SE503924C2 - Bärelement bestående av en bärfilm, en IC-komponent och en film med ursparningar som är förbunden med bärfilmen samt ett identitetskort innefattande ett sådant bärelement - Google Patents

Bärelement bestående av en bärfilm, en IC-komponent och en film med ursparningar som är förbunden med bärfilmen samt ett identitetskort innefattande ett sådant bärelement

Info

Publication number
SE503924C2
SE503924C2 SE8803469A SE8803469A SE503924C2 SE 503924 C2 SE503924 C2 SE 503924C2 SE 8803469 A SE8803469 A SE 8803469A SE 8803469 A SE8803469 A SE 8803469A SE 503924 C2 SE503924 C2 SE 503924C2
Authority
SE
Sweden
Prior art keywords
film
carrier
component
conductor tracks
support element
Prior art date
Application number
SE8803469A
Other languages
English (en)
Swedish (sv)
Other versions
SE8803469D0 (sv
SE8803469L (sv
Inventor
Yahya Haghiri-Tehrani
Joachim Hoppe
Original Assignee
Gao Ges Automation Org
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gao Ges Automation Org filed Critical Gao Ges Automation Org
Publication of SE8803469D0 publication Critical patent/SE8803469D0/xx
Publication of SE8803469L publication Critical patent/SE8803469L/xx
Publication of SE503924C2 publication Critical patent/SE503924C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
SE8803469A 1980-12-08 1988-09-30 Bärelement bestående av en bärfilm, en IC-komponent och en film med ursparningar som är förbunden med bärfilmen samt ett identitetskort innefattande ett sådant bärelement SE503924C2 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3046193 1980-12-08

Publications (3)

Publication Number Publication Date
SE8803469D0 SE8803469D0 (sv) 1988-09-30
SE8803469L SE8803469L (sv) 1988-09-30
SE503924C2 true SE503924C2 (sv) 1996-09-30

Family

ID=6118603

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8803469A SE503924C2 (sv) 1980-12-08 1988-09-30 Bärelement bestående av en bärfilm, en IC-komponent och en film med ursparningar som är förbunden med bärfilmen samt ett identitetskort innefattande ett sådant bärelement

Country Status (3)

Country Link
JP (1) JPS57122559A (fr)
BE (1) BE891283A (fr)
SE (1) SE503924C2 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59222947A (ja) * 1983-06-02 1984-12-14 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JPH0655554B2 (ja) * 1984-12-13 1994-07-27 松下電器産業株式会社 Ｉｃカードおよびその製造方法
JPS6283672U (fr) * 1985-11-12 1987-05-28
JPH06101493B2 (ja) * 1986-03-28 1994-12-12 松下電器産業株式会社 プラスチツクチツプキヤリア
JP2796625B2 (ja) * 1988-01-09 1998-09-10 カシオ計算機株式会社 電子桟器
JP2519332B2 (ja) * 1988-07-08 1996-07-31 沖電気工業株式会社 半導体装置
JP2606673B2 (ja) * 1994-10-21 1997-05-07 松下電器産業株式会社 実装体
JP2777114B2 (ja) * 1996-09-02 1998-07-16 株式会社日立製作所 テープキャリア
KR100447035B1 (ko) 1996-11-21 2004-09-07 가부시키가이샤 히타치세이사쿠쇼 반도체 장치의 제조방법
KR20010034214A (ko) * 1998-03-19 2001-04-25 가나이 쓰토무 반도체장치와 그 제조방법 및 반도체장치의 실장구조
JP3931330B2 (ja) 2001-09-14 2007-06-13 ソニー株式会社 熱プレス用プレートおよびカード製造装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50135062U (fr) * 1974-04-23 1975-11-07
JPS50159262A (fr) * 1974-06-12 1975-12-23

Also Published As

Publication number Publication date
BE891283A (fr) 1982-03-16
SE8803469D0 (sv) 1988-09-30
SE8803469L (sv) 1988-09-30
JPS57122559A (en) 1982-07-30
JPH0370374B2 (fr) 1991-11-07

Similar Documents

Publication Publication Date Title
SE458244B (sv) Baerelement foer en ic-komponent
SE461693B (sv) Foerfarande foer framstaellning av en databaerare
JP2632992B2 (ja) 電子モジユール回路用テープの生産方法とこの方法によつて得られるテープ
SE503924C2 (sv) Bärelement bestående av en bärfilm, en IC-komponent och en film med ursparningar som är förbunden med bärfilmen samt ett identitetskort innefattande ett sådant bärelement
SE461694B (sv) Foer inbyggnad i identitetskort eller liknande dat abaerare avsedda baerelement foer en ic-modul
US4463338A (en) Electrical network and method for producing the same
EP0071423A2 (fr) Empaquetages pour enfermer des éléments semiconducteurs
MX169754B (es) Cinta para la interconexion de capas de metales multiples y proceso para su fabricacion
KR20040032873A (ko) 카드 제조 기법 및 이에 의한 카드
JP3483280B2 (ja) 電子コンポーネントパッケージの３次元相互接続方法及びそれによって形成される３次元コンポーネント
EP2273261A1 (fr) Dispositif de capteur sur support flexible
US20120117797A1 (en) Packaging or mounting a component
CN103650133B (zh) Qfn封装的晶圆级处理技术
CN102792432A (zh) 半导体器件及其制造方法
JP4230543B2 (ja) 「チップサイズパッケージ」を有する半導体装置の製造方法
US7033860B2 (en) Process for manufacturing semiconductor device
US4164071A (en) Method of forming a circuit board with integral terminals
WO2004001774A1 (fr) Pave resistif presentant une faible resistance et son procede de fabrication
US10096409B2 (en) Chip resistor and method for manufacturing same
ES2224191T3 (es) Metodo para la fabricacion de un soporte de datos con modulo electronico.
CN102403277B (zh) 构造电路的方法和电路
EP0184439B1 (fr) Composant électrique montable en surface et son procédé de fabrication
SE466477B (sv) Elektroniskt byggblock i miniatyrutfoerande med hoeg packningstaethet samt saett att framstaella dylikt
JPS6181693A (ja) セラミツク基板の製造方法およびこれに用いるグリ−ンシ−ト
GB1583684A (en) Electrical layer resistor and a method for its manufacture

Legal Events

Date Code Title Description
NUG Patent has lapsed

Ref document number: 8803469-9

Format of ref document f/p: F