SE511139C2 - Plasmabearbetningsapparat med vridbara magneter - Google Patents

Plasmabearbetningsapparat med vridbara magneter

Info

Publication number
SE511139C2
SE511139C2 SE9704260A SE9704260A SE511139C2 SE 511139 C2 SE511139 C2 SE 511139C2 SE 9704260 A SE9704260 A SE 9704260A SE 9704260 A SE9704260 A SE 9704260A SE 511139 C2 SE511139 C2 SE 511139C2
Authority
SE
Sweden
Prior art keywords
permanent magnet
rotatable
plasma processing
magnetic
plasma
Prior art date
Application number
SE9704260A
Other languages
English (en)
Swedish (sv)
Other versions
SE9704260D0 (sv
SE9704260L (sv
Inventor
Hana Barankova
Ladislav Bardos
Original Assignee
Hana Barankova
Ladislav Bardos
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=20409052&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SE511139(C2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Publication of SE9704260D0 publication Critical patent/SE9704260D0/xx
Priority to SE9704260A priority Critical patent/SE511139C2/sv
Application filed by Hana Barankova, Ladislav Bardos filed Critical Hana Barankova
Priority to EP98954885A priority patent/EP1033068B2/en
Priority to DE69828904T priority patent/DE69828904T3/de
Priority to PCT/SE1998/001983 priority patent/WO1999027758A1/en
Priority to AU11820/99A priority patent/AU1182099A/en
Priority to US09/554,666 priority patent/US6351075B1/en
Priority to CZ20001853A priority patent/CZ298474B6/cs
Priority to JP2000522766A priority patent/JP4491132B2/ja
Publication of SE9704260L publication Critical patent/SE9704260L/xx
Publication of SE511139C2 publication Critical patent/SE511139C2/sv

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3266Magnetic control means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055Arc discharge

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
SE9704260A 1997-11-20 1997-11-20 Plasmabearbetningsapparat med vridbara magneter SE511139C2 (sv)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE9704260A SE511139C2 (sv) 1997-11-20 1997-11-20 Plasmabearbetningsapparat med vridbara magneter
JP2000522766A JP4491132B2 (ja) 1997-11-20 1998-11-03 プラズマ処理装置
EP98954885A EP1033068B2 (en) 1997-11-20 1998-11-03 Plasma processing apparatus having rotating magnets
CZ20001853A CZ298474B6 (cs) 1997-11-20 1998-11-03 Zarízení na zpracování plazmatem
DE69828904T DE69828904T3 (de) 1997-11-20 1998-11-03 Plasmabehandlungsgerät mit rotierenden magneten
PCT/SE1998/001983 WO1999027758A1 (en) 1997-11-20 1998-11-03 Plasma processing apparatus having rotating magnets
AU11820/99A AU1182099A (en) 1997-11-20 1998-11-03 Plasma processing apparatus having rotating magnets
US09/554,666 US6351075B1 (en) 1997-11-20 1998-11-03 Plasma processing apparatus having rotating magnets

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9704260A SE511139C2 (sv) 1997-11-20 1997-11-20 Plasmabearbetningsapparat med vridbara magneter

Publications (3)

Publication Number Publication Date
SE9704260D0 SE9704260D0 (sv) 1997-11-20
SE9704260L SE9704260L (sv) 1999-05-21
SE511139C2 true SE511139C2 (sv) 1999-08-09

Family

ID=20409052

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9704260A SE511139C2 (sv) 1997-11-20 1997-11-20 Plasmabearbetningsapparat med vridbara magneter

Country Status (8)

Country Link
US (1) US6351075B1 (ja)
EP (1) EP1033068B2 (ja)
JP (1) JP4491132B2 (ja)
AU (1) AU1182099A (ja)
CZ (1) CZ298474B6 (ja)
DE (1) DE69828904T3 (ja)
SE (1) SE511139C2 (ja)
WO (1) WO1999027758A1 (ja)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7067034B2 (en) * 2000-03-27 2006-06-27 Lam Research Corporation Method and apparatus for plasma forming inner magnetic bucket to control a volume of a plasma
CZ296094B6 (cs) * 2000-12-18 2006-01-11 Shm, S. R. O. Zarízení pro odparování materiálu k povlakování predmetu
SE525231C2 (sv) * 2001-06-14 2005-01-11 Chemfilt R & D Ab Förfarande och anordning för att alstra plasma
US6777885B2 (en) 2001-10-12 2004-08-17 Semiconductor Energy Laboratory Co., Ltd. Drive circuit, display device using the drive circuit and electronic apparatus using the display device
US6811657B2 (en) * 2003-01-27 2004-11-02 Micron Technology, Inc. Device for measuring the profile of a metal film sputter deposition target, and system and method employing same
US6864773B2 (en) * 2003-04-04 2005-03-08 Applied Materials, Inc. Variable field magnet apparatus
JP3508110B1 (ja) * 2003-04-25 2004-03-22 卓三 岩田 イオン化可能物質の活性化装置
JP2006024775A (ja) * 2004-07-08 2006-01-26 Tokyo Electron Ltd プラズマ処理装置、該装置の制御方法及び該方法を実行するプログラム
WO2006006637A1 (ja) 2004-07-09 2006-01-19 National Institute For Materials Science 磁束配置(バランス型/アンバランス型)を切換可能としたマグネトロンスパッタリング装置とこの装置を用いた無機質薄膜体材料の成膜方法、及びデユアル形式のマグネトロンスパッタリング装置とこの装置による低温成膜を可能とした無機質薄膜体材料の成膜方法
DE102005019101A1 (de) * 2005-04-25 2006-10-26 Steag Hama Tech Ag Verfahren und Vorrichtung zum Beschichten von Substraten
CN100460557C (zh) * 2005-09-28 2009-02-11 中芯国际集成电路制造(上海)有限公司 操作物理气相沉积工艺的方法与系统
CN101283114B (zh) * 2005-10-07 2012-04-18 国立大学法人东北大学 磁控溅射装置
JP5342240B2 (ja) * 2005-12-22 2013-11-13 テル・ソーラー・アクチェンゲゼルシャフト 少なくとも1つのスパッタコーティングされた基板を製造する方法およびスパッタソース
JP5078889B2 (ja) * 2006-06-08 2012-11-21 芝浦メカトロニクス株式会社 マグネトロンスパッタ用磁石装置、マグネトロンスパッタ装置及びマグネトロンスパッタ方法
US10043642B2 (en) * 2008-02-01 2018-08-07 Oerlikon Surface Solutions Ag, Pfäffikon Magnetron sputtering source and arrangement with adjustable secondary magnet arrangement
KR101009642B1 (ko) * 2008-07-09 2011-01-19 삼성모바일디스플레이주식회사 자화 방지용 마그네트론 부 이송 장치 및 이를 갖는마그네트론 스퍼터링 설비
US8698400B2 (en) * 2009-04-28 2014-04-15 Leybold Optics Gmbh Method for producing a plasma beam and plasma source
US9545360B2 (en) 2009-05-13 2017-01-17 Sio2 Medical Products, Inc. Saccharide protective coating for pharmaceutical package
DK2251454T3 (da) 2009-05-13 2014-10-13 Sio2 Medical Products Inc Coating og inspektion af beholder
US9458536B2 (en) 2009-07-02 2016-10-04 Sio2 Medical Products, Inc. PECVD coating methods for capped syringes, cartridges and other articles
WO2011029096A2 (en) * 2009-09-05 2011-03-10 General Plasma, Inc. Plasma enhanced chemical vapor deposition apparatus
US11624115B2 (en) 2010-05-12 2023-04-11 Sio2 Medical Products, Inc. Syringe with PECVD lubrication
WO2011156877A1 (en) 2010-06-18 2011-12-22 Mahle Metal Leve S/A Plasma processing device
WO2011156876A1 (en) 2010-06-18 2011-12-22 Mahle Metal Leve S/A Plasma processing device
US9878101B2 (en) 2010-11-12 2018-01-30 Sio2 Medical Products, Inc. Cyclic olefin polymer vessels and vessel coating methods
US9272095B2 (en) 2011-04-01 2016-03-01 Sio2 Medical Products, Inc. Vessels, contact surfaces, and coating and inspection apparatus and methods
KR20140004785A (ko) * 2011-05-30 2014-01-13 히타치 긴조쿠 가부시키가이샤 레이스트랙 형상의 마그네트론 스퍼터링용 자장 발생 장치
KR101241049B1 (ko) 2011-08-01 2013-03-15 주식회사 플라즈마트 플라즈마 발생 장치 및 플라즈마 발생 방법
KR101246191B1 (ko) * 2011-10-13 2013-03-21 주식회사 윈텔 플라즈마 장치 및 기판 처리 장치
CN103930595A (zh) 2011-11-11 2014-07-16 Sio2医药产品公司 用于药物包装的钝化、pH保护性或润滑性涂层、涂布方法以及设备
US11116695B2 (en) 2011-11-11 2021-09-14 Sio2 Medical Products, Inc. Blood sample collection tube
US9664626B2 (en) 2012-11-01 2017-05-30 Sio2 Medical Products, Inc. Coating inspection method
EP2920567B1 (en) 2012-11-16 2020-08-19 SiO2 Medical Products, Inc. Method and apparatus for detecting rapid barrier coating integrity characteristics
US9764093B2 (en) 2012-11-30 2017-09-19 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition
WO2014085348A2 (en) 2012-11-30 2014-06-05 Sio2 Medical Products, Inc. Controlling the uniformity of pecvd deposition on medical syringes, cartridges, and the like
EP2778253B1 (de) * 2013-02-26 2018-10-24 Oerlikon Surface Solutions AG, Pfäffikon Zylinderförmige Verdampfungsquelle
US9662450B2 (en) 2013-03-01 2017-05-30 Sio2 Medical Products, Inc. Plasma or CVD pre-treatment for lubricated pharmaceutical package, coating process and apparatus
US9937099B2 (en) 2013-03-11 2018-04-10 Sio2 Medical Products, Inc. Trilayer coated pharmaceutical packaging with low oxygen transmission rate
KR102211788B1 (ko) 2013-03-11 2021-02-04 에스아이오2 메디컬 프로덕츠, 인크. 코팅된 패키징
US9508532B2 (en) 2013-03-13 2016-11-29 Bb Plasma Design Ab Magnetron plasma apparatus
US9863042B2 (en) 2013-03-15 2018-01-09 Sio2 Medical Products, Inc. PECVD lubricity vessel coating, coating process and apparatus providing different power levels in two phases
CN103269555B (zh) * 2013-04-28 2016-07-06 哈尔滨工业大学 用具零磁场区的磁场位形约束高温等离子体的系统和方法
RU2554085C2 (ru) * 2013-09-20 2015-06-27 Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный университет имени М.В. Ломоносова" (МГУ) Способ нагрева электродов и создания самостоятельного дугового разряда с поджигом от тонкой металлической проволочки в свободном пространстве в магнитном поле
EP3122917B1 (en) 2014-03-28 2020-05-06 SiO2 Medical Products, Inc. Antistatic coatings for plastic vessels
US9550694B2 (en) * 2014-03-31 2017-01-24 Corning Incorporated Methods and apparatus for material processing using plasma thermal source
US9533909B2 (en) 2014-03-31 2017-01-03 Corning Incorporated Methods and apparatus for material processing using atmospheric thermal plasma reactor
US10410889B2 (en) 2014-07-25 2019-09-10 Applied Materials, Inc. Systems and methods for electrical and magnetic uniformity and skew tuning in plasma processing reactors
RU2577040C2 (ru) * 2014-07-29 2016-03-10 Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный университет имени М.В. Ломоносова" (МГУ) Магнитный гаситель самостоятельного дугового разряда
JP6403269B2 (ja) * 2014-07-30 2018-10-10 株式会社神戸製鋼所 アーク蒸発源
US20160200618A1 (en) 2015-01-08 2016-07-14 Corning Incorporated Method and apparatus for adding thermal energy to a glass melt
KR20180048694A (ko) 2015-08-18 2018-05-10 에스아이오2 메디컬 프로덕츠, 인크. 산소 전달률이 낮은, 의약품 및 다른 제품의 포장용기
RU2614526C2 (ru) * 2015-08-31 2017-03-28 Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный университет имени М.В. Ломоносова" (МГУ) Способ отклонения тепловой кумулятивной струи расплавленного металла и образованного ей канала на металлической поверхности катода в дуговом импульсном разряде при взрыве проволочки между электродами действием поперечного магнитного поля
WO2017221134A1 (en) * 2016-06-21 2017-12-28 Medident Technologies Inc. Plasmaclave device
FR3079775B1 (fr) * 2018-04-06 2021-11-26 Addup Dispositif de chauffage a confinement magnetique pour appareil de fabrication additive selective
US11784033B2 (en) 2021-05-28 2023-10-10 Applied Materials, Inc. Methods and apparatus for processing a substrate
CN118480675A (zh) * 2024-07-09 2024-08-13 河南通达电缆股份有限公司 一种防止铜线氧化的退火系统及方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5143371A (en) * 1974-10-12 1976-04-14 Daido Steel Co Ltd Netsushorihohooyobi netsushorisochi
US4588490A (en) * 1985-05-22 1986-05-13 International Business Machines Corporation Hollow cathode enhanced magnetron sputter device
JPH02243762A (ja) 1989-03-17 1990-09-27 Hitachi Ltd スパッタ装置
JPH02246216A (ja) 1989-03-20 1990-10-02 Hitachi Ltd プラズマ装置
JPH0688229A (ja) * 1991-01-29 1994-03-29 Boc Group Inc:The 二重円筒マグネトロンに於けるスパッタリングターゲットの磁場ゾーン回転の電気制御
JPH04346662A (ja) * 1991-05-22 1992-12-02 Ube Ind Ltd スパッタリング方法およびその装置
US5411624A (en) * 1991-07-23 1995-05-02 Tokyo Electron Limited Magnetron plasma processing apparatus
JPH05148642A (ja) 1991-11-28 1993-06-15 Hitachi Ltd マグネトロンスパツタ装置
NO174450C (no) * 1991-12-12 1994-05-04 Kvaerner Eng Anordning ved plasmabrenner for kjemiske prosesser
JP3311064B2 (ja) * 1992-03-26 2002-08-05 株式会社東芝 プラズマ生成装置、表面処理装置および表面処理方法
KR0127663B1 (ko) * 1992-04-17 1998-04-01 모리시타 요이찌 플라즈마발생장치 및 플라즈마발생방법
JPH06181187A (ja) * 1992-12-11 1994-06-28 Hitachi Ltd スパッタリング装置
US5399253A (en) 1992-12-23 1995-03-21 Balzers Aktiengesellschaft Plasma generating device
JPH06212420A (ja) 1993-01-13 1994-08-02 Shin Etsu Chem Co Ltd スパッタ及びエッチング方法
JP2704352B2 (ja) 1993-01-22 1998-01-26 信越化学工業株式会社 磁場発生装置
JP3174982B2 (ja) 1993-03-27 2001-06-11 東京エレクトロン株式会社 プラズマ処理装置
JP2970317B2 (ja) * 1993-06-24 1999-11-02 松下電器産業株式会社 スパッタリング装置及びスパッタリング方法
US5518547A (en) * 1993-12-23 1996-05-21 International Business Machines Corporation Method and apparatus for reducing particulates in a plasma tool through steady state flows
JP3124204B2 (ja) * 1994-02-28 2001-01-15 株式会社東芝 プラズマ処理装置
ZA956811B (en) 1994-09-06 1996-05-14 Boc Group Inc Dual cylindrical target magnetron with multiple anodes
SE503141C2 (sv) * 1994-11-18 1996-04-01 Ladislav Bardos Apparat för alstring av linjär ljusbågsurladdning för plasmabearbetning
JPH08319552A (ja) * 1995-05-22 1996-12-03 Nagata Tekko Kk プラズマトーチおよびプラズマ溶射装置

Also Published As

Publication number Publication date
EP1033068B2 (en) 2011-03-09
SE9704260D0 (sv) 1997-11-20
DE69828904T3 (de) 2012-02-09
US6351075B1 (en) 2002-02-26
EP1033068A1 (en) 2000-09-06
JP4491132B2 (ja) 2010-06-30
AU1182099A (en) 1999-06-15
DE69828904T2 (de) 2006-01-12
CZ298474B6 (cs) 2007-10-10
WO1999027758A1 (en) 1999-06-03
DE69828904D1 (de) 2005-03-10
EP1033068B1 (en) 2005-02-02
CZ20001853A3 (cs) 2000-08-16
JP2001524743A (ja) 2001-12-04
SE9704260L (sv) 1999-05-21

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