019-03-27 2020-03-19 Substrate with a multilayer reflective film, reflective mask blank, reflective mask, and semiconductor device manufacturing method SG10202002515QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019061658 2019-03-27
JP2020042971A JP7401356B2 (en) 2019-03-27 2020-03-12 Substrate with multilayer reflective film, reflective mask blank, reflective mask, and semiconductor device manufacturing method

Publications (1)

Publication Number Publication Date
SG10202002515QA true SG10202002515QA (en) 2020-10-29

Family

ID=72716153

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202002515QA SG10202002515QA (en) 2019-03-27 2020-03-19 Substrate with a multilayer reflective film, reflective mask blank, reflective mask, and semiconductor device manufacturing method

Country Status (6)

Country Link
US (2) US11256167B2 (en)
JP (2) JP7401356B2 (en)
KR (1) KR20200115191A (en)
CN (1) CN118567174A (en)
SG (1) SG10202002515QA (en)
TW (1) TWI827823B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021060253A1 (en) * 2019-09-26 2021-04-01
US11852965B2 (en) 2020-10-30 2023-12-26 Taiwan Semiconductor Manufacturing Co., Ltd. Extreme ultraviolet mask with tantalum base alloy absorber
CN113573458B (en) * 2021-06-11 2024-06-25 中科超睿(青岛)技术有限公司 Nano gradient neutron target and preparation method thereof
US11762278B2 (en) 2021-06-16 2023-09-19 Applied Materials, Inc. Multilayer extreme ultraviolet reflectors
JP7484826B2 (en) * 2021-06-18 2024-05-16 信越化学工業株式会社 Reflective mask blank and method for manufacturing a reflective mask
JP2023053673A (en) * 2021-10-01 2023-04-13 信越化学工業株式会社 Substrate with film for reflective mask blank, reflective mask blank, and method for manufacturing reflective mask

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5310603A (en) 1986-10-01 1994-05-10 Canon Kabushiki Kaisha Multi-layer reflection mirror for soft X-ray to vacuum ultraviolet ray
JPH0797159B2 (en) 1986-10-01 1995-10-18 キヤノン株式会社 Multi-layer mirror for soft X-ray / VUV
JPH0816720B2 (en) 1992-04-21 1996-02-21 日本航空電子工業株式会社 Soft X-ray multilayer mirror
JP5067483B2 (en) 2008-06-19 2012-11-07 旭硝子株式会社 Reflective mask blank for EUV lithography
DE102008042212A1 (en) 2008-09-19 2010-04-01 Carl Zeiss Smt Ag Reflective optical element and method for its production
JP5419612B2 (en) * 2008-10-23 2014-02-19 Hoya株式会社 Mask blank substrate manufacturing method, reflective mask blank manufacturing method, and reflective mask manufacturing method
US9612521B2 (en) 2013-03-12 2017-04-04 Applied Materials, Inc. Amorphous layer extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor
US9618836B2 (en) * 2014-04-22 2017-04-11 Asahi Glass Company, Limited Reflective mask blank for EUV lithography, substrate with funtion film for the mask blank, and methods for their production
US9690016B2 (en) * 2014-07-11 2017-06-27 Applied Materials, Inc. Extreme ultraviolet reflective element with amorphous layers and method of manufacturing thereof
JP6651314B2 (en) 2014-12-26 2020-02-19 Hoya株式会社 Reflective mask blank, reflective mask and method of manufacturing the same, and method of manufacturing semiconductor device
JP6297512B2 (en) 2015-02-09 2018-03-20 Hoya株式会社 Manufacturing method of mask blank substrate, manufacturing method of substrate with multilayer film, manufacturing method of mask blank, and manufacturing method of transfer mask
JP7006078B2 (en) * 2017-08-10 2022-01-24 Agc株式会社 Reflective mask blank, and reflective mask

Also Published As

Publication number Publication date
US20220137501A1 (en) 2022-05-05
TWI827823B (en) 2024-01-01
CN118567174A (en) 2024-08-30
US11256167B2 (en) 2022-02-22
JP7401356B2 (en) 2023-12-19
JP2024023584A (en) 2024-02-21
TW202105042A (en) 2021-02-01
JP2020166249A (en) 2020-10-08
KR20200115191A (en) 2020-10-07
TW202411771A (en) 2024-03-16
US11650494B2 (en) 2023-05-16
US20200310244A1 (en) 2020-10-01

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