SE9701417D0 - A shielding housing and a method of producing a shielding housing - Google Patents

A shielding housing and a method of producing a shielding housing

Info

Publication number
SE9701417D0
SE9701417D0 SE9701417A SE9701417A SE9701417D0 SE 9701417 D0 SE9701417 D0 SE 9701417D0 SE 9701417 A SE9701417 A SE 9701417A SE 9701417 A SE9701417 A SE 9701417A SE 9701417 D0 SE9701417 D0 SE 9701417D0
Authority
SE
Sweden
Prior art keywords
shielding housing
shielding
component
layer
producing
Prior art date
Application number
SE9701417A
Other languages
English (en)
Other versions
SE9701417L (sv
SE511926C2 (sv
Inventor
Per Holmberg
Mats Larsson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9701417A priority Critical patent/SE511926C2/sv
Publication of SE9701417D0 publication Critical patent/SE9701417D0/sv
Priority to AU70920/98A priority patent/AU734134B2/en
Priority to EEP199900454A priority patent/EE03899B1/xx
Priority to DE69825434T priority patent/DE69825434T2/de
Priority to CNB988043092A priority patent/CN1147211C/zh
Priority to JP54381098A priority patent/JP3879936B2/ja
Priority to BR9808555-7A priority patent/BR9808555A/pt
Priority to EP98917871A priority patent/EP0976311B1/en
Priority to PCT/SE1998/000654 priority patent/WO1998047340A1/en
Priority to KR1019997009204A priority patent/KR20010006126A/ko
Priority to MYPI98001581A priority patent/MY120037A/en
Priority to US09/060,111 priority patent/US6178318B1/en
Publication of SE9701417L publication Critical patent/SE9701417L/sv
Publication of SE511926C2 publication Critical patent/SE511926C2/sv
Priority to HK00106788A priority patent/HK1027714A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/16153—Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1617—Cavity coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S174/00—Electricity: conductors and insulators
    • Y10S174/34—PCB in box or housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
SE9701417A 1997-04-16 1997-04-16 Skärmningshölje jämte förfarande för framställning och användning av ett skärmningshölje samt mobiltelefon med skärmningshölje SE511926C2 (sv)

Priority Applications (13)

Application Number Priority Date Filing Date Title
SE9701417A SE511926C2 (sv) 1997-04-16 1997-04-16 Skärmningshölje jämte förfarande för framställning och användning av ett skärmningshölje samt mobiltelefon med skärmningshölje
KR1019997009204A KR20010006126A (ko) 1997-04-16 1998-04-08 차폐 하우징 및 이의 제조방법
BR9808555-7A BR9808555A (pt) 1997-04-16 1998-04-08 Alojamento de blindagem elétrica, processo de sua produção, e, telefone celular.
PCT/SE1998/000654 WO1998047340A1 (en) 1997-04-16 1998-04-08 A shielding housing and a method of producing a shielding housing
DE69825434T DE69825434T2 (de) 1997-04-16 1998-04-08 Schirmgehäuse und dessen herstellungsverfahren
CNB988043092A CN1147211C (zh) 1997-04-16 1998-04-08 一种屏蔽外壳和一种用于制造屏蔽外壳的方法
JP54381098A JP3879936B2 (ja) 1997-04-16 1998-04-08 シールドハウジングおよびシールドハウジング製造方法
AU70920/98A AU734134B2 (en) 1997-04-16 1998-04-08 A shielding housing and a method of producing a shielding housing
EP98917871A EP0976311B1 (en) 1997-04-16 1998-04-08 A shielding housing and a method of producing a shielding housing
EEP199900454A EE03899B1 (et) 1997-04-16 1998-04-08 Varjestuskest ja varjestuskesta valmistamismeetod
MYPI98001581A MY120037A (en) 1997-04-16 1998-04-09 Shielding housing and a method of producing a shielding housing
US09/060,111 US6178318B1 (en) 1997-04-16 1998-04-15 Shielding housing and a method of producing a shielding housing
HK00106788A HK1027714A1 (en) 1997-04-16 2000-10-25 A shielding housing and a method of producing a shielding housing.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9701417A SE511926C2 (sv) 1997-04-16 1997-04-16 Skärmningshölje jämte förfarande för framställning och användning av ett skärmningshölje samt mobiltelefon med skärmningshölje

Publications (3)

Publication Number Publication Date
SE9701417D0 true SE9701417D0 (sv) 1997-04-16
SE9701417L SE9701417L (sv) 1998-10-17
SE511926C2 SE511926C2 (sv) 1999-12-20

Family

ID=20406594

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9701417A SE511926C2 (sv) 1997-04-16 1997-04-16 Skärmningshölje jämte förfarande för framställning och användning av ett skärmningshölje samt mobiltelefon med skärmningshölje

Country Status (13)

Country Link
US (1) US6178318B1 (sv)
EP (1) EP0976311B1 (sv)
JP (1) JP3879936B2 (sv)
KR (1) KR20010006126A (sv)
CN (1) CN1147211C (sv)
AU (1) AU734134B2 (sv)
BR (1) BR9808555A (sv)
DE (1) DE69825434T2 (sv)
EE (1) EE03899B1 (sv)
HK (1) HK1027714A1 (sv)
MY (1) MY120037A (sv)
SE (1) SE511926C2 (sv)
WO (1) WO1998047340A1 (sv)

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US6538196B1 (en) * 1999-10-28 2003-03-25 Ericsson Inc. Electric module structure formed with a polymer shrunk material
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US20080080160A1 (en) * 2005-12-16 2008-04-03 Laird Technologies, Inc. Emi shielding assemblies
US7262369B1 (en) 2006-03-09 2007-08-28 Laird Technologies, Inc. Combined board level EMI shielding and thermal management
US7355857B2 (en) 2006-02-07 2008-04-08 Methode Electronics, Inc. Heat sink gasket
US7623360B2 (en) 2006-03-09 2009-11-24 Laird Technologies, Inc. EMI shielding and thermal management assemblies including frames and covers with multi-position latching
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US8537543B2 (en) 2008-04-11 2013-09-17 Apple Inc. Portable electronic device housing structures
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DE102008051547A1 (de) * 2008-10-14 2010-04-15 Continental Automotive Gmbh Elektronisches Gerät mit Bechergehäuse und Verfahren zur Herstellung desselben
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Also Published As

Publication number Publication date
CN1252923A (zh) 2000-05-10
AU734134B2 (en) 2001-06-07
EP0976311B1 (en) 2004-08-04
SE9701417L (sv) 1998-10-17
EP0976311A1 (en) 2000-02-02
JP2001520802A (ja) 2001-10-30
MY120037A (en) 2005-08-30
DE69825434T2 (de) 2004-12-30
JP3879936B2 (ja) 2007-02-14
DE69825434D1 (de) 2004-09-09
SE511926C2 (sv) 1999-12-20
WO1998047340A1 (en) 1998-10-22
KR20010006126A (ko) 2001-01-26
EE9900454A (et) 2000-04-17
US6178318B1 (en) 2001-01-23
AU7092098A (en) 1998-11-11
CN1147211C (zh) 2004-04-21
HK1027714A1 (en) 2001-01-19
BR9808555A (pt) 2000-05-23
EE03899B1 (et) 2002-10-15

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