SG11202001426UA - A Compound Semiconductor Substrate, A Pellicle Film, And A Method For Manufacturing A Compound Semiconductor Substrate - Google Patents
A Compound Semiconductor Substrate, A Pellicle Film, And A Method For Manufacturing A Compound Semiconductor SubstrateInfo
- Publication number
- SG11202001426UA SG11202001426UA SG11202001426UA SG11202001426UA SG11202001426UA SG 11202001426U A SG11202001426U A SG 11202001426UA SG 11202001426U A SG11202001426U A SG 11202001426UA SG 11202001426U A SG11202001426U A SG 11202001426UA SG 11202001426U A SG11202001426U A SG 11202001426UA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor substrate
- compound semiconductor
- manufacturing
- pellicle film
- pellicle
- Prior art date
Links
- 150000001875 compounds Chemical class 0.000 title 2
- 239000004065 semiconductor Substances 0.000 title 2
- 239000000758 substrate Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02441—Group 14 semiconducting materials
- H01L21/02447—Silicon carbide
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/36—Carbides
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- H01L21/02167—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon carbide not containing oxygen, e.g. SiC, SiC:H or silicon carbonitrides
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
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- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/04—Pattern deposit, e.g. by using masks
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- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
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- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
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- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
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Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP2016030235 | 2016-02-19 | ||
JP2016113656A JP6753703B2 (en) | 2016-02-19 | 2016-06-07 | Method for manufacturing compound semiconductor substrate, pellicle film, and compound semiconductor substrate |
JP2017008115A JP6825923B2 (en) | 2017-01-20 | 2017-01-20 | Method for manufacturing compound semiconductor substrate, pellicle film, and compound semiconductor substrate |
PCT/JP2017/004988 WO2017141835A1 (en) | 2016-02-19 | 2017-02-10 | Compound semiconductor substrate, pellicle film, and method for manufacturing compound semiconductor substrate |
Publications (1)
Publication Number | Publication Date |
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SG11202001426UA true SG11202001426UA (en) | 2020-03-30 |
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Application Number | Title | Priority Date | Filing Date |
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SG11202001426UA SG11202001426UA (en) | 2016-02-19 | 2017-02-10 | A Compound Semiconductor Substrate, A Pellicle Film, And A Method For Manufacturing A Compound Semiconductor Substrate |
Country Status (4)
Country | Link |
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US (1) | US20200152455A1 (en) |
EP (1) | EP3418424A4 (en) |
SG (1) | SG11202001426UA (en) |
TW (1) | TWI721107B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017141835A1 (en) * | 2016-02-19 | 2017-08-24 | エア・ウォーター株式会社 | Compound semiconductor substrate, pellicle film, and method for manufacturing compound semiconductor substrate |
JP7248410B2 (en) * | 2018-11-01 | 2023-03-29 | エア・ウォーター株式会社 | Compound semiconductor device, compound semiconductor substrate, and method for manufacturing compound semiconductor device |
NL2025186B1 (en) * | 2019-04-12 | 2021-02-23 | Asml Netherlands Bv | Pellicle for euv lithography |
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US4735877A (en) * | 1985-10-07 | 1988-04-05 | Canon Kabushiki Kaisha | Lithographic mask structure and lithographic process |
JPH09310170A (en) * | 1996-05-21 | 1997-12-02 | Hoya Corp | Silicon carbide thin coating structural body and its production |
US5809103A (en) * | 1996-12-20 | 1998-09-15 | Massachusetts Institute Of Technology | X-ray lithography masking |
JP4011687B2 (en) * | 1997-10-01 | 2007-11-21 | キヤノン株式会社 | Mask structure, exposure apparatus using the mask structure, and semiconductor device manufacturing method using the mask structure |
JP2000299266A (en) * | 1999-04-12 | 2000-10-24 | Canon Inc | X-ray mask and preparation thereof |
US6180292B1 (en) * | 1999-06-18 | 2001-01-30 | International Business Machines Corporation | Structure and manufacture of X-ray mask pellicle with washer-shaped member |
US6593035B1 (en) * | 2001-01-26 | 2003-07-15 | Advanced Micro Devices, Inc. | Pellicle for use in small wavelength lithography and a method for making such a pellicle using polymer films |
KR101707763B1 (en) * | 2013-05-24 | 2017-02-16 | 미쯔이가가꾸가부시끼가이샤 | Pellicle and euv exposure device comprising same |
JP6450086B2 (en) * | 2014-04-15 | 2019-01-09 | エア・ウォーター株式会社 | Method for manufacturing compound semiconductor substrate |
JP6148796B2 (en) * | 2014-05-27 | 2017-06-14 | 三井化学株式会社 | Pellicle mount device |
WO2017024048A1 (en) * | 2015-08-03 | 2017-02-09 | UHV Technologies, Inc. | X-ray window |
US9864270B2 (en) * | 2016-01-15 | 2018-01-09 | Taiwan Semiconductor Manufacturing Company Ltd. | Pellicle and method for manufacturing the same |
WO2017141835A1 (en) * | 2016-02-19 | 2017-08-24 | エア・ウォーター株式会社 | Compound semiconductor substrate, pellicle film, and method for manufacturing compound semiconductor substrate |
JP6753705B2 (en) * | 2016-06-10 | 2020-09-09 | エア・ウォーター株式会社 | Substrate manufacturing method |
JP6944768B2 (en) * | 2016-08-29 | 2021-10-06 | エア・ウォーター株式会社 | How to make a pellicle |
US10162258B2 (en) * | 2016-12-15 | 2018-12-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Pellicle fabrication methods and structures thereof |
JP6787851B2 (en) * | 2017-08-08 | 2020-11-18 | エア・ウォーター株式会社 | Pellicle and method of manufacturing pellicle |
WO2019142556A1 (en) * | 2018-01-17 | 2019-07-25 | Sppテクノロジーズ株式会社 | Wide-gap semiconductor substrate, apparatus for manufacturing wide-gap semiconductor substrate, and method for manufacturing wide-gap semiconductor substrate |
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- 2017-02-10 SG SG11202001426UA patent/SG11202001426UA/en unknown
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EP3418424A1 (en) | 2018-12-26 |
KR20180118681A (en) | 2018-10-31 |
US20200152455A1 (en) | 2020-05-14 |
TW201739948A (en) | 2017-11-16 |
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