HK1027714A1 - A shielding housing and a method of producing a shielding housing. - Google Patents

A shielding housing and a method of producing a shielding housing.

Info

Publication number
HK1027714A1
HK1027714A1 HK00106788A HK00106788A HK1027714A1 HK 1027714 A1 HK1027714 A1 HK 1027714A1 HK 00106788 A HK00106788 A HK 00106788A HK 00106788 A HK00106788 A HK 00106788A HK 1027714 A1 HK1027714 A1 HK 1027714A1
Authority
HK
Hong Kong
Prior art keywords
shielding housing
producing
shielding
housing
Prior art date
Application number
HK00106788A
Other languages
English (en)
Inventor
Per Holmberg
Mats Larsson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of HK1027714A1 publication Critical patent/HK1027714A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/16153—Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1617—Cavity coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S174/00—Electricity: conductors and insulators
    • Y10S174/34—PCB in box or housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
HK00106788A 1997-04-16 2000-10-25 A shielding housing and a method of producing a shielding housing. HK1027714A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9701417A SE511926C2 (sv) 1997-04-16 1997-04-16 Skärmningshölje jämte förfarande för framställning och användning av ett skärmningshölje samt mobiltelefon med skärmningshölje
PCT/SE1998/000654 WO1998047340A1 (en) 1997-04-16 1998-04-08 A shielding housing and a method of producing a shielding housing

Publications (1)

Publication Number Publication Date
HK1027714A1 true HK1027714A1 (en) 2001-01-19

Family

ID=20406594

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00106788A HK1027714A1 (en) 1997-04-16 2000-10-25 A shielding housing and a method of producing a shielding housing.

Country Status (13)

Country Link
US (1) US6178318B1 (xx)
EP (1) EP0976311B1 (xx)
JP (1) JP3879936B2 (xx)
KR (1) KR20010006126A (xx)
CN (1) CN1147211C (xx)
AU (1) AU734134B2 (xx)
BR (1) BR9808555A (xx)
DE (1) DE69825434T2 (xx)
EE (1) EE03899B1 (xx)
HK (1) HK1027714A1 (xx)
MY (1) MY120037A (xx)
SE (1) SE511926C2 (xx)
WO (1) WO1998047340A1 (xx)

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US9345183B2 (en) * 2005-03-15 2016-05-17 Stealthdrive Canada Corp. EMI-shielding solutions for electronics enclosures using opposing three-dimensional shapes and channels formed in sheet metal
CN1972587B (zh) * 2005-11-25 2011-11-16 深圳富泰宏精密工业有限公司 电子装置的屏蔽构件及壳体组件
US7262369B1 (en) 2006-03-09 2007-08-28 Laird Technologies, Inc. Combined board level EMI shielding and thermal management
US20080080160A1 (en) * 2005-12-16 2008-04-03 Laird Technologies, Inc. Emi shielding assemblies
US7355857B2 (en) 2006-02-07 2008-04-08 Methode Electronics, Inc. Heat sink gasket
US7463496B2 (en) * 2006-03-09 2008-12-09 Laird Technologies, Inc. Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
US7623360B2 (en) 2006-03-09 2009-11-24 Laird Technologies, Inc. EMI shielding and thermal management assemblies including frames and covers with multi-position latching
US7317618B2 (en) * 2006-03-09 2008-01-08 Laird Technologies, Inc. Combined board level shielding and thermal management
WO2008062982A1 (en) * 2006-11-21 2008-05-29 Lg Innotek Co., Ltd Electromagnetic shielding device, radio frequency module having the same, and method of manufacturing the radio frequency module
TWM313957U (en) * 2007-01-03 2007-06-11 Chin-Fu Horng Anti- electromagnetic interference shielding apparatus
US20090116208A1 (en) * 2007-11-02 2009-05-07 Nokia Corporation Electronic device electrical shielding
US8537543B2 (en) 2008-04-11 2013-09-17 Apple Inc. Portable electronic device housing structures
JP5239556B2 (ja) * 2008-07-01 2013-07-17 富士通株式会社 成型品
US20100066026A1 (en) * 2008-09-15 2010-03-18 Motorola, Inc. Main seal system and method for use in an electronic device
DE102008051547A1 (de) * 2008-10-14 2010-04-15 Continental Automotive Gmbh Elektronisches Gerät mit Bechergehäuse und Verfahren zur Herstellung desselben
CN101800215B (zh) * 2009-02-11 2012-07-04 日月光半导体制造股份有限公司 无线通讯模组封装构造
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US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US20110255250A1 (en) * 2010-04-19 2011-10-20 Richard Hung Minh Dinh Printed circuit board components for electronic devices
JP5661423B2 (ja) * 2010-10-28 2015-01-28 株式会社デンソー レーダ装置
TWI404485B (zh) * 2010-12-02 2013-08-01 Quanta Comp Inc 電子裝置及電子裝置之組裝方法
US20130014983A1 (en) * 2011-07-14 2013-01-17 Texas Instruments Incorporated Device contactor with integrated rf shield
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WO2014102984A1 (ja) * 2012-12-27 2014-07-03 山一電機株式会社 リセプタクルアッセンブリー、および、トランシーバモジュールアッセンブリー
CN103260388A (zh) * 2013-04-24 2013-08-21 常州碳元科技发展有限公司 具有屏蔽罩功能的高导热石墨膜结构
DE102014012652A1 (de) * 2014-08-21 2016-02-25 Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Hallstadt Elektronische Baueinheit, insbesondere kapazitiver Näherungssensor für ein Fahrzeug
CN104159440B (zh) * 2014-08-28 2017-07-11 惠州Tcl移动通信有限公司 一种电子设备的屏蔽件
CN204652865U (zh) * 2014-12-11 2015-09-16 中兴通讯股份有限公司 一种射频屏蔽盒体
JP6418041B2 (ja) * 2015-04-06 2018-11-07 株式会社デンソー 電子制御装置
US10156870B2 (en) * 2016-01-29 2018-12-18 Google Llc Flexible electromagnetic interference (EMI) shield
US10446309B2 (en) 2016-04-20 2019-10-15 Vishay Dale Electronics, Llc Shielded inductor and method of manufacturing
CN106304822B (zh) * 2016-10-31 2019-06-11 宇龙计算机通信科技(深圳)有限公司 一种移动终端及其外壳
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Also Published As

Publication number Publication date
JP3879936B2 (ja) 2007-02-14
DE69825434T2 (de) 2004-12-30
CN1147211C (zh) 2004-04-21
AU7092098A (en) 1998-11-11
AU734134B2 (en) 2001-06-07
JP2001520802A (ja) 2001-10-30
MY120037A (en) 2005-08-30
US6178318B1 (en) 2001-01-23
SE511926C2 (sv) 1999-12-20
DE69825434D1 (de) 2004-09-09
CN1252923A (zh) 2000-05-10
BR9808555A (pt) 2000-05-23
SE9701417D0 (sv) 1997-04-16
EE9900454A (et) 2000-04-17
EE03899B1 (et) 2002-10-15
EP0976311A1 (en) 2000-02-02
EP0976311B1 (en) 2004-08-04
SE9701417L (sv) 1998-10-17
WO1998047340A1 (en) 1998-10-22
KR20010006126A (ko) 2001-01-26

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20150408