SE9001766L - Saett vid tillverkning av flerlagermoensterkort - Google Patents

Saett vid tillverkning av flerlagermoensterkort

Info

Publication number
SE9001766L
SE9001766L SE9001766A SE9001766A SE9001766L SE 9001766 L SE9001766 L SE 9001766L SE 9001766 A SE9001766 A SE 9001766A SE 9001766 A SE9001766 A SE 9001766A SE 9001766 L SE9001766 L SE 9001766L
Authority
SE
Sweden
Prior art keywords
pct
layers
resin
metal
inner layers
Prior art date
Application number
SE9001766A
Other languages
English (en)
Other versions
SE9001766D0 (sv
SE465399B (sv
Inventor
J Masik
Original Assignee
Perstorp Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Perstorp Ab filed Critical Perstorp Ab
Priority to SE9001766A priority Critical patent/SE465399B/sv
Publication of SE9001766D0 publication Critical patent/SE9001766D0/sv
Priority to DE69113456T priority patent/DE69113456T2/de
Priority to JP91509617A priority patent/JPH05507388A/ja
Priority to AT91910236T priority patent/ATE128598T1/de
Priority to AU79706/91A priority patent/AU7970691A/en
Priority to US07/946,429 priority patent/US5336353A/en
Priority to PCT/SE1991/000270 priority patent/WO1991018491A1/en
Priority to EP91910236A priority patent/EP0528963B1/en
Publication of SE9001766L publication Critical patent/SE9001766L/sv
Publication of SE465399B publication Critical patent/SE465399B/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/102—Using microwaves, e.g. for curing ink patterns or adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
SE9001766A 1990-05-16 1990-05-16 Saett vid tillverkning av flerlagermoensterkort SE465399B (sv)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE9001766A SE465399B (sv) 1990-05-16 1990-05-16 Saett vid tillverkning av flerlagermoensterkort
DE69113456T DE69113456T2 (de) 1990-05-16 1991-04-17 Verfahren zur herstellung einer vielschichtleiterplatte.
JP91509617A JPH05507388A (ja) 1990-05-16 1991-04-17 多層プリント回路基板の製造方法
AT91910236T ATE128598T1 (de) 1990-05-16 1991-04-17 Verfahren zur herstellung einer vielschichtleiterplatte.
AU79706/91A AU7970691A (en) 1990-05-16 1991-04-17 Process for the production of a multilayer printed circuit board
US07/946,429 US5336353A (en) 1990-05-16 1991-04-17 Process for the production of a multilayer printed circuit board
PCT/SE1991/000270 WO1991018491A1 (en) 1990-05-16 1991-04-17 Process for the production of a multilayer printed circuit board
EP91910236A EP0528963B1 (en) 1990-05-16 1991-04-17 Process for the production of a multilayer printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9001766A SE465399B (sv) 1990-05-16 1990-05-16 Saett vid tillverkning av flerlagermoensterkort

Publications (3)

Publication Number Publication Date
SE9001766D0 SE9001766D0 (sv) 1990-05-16
SE9001766L true SE9001766L (sv) 1991-09-02
SE465399B SE465399B (sv) 1991-09-02

Family

ID=20379505

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9001766A SE465399B (sv) 1990-05-16 1990-05-16 Saett vid tillverkning av flerlagermoensterkort

Country Status (8)

Country Link
US (1) US5336353A (sv)
EP (1) EP0528963B1 (sv)
JP (1) JPH05507388A (sv)
AT (1) ATE128598T1 (sv)
AU (1) AU7970691A (sv)
DE (1) DE69113456T2 (sv)
SE (1) SE465399B (sv)
WO (1) WO1991018491A1 (sv)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMC960043A1 (it) * 1996-04-05 1997-10-05 So Ma Ci S Spa Sistema per mantenere bloccati i pannelli dei circuiti stampati multistrato durante la polimerizzazione dei fogli isolanti intermedi
DE19958644A1 (de) * 1999-12-06 2001-10-04 Schweizer Electronic Ag Verfahren und Vorrichtung zur Herstellung von Multilayern
US6682802B2 (en) 2000-12-14 2004-01-27 Intel Corporation Selective PCB stiffening with preferentially oriented fibers
EP1220590A1 (en) * 2000-12-22 2002-07-03 TAPEMATIC S.p.A. A process for making multilayered cards for printed circuits
JP2005026608A (ja) * 2003-07-02 2005-01-27 Tokyo Electron Ltd 接合方法および接合装置
CN112533400B (zh) * 2019-09-19 2022-04-15 宏启胜精密电子(秦皇岛)有限公司 电路板的制造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2917472C2 (de) * 1979-04-30 1986-10-16 Telefonbau Und Normalzeit Gmbh, 6000 Frankfurt Unverstiftet verpreßte Mehrlagenleiterplatte und Verfahren zu deren Herstellung
DE3240754A1 (de) * 1981-11-06 1983-05-19 Sumitomo Bakelite Co. Ltd., Tokyo Gedruckte schaltung mit mehreren schichten und verfahren zu deren herstellung
US4481533A (en) * 1981-11-27 1984-11-06 Lenkeit Industries, Inc. Method and apparatus for successively positioning sheets of material with precision for punching aligning holes in the sheets enabling the sheets to be used in the manufacture of composite circuit boards
DE3423181A1 (de) * 1984-06-22 1986-01-02 Dielektra GmbH, 5000 Köln Verfahren zur herstellung von vorlaminaten fuer mehrlagenleiterplatten
US4702785A (en) * 1985-06-24 1987-10-27 President Engineering Corporation Process for manufacturing multilayer PC boards
JPS62233211A (ja) * 1986-04-02 1987-10-13 Matsushita Electric Works Ltd 積層板の製造方法
JPH072392B2 (ja) * 1986-07-18 1995-01-18 日立化成工業株式会社 積層板
JPH0728127B2 (ja) * 1986-08-28 1995-03-29 東芝ケミカル株式会社 多層回路積層板の製造方法
JPH0298195A (ja) * 1988-10-04 1990-04-10 Mitsubishi Electric Corp 多層プリント基板の製造方法

Also Published As

Publication number Publication date
AU7970691A (en) 1991-12-10
DE69113456D1 (de) 1995-11-02
EP0528963B1 (en) 1995-09-27
ATE128598T1 (de) 1995-10-15
DE69113456T2 (de) 1996-04-04
WO1991018491A1 (en) 1991-11-28
SE9001766D0 (sv) 1990-05-16
EP0528963A1 (en) 1993-03-03
JPH05507388A (ja) 1993-10-21
SE465399B (sv) 1991-09-02
US5336353A (en) 1994-08-09

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