SG10201405419XA - Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition - Google Patents

Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition

Info

Publication number
SG10201405419XA
SG10201405419XA SG10201405419XA SG10201405419XA SG10201405419XA SG 10201405419X A SG10201405419X A SG 10201405419XA SG 10201405419X A SG10201405419X A SG 10201405419XA SG 10201405419X A SG10201405419X A SG 10201405419XA SG 10201405419X A SG10201405419X A SG 10201405419XA
Authority
SG
Singapore
Prior art keywords
copper metal
metal pattern
heat conduction
liquid composition
bonding material
Prior art date
Application number
SG10201405419XA
Other languages
English (en)
Inventor
Hideo Nakako
Kazunori Yamamoto
Yasushi Kumashiro
Shunya Yokosawa
Katsuyuki Masuda
Yoshinori Ejiri
Maki Inada
Kyoko Kuroda
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG10201405419XA publication Critical patent/SG10201405419XA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B22F9/26—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions using gaseous reductors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/02—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using non-aqueous solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16—Metallic particles coated with a non-metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C20/00—Chemical coating by decomposition of either solid compounds or suspensions of the coating forming compounds, without leaving reaction products of surface material in the coating
    • C23C20/02—Coating with metallic material
    • C23C20/04—Coating with metallic material with metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2201/00—Treatment under specific atmosphere
    • B22F2201/01—Reducing atmosphere
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2302/00—Metal Compound, non-Metallic compound or non-metal composition of the powder or its coating
    • B22F2302/25—Oxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/20—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds
    • B22F9/22—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds using gaseous reductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
SG10201405419XA 2009-09-16 2010-09-13 Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition SG10201405419XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009215003 2009-09-16

Publications (1)

Publication Number Publication Date
SG10201405419XA true SG10201405419XA (en) 2014-10-30

Family

ID=43758620

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201405419XA SG10201405419XA (en) 2009-09-16 2010-09-13 Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition

Country Status (9)

Country Link
US (1) US9457406B2 (ja)
EP (1) EP2479314B1 (ja)
JP (1) JP5747821B2 (ja)
KR (2) KR20120093188A (ja)
CN (2) CN102498238B (ja)
MY (1) MY169953A (ja)
SG (1) SG10201405419XA (ja)
TW (1) TWI494471B (ja)
WO (1) WO2011034016A1 (ja)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100922810B1 (ko) * 2007-12-11 2009-10-21 주식회사 잉크테크 흑화 전도성 패턴의 제조방법
US8758638B2 (en) * 2011-05-10 2014-06-24 Applied Materials, Inc. Copper oxide removal techniques
EP2741300B1 (en) 2011-08-03 2019-04-17 Hitachi Chemical Company, Ltd. Composition set, conductive substrate and method of producing the same, and conductive adhesive composition
DE102011080620B4 (de) * 2011-08-08 2014-06-05 Siemens Aktiengesellschaft Verfahren für die Beschichtung eines Isolationsbauteils und Isolationsbauteil sowie elektrisch leitfähiges Heizkabel
TW201339279A (zh) * 2011-11-24 2013-10-01 Showa Denko Kk 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物
KR101353149B1 (ko) * 2011-12-27 2014-01-27 삼성전기주식회사 구리분말 제조방법
JP2013175560A (ja) * 2012-02-24 2013-09-05 Hitachi Chemical Co Ltd １４０℃以下で導体化して得られる金属銅膜、金属銅パターン及びそれらの製造方法
JP2013206722A (ja) * 2012-03-28 2013-10-07 Fujifilm Corp 液状組成物、金属銅膜、及び導体配線、並びに金属銅膜の製造方法
KR101525652B1 (ko) * 2012-05-04 2015-06-03 삼성전기주식회사 도전성 수지 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법
JP2014067617A (ja) * 2012-09-26 2014-04-17 Fujifilm Corp 導電膜の製造方法および導電膜形成用組成物
US9234112B2 (en) * 2013-06-05 2016-01-12 Korea Institute Of Machinery & Materials Metal precursor powder, method of manufacturing conductive metal layer or pattern, and device including the same
KR101582637B1 (ko) * 2013-07-29 2016-01-07 전북대학교산학협력단 CuO 나노입자와 그의 잉크 및 마이크로파 조사를 통한 CuO 박막으로부터 Cu박막으로 환원시키는 이들의 제조방법
JP2015099917A (ja) * 2013-10-16 2015-05-28 須賀　唯知 基板接合方法及び基板接合体
CN103731978A (zh) * 2013-12-31 2014-04-16 深圳市华星光电技术有限公司 印制电路板及使用该印制电路板的显示装置
JP6100178B2 (ja) * 2014-01-06 2017-03-22 四国化成工業株式会社 銅被膜形成剤および銅被膜の形成方法
US9190322B2 (en) * 2014-01-24 2015-11-17 Infineon Technologies Ag Method for producing a copper layer on a semiconductor body using a printing process
EP3158015B1 (en) * 2014-06-19 2019-12-04 National Research Council of Canada Molecular inks
EP3189915B1 (en) * 2014-08-13 2020-12-23 National Institute of Advanced Industrial Science and Technology Sintering device for metal material
JP6014792B1 (ja) * 2015-06-24 2016-10-25 株式会社メイコー 立体配線基板の製造方法、立体配線基板、立体配線基板用基材
US9741682B2 (en) * 2015-12-18 2017-08-22 International Business Machines Corporation Structures to enable a full intermetallic interconnect
US10793965B2 (en) 2016-08-29 2020-10-06 Board Of Trustees Of The University Of Arkansas Light-directed electrochemical patterning of copper structures
US9865527B1 (en) 2016-12-22 2018-01-09 Texas Instruments Incorporated Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation
US9941194B1 (en) 2017-02-21 2018-04-10 Texas Instruments Incorporated Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer
CN108788167B (zh) * 2018-06-21 2022-04-22 中国科学院理化技术研究所 一种去除液态金属氧化层及分散液态金属的方法
TWI716781B (zh) * 2018-12-04 2021-01-21 廣州力及熱管理科技有限公司 一種毛細結構元件

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4555414A (en) * 1983-04-15 1985-11-26 Polyonics Corporation Process for producing composite product having patterned metal layer
JPH03255695A (ja) * 1990-03-05 1991-11-14 Nec Corp 印刷配線板の製造方法
US5382333A (en) * 1990-07-30 1995-01-17 Mitsubishi Gas Chemical Company, Inc. Process for producing copper clad laminate
MY120077A (en) * 1998-06-26 2005-08-30 Ibiden Co Ltd Multilayer printed wiring board having a roughened inner conductor layer and production method thereof
US6207551B1 (en) * 1999-08-24 2001-03-27 Conexant Systems, Inc. Method and apparatus using formic acid vapor as reducing agent for copper wirebonding
EP1282911B1 (en) * 2000-05-15 2018-09-05 Asm International N.V. Process for producing integrated circuits
US6679951B2 (en) 2000-05-15 2004-01-20 Asm Intenational N.V. Metal anneal with oxidation prevention
ATE525730T1 (de) 2000-10-25 2011-10-15 Harima Chemicals Inc Elektroleitfähige metallpaste und verfahren zu ihrer herstellung
JP3373499B2 (ja) 2001-03-09 2003-02-04 富士通株式会社 半導体装置の製造方法及び半導体装置の製造装置
JP4205393B2 (ja) 2002-09-26 2009-01-07 ハリマ化成株式会社 微細配線パターンの形成方法
JP2004162110A (ja) 2002-11-12 2004-06-10 Mitsubishi Paper Mills Ltd 銅／アミン組成物
US7494580B2 (en) * 2003-07-28 2009-02-24 Phelps Dodge Corporation System and method for producing copper powder by electrowinning using the ferrous/ferric anode reaction
JPWO2005055305A1 (ja) 2003-12-04 2007-06-28 東京エレクトロン株式会社 半導体基板導電層表面の清浄化方法
JP4020111B2 (ja) * 2004-08-23 2007-12-12 日立化成工業株式会社 めっき層付き積層粒子の製造方法
JP2007087735A (ja) 2005-09-21 2007-04-05 Asahi Kasei Corp 金属酸化物分散体
US20070193026A1 (en) * 2006-02-23 2007-08-23 Chun Christine Dong Electron attachment assisted formation of electrical conductors
JP4936928B2 (ja) * 2006-05-16 2012-05-23 東京エレクトロン株式会社 成膜方法および成膜装置、ならびに記憶媒体
JP4948199B2 (ja) 2007-02-16 2012-06-06 旭化成イーマテリアルズ株式会社 積層体の製造方法
JP2008267400A (ja) 2007-04-16 2008-11-06 Nsk Ltd 玉軸受
WO2009054343A1 (ja) 2007-10-22 2009-04-30 Hitachi Chemical Company, Ltd. 銅配線パターン形成方法及びそれに用いる酸化銅粒子分散液
US8801971B2 (en) * 2007-12-18 2014-08-12 Hitachi Chemical Company, Ltd. Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution
JP2009196249A (ja) * 2008-02-22 2009-09-03 Asahi Kasei E-Materials Corp 積層体および積層体の製造方法
JP5131531B2 (ja) 2008-03-11 2013-01-30 富士ゼロックス株式会社 シート搬送装置及び画像形成装置

Also Published As

Publication number Publication date
US20120175147A1 (en) 2012-07-12
TW201116649A (en) 2011-05-16
EP2479314A1 (en) 2012-07-25
JPWO2011034016A1 (ja) 2013-02-14
MY169953A (en) 2019-06-19
WO2011034016A1 (ja) 2011-03-24
KR20160044062A (ko) 2016-04-22
TWI494471B (zh) 2015-08-01
EP2479314A4 (en) 2017-08-02
CN104475758A (zh) 2015-04-01
CN102498238A (zh) 2012-06-13
KR20120093188A (ko) 2012-08-22
KR101697055B1 (ko) 2017-01-16
US9457406B2 (en) 2016-10-04
EP2479314B1 (en) 2020-09-09
JP5747821B2 (ja) 2015-07-15
CN102498238B (zh) 2015-04-22
CN104475758B (zh) 2018-01-05

Similar Documents

Publication Publication Date Title
SG10201405419XA (en) Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition
EP2100328A4 (en) LÖTHÖCKER - / - UNDERHELLING METALURGY STRUCTURE FOR HIGH-TEMPERATURE APPLICATIONS
EP2319947A4 (en) COPPER ALLOY MATERIAL FOR ELECTRICAL AND ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME
EP2213404A4 (en) SOLDERING MATERIAL, METHOD FOR PRODUCING THE SOLDER MATERIAL, CONNECTING PRODUCT, METHOD FOR PRODUCING THE CONNECTING PRODUCT, POWER-SEMICONDUCTOR MODULE, AND METHOD FOR PRODUCING THE POWER-SEMICONDUCTOR MODULE
EP2333128A4 (en) COPPER ALLOY MATERIAL FOR ELECTRICAL AND ELECTRONIC COMPONENTS
EP2248921A4 (en) COPPER ALLOY MATERIAL FOR ELECTRICAL / ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING COPPER ALLOY MATERIAL
EP2407980A4 (en) METHOD FOR PRODUCING A CONDUCTIVE MATERIAL, CONDUCTIVE MATERIAL OBTAINED IN THIS PROCESS, ELECTRONIC UNIT WITH THE CONDUCTIVE MATERIAL AND LIGHT EMITTING DEVICE THEREWITH
EP2157199A4 (en) COPPER ALLOY MATERIAL AND MANUFACTURING METHOD THEREFOR
EP2436475A4 (en) WELDING MATERIAL, HEAT DISPOSAL BASIS THEREFOR AND ELECTRONIC DEVICE
EP2826589A4 (en) STRIPPER, WELDING COMPOSITION AND PROCESS FOR PRODUCING ELECTRONIC CIRCUIT SUPPORTING SUBSTRATE
EP2203574A4 (de) Hartlotfolie auf nickel-basis sowie verfahren zum hartlöten
EP2177305A4 (en) LEAD-FREE SOLDER IN CONTAINER FOR ELECTRONIC ON-BOARD CIRCUIT
EP2154257A4 (en) ALLOY BASED ON CU-NI-SI FOR ELECTRONIC MATERIAL
EP2305402A4 (en) SILVER-CONTAINING POWDER, MANUFACTURING METHOD, THIS USING CONDUCTIVE PASTE AND PLASTIC SUBSTRATE
EP2554693A4 (en) CU-NI-SI-CO COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD OF MANUFACTURING THEREOF
EP2182093A4 (en) METALLIC MATERIAL, METHOD FOR PRODUCING THE SAME, AND ELECTRIC-ELECTRONIC COMPONENT USING THE SAME
EP2405474A4 (en) BOSS, METHOD FOR FORMING BOSS AND METHOD FOR MOUNTING SUBSTRATE COMPRISING BOSS FORMED ON IT
EP2333127A4 (en) COPPER ALLOY MATERIAL FOR AN ELECTRICAL / ELECTRONIC COMPONENT
EP2578709A4 (en) CU-CO-SI COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCING THE SAME
EP2277657A4 (en) LEAD-FREE SOFT PLATE
EP2048253A4 (en) LEAD FREE COPPER ALLOY MATERIAL
EP2485257A4 (en) COOLING BODY FOR AN ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THEREOF
IL210241A0 (en) Metal-containing composition, process for producing electric contact structures on electronic components and also electronic component
EP2484787A4 (en) COPPER ALLOY ON CU-NI-SI-CO BASE FOR ELECTRONIC MATERIAL AND METHOD OF MANUFACTURING THEREOF
TWI348881B (en) Method for manufacturing wiring board with parts, method for manufacturing wiring board with solder humps, and wiring board