BR9808555A - Alojamento de blindagem elétrica, processo de sua produção, e, telefone celular. - Google Patents

Alojamento de blindagem elétrica, processo de sua produção, e, telefone celular.

Info

Publication number
BR9808555A
BR9808555A BR9808555-7A BR9808555A BR9808555A BR 9808555 A BR9808555 A BR 9808555A BR 9808555 A BR9808555 A BR 9808555A BR 9808555 A BR9808555 A BR 9808555A
Authority
BR
Brazil
Prior art keywords
cell phone
production process
shielding
electrical shielding
shielding housing
Prior art date
Application number
BR9808555-7A
Other languages
English (en)
Inventor
Per Holmberg
Mats Larsson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of BR9808555A publication Critical patent/BR9808555A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/16153—Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1617—Cavity coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S174/00—Electricity: conductors and insulators
    • Y10S174/34—PCB in box or housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

"ALOJAMENTO DE BLINDAGEM ELéTRICA, PROCESSO DE SUA PRODUçãO, E, TELEFONE CELULAR". Um alojamento de blindagem (11) para blindar eletricamente pelo menos um componente sobre um painel de circuito impresso (12), compreende uma camada (14) de um material de não-blindagem tendo pelo menos uma cavidade (15) para receber o dito pelo menos um componente. Uma gaxeta elástica (16) é prevista sobre a borda da pelo menos uma cavidade (15). Uma camada (17) de um material de blindagem elétrica cobre a gaxeta (16) assim como uma ou ambas as superfícies da camada (14) de um material de não blindagem. Em operação, o alojamento de blindagem (11) é pressionado com sua gaxeta (16) contra um condutor (13) localizado sobre o painel de circuito impresso (12) em torno do dito pelo menos um componente a ser blindado.
BR9808555-7A 1997-04-16 1998-04-08 Alojamento de blindagem elétrica, processo de sua produção, e, telefone celular. BR9808555A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9701417A SE511926C2 (sv) 1997-04-16 1997-04-16 Skärmningshölje jämte förfarande för framställning och användning av ett skärmningshölje samt mobiltelefon med skärmningshölje
PCT/SE1998/000654 WO1998047340A1 (en) 1997-04-16 1998-04-08 A shielding housing and a method of producing a shielding housing

Publications (1)

Publication Number Publication Date
BR9808555A true BR9808555A (pt) 2000-05-23

Family

ID=20406594

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9808555-7A BR9808555A (pt) 1997-04-16 1998-04-08 Alojamento de blindagem elétrica, processo de sua produção, e, telefone celular.

Country Status (13)

Country Link
US (1) US6178318B1 (pt)
EP (1) EP0976311B1 (pt)
JP (1) JP3879936B2 (pt)
KR (1) KR20010006126A (pt)
CN (1) CN1147211C (pt)
AU (1) AU734134B2 (pt)
BR (1) BR9808555A (pt)
DE (1) DE69825434T2 (pt)
EE (1) EE03899B1 (pt)
HK (1) HK1027714A1 (pt)
MY (1) MY120037A (pt)
SE (1) SE511926C2 (pt)
WO (1) WO1998047340A1 (pt)

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US20080080160A1 (en) * 2005-12-16 2008-04-03 Laird Technologies, Inc. Emi shielding assemblies
US7262369B1 (en) 2006-03-09 2007-08-28 Laird Technologies, Inc. Combined board level EMI shielding and thermal management
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Also Published As

Publication number Publication date
CN1252923A (zh) 2000-05-10
AU734134B2 (en) 2001-06-07
EP0976311B1 (en) 2004-08-04
SE9701417L (sv) 1998-10-17
EP0976311A1 (en) 2000-02-02
JP2001520802A (ja) 2001-10-30
MY120037A (en) 2005-08-30
DE69825434T2 (de) 2004-12-30
JP3879936B2 (ja) 2007-02-14
DE69825434D1 (de) 2004-09-09
SE511926C2 (sv) 1999-12-20
WO1998047340A1 (en) 1998-10-22
KR20010006126A (ko) 2001-01-26
EE9900454A (et) 2000-04-17
US6178318B1 (en) 2001-01-23
AU7092098A (en) 1998-11-11
CN1147211C (zh) 2004-04-21
SE9701417D0 (sv) 1997-04-16
HK1027714A1 (en) 2001-01-19
EE03899B1 (et) 2002-10-15

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 9A E 10A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO PUBLICADO NA RPI 1971 DE 14/10/2008.