SG11202110115VA - Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device - Google Patents

Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device

Info

Publication number
SG11202110115VA
SG11202110115VA SG11202110115VA SG11202110115VA SG11202110115VA SG 11202110115V A SG11202110115V A SG 11202110115VA SG 11202110115V A SG11202110115V A SG 11202110115VA SG 11202110115V A SG11202110115V A SG 11202110115VA SG 11202110115V A SG11202110115V A SG 11202110115VA
Authority
SG
Singapore
Prior art keywords
manufacturing
mask
semiconductor device
mask blank
manufacturing semiconductor
Prior art date
Application number
SG11202110115VA
Inventor
Hiroaki Shishido
Ryo Ohkubo
Osamu Nozawa
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of SG11202110115VA publication Critical patent/SG11202110115VA/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/32Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/227Measuring photoelectric effect, e.g. photoelectron emission microscopy [PEEM]
    • G01N23/2273Measuring photoelectron spectrum, e.g. electron spectroscopy for chemical analysis [ESCA] or X-ray photoelectron spectroscopy [XPS]
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54Absorbers, e.g. of opaque materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/80Etching
SG11202110115VA 2019-03-18 2020-02-20 Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device SG11202110115VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019050514A JP7313166B2 (en) 2019-03-18 2019-03-18 Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device
PCT/JP2020/006732 WO2020189168A1 (en) 2019-03-18 2020-02-20 Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device

Publications (1)

Publication Number Publication Date
SG11202110115VA true SG11202110115VA (en) 2021-10-28

Family

ID=72520242

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202110115VA SG11202110115VA (en) 2019-03-18 2020-02-20 Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device

Country Status (7)

Country Link
US (1) US20220214608A1 (en)
JP (2) JP7313166B2 (en)
KR (1) KR20210136114A (en)
CN (1) CN113614637A (en)
SG (1) SG11202110115VA (en)
TW (1) TW202040258A (en)
WO (1) WO2020189168A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102583075B1 (en) * 2021-01-27 2023-09-27 주식회사 에스앤에스텍 Phase Shift Blankmask and Photomask for EUV lithography
JP7280296B2 (en) * 2021-02-03 2023-05-23 アルバック成膜株式会社 Mask blanks and photomasks
CN115876823B (en) * 2023-01-19 2023-07-14 合肥晶合集成电路股份有限公司 Film defect detection method, film defect detection device and detection system

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040185674A1 (en) * 2003-03-17 2004-09-23 Applied Materials, Inc. Nitrogen-free hard mask over low K dielectric
TWI259329B (en) * 2003-04-09 2006-08-01 Hoya Corp Method of manufacturing a photomask, and photomask blank
KR101485754B1 (en) * 2008-09-26 2015-01-26 주식회사 에스앤에스텍 Blank mask for euv and photomask manufactured thereof
JP6100096B2 (en) * 2013-05-29 2017-03-22 Hoya株式会社 Mask blank, phase shift mask, manufacturing method thereof, and manufacturing method of semiconductor device
KR102390253B1 (en) * 2013-01-15 2022-04-22 호야 가부시키가이샤 Mask blank, phase-shift mask, and method for manufacturing semiconductor device
JP6258151B2 (en) * 2013-09-25 2018-01-10 信越化学工業株式会社 Photomask blank and manufacturing method thereof
KR101567057B1 (en) * 2013-11-15 2015-11-09 주식회사 에스앤에스텍 Blankmask for Extreme Ultra-Violet Lithography and Photomask using the same
KR20160002332A (en) * 2014-06-30 2016-01-07 주식회사 에스앤에스텍 Blankmask for Extreme Ultra-Violet Lithography and Photomask using the same
WO2016140044A1 (en) * 2015-03-04 2016-09-09 信越化学工業株式会社 Photomask blank, method for manufacturing photomask, and mask pattern formation method
JP6601245B2 (en) * 2015-03-04 2019-11-06 信越化学工業株式会社 Photomask blank, photomask manufacturing method, and mask pattern forming method
TWI684822B (en) * 2015-09-30 2020-02-11 日商Hoya股份有限公司 Blank mask, phase shift mask and method for manufacturing semiconductor element
SG10201908855RA (en) 2015-11-06 2019-10-30 Hoya Corp Mask blank, method for manufacturing phase shift mask, and method for manufacturing semiconductor device
US20190040516A1 (en) * 2016-02-15 2019-02-07 Hoya Corporation Mask blank, method for manufacturing phase shift mask, and method for manufacturing semiconductor device
JP6698438B2 (en) * 2016-06-17 2020-05-27 Hoya株式会社 Mask blank, transfer mask, mask blank manufacturing method, transfer mask manufacturing method, and semiconductor device manufacturing method
JP2017227824A (en) * 2016-06-24 2017-12-28 Hoya株式会社 Mask blank, manufacturing method of transfer mask, and manufacturing method of semiconductor device
JP6900873B2 (en) * 2016-12-26 2021-07-07 信越化学工業株式会社 Photomask blank and its manufacturing method
KR102429244B1 (en) * 2017-02-27 2022-08-05 호야 가부시키가이샤 Mask blank and manufacturing method of imprint mold
JP6791031B2 (en) * 2017-06-13 2020-11-25 信越化学工業株式会社 Photomask blank and its manufacturing method

Also Published As

Publication number Publication date
TW202040258A (en) 2020-11-01
KR20210136114A (en) 2021-11-16
WO2020189168A1 (en) 2020-09-24
CN113614637A (en) 2021-11-05
JP2020154054A (en) 2020-09-24
JP2023145473A (en) 2023-10-11
JP7313166B2 (en) 2023-07-24
US20220214608A1 (en) 2022-07-07

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