MX169754B - Cinta para la interconexion de capas de metales multiples y proceso para su fabricacion - Google Patents

Cinta para la interconexion de capas de metales multiples y proceso para su fabricacion

Info

Publication number
MX169754B
MX169754B MX024040A MX2404090A MX169754B MX 169754 B MX169754 B MX 169754B MX 024040 A MX024040 A MX 024040A MX 2404090 A MX2404090 A MX 2404090A MX 169754 B MX169754 B MX 169754B
Authority
MX
Mexico
Prior art keywords
sheet metal
thin sheet
manufacture
dielectric adhesive
tape
Prior art date
Application number
MX024040A
Other languages
English (en)
Inventor
Arvind Parthasarathi
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of MX169754B publication Critical patent/MX169754B/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/451—Multilayered leadframes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Wire Bonding (AREA)

Abstract

La presente invención se refiere a un proceso para la fabricación de una cinta de interconexión, caracterizado por los pasos de: proporcionar primera y segunda capas de hoja delgada de metal; formar un elemento de indización en la segunda capa de hoja delgada de metal; ligar un adhesivo dieléctrico a la segunda capa de hoja delgada de metal de manera tal que el adhesivo dieléctrico no obstruya el elemento de indización; formar una ventana de personalidad en la segunda capa de hoja delgada de metal y el adhesivo dieléctrico; ligar la primera capa de hoja delgada de metal en el adhesivo dieléctrico; y configurar la primera capa de hoja delgada de metal en una pluralidad de conductores separados de la ventana de personalidad, teniendo los conductores una porción conductora eléctrica que se extiende hacia la ventana de personalidad.
MX024040A 1990-01-09 1990-12-28 Cinta para la interconexion de capas de metales multiples y proceso para su fabricacion MX169754B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/462,519 US4997517A (en) 1990-01-09 1990-01-09 Multi-metal layer interconnect tape for tape automated bonding

Publications (1)

Publication Number Publication Date
MX169754B true MX169754B (es) 1993-07-22

Family

ID=23836728

Family Applications (1)

Application Number Title Priority Date Filing Date
MX024040A MX169754B (es) 1990-01-09 1990-12-28 Cinta para la interconexion de capas de metales multiples y proceso para su fabricacion

Country Status (5)

Country Link
US (1) US4997517A (es)
AU (1) AU7167091A (es)
MX (1) MX169754B (es)
PH (1) PH27566A (es)
WO (1) WO1991010573A1 (es)

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US5446620A (en) * 1990-08-01 1995-08-29 Staktek Corporation Ultra high density integrated circuit packages
AU8519891A (en) * 1990-08-01 1992-03-02 Staktek Corporation Ultra high density integrated circuit packages, method and apparatus
US5475920A (en) * 1990-08-01 1995-12-19 Burns; Carmen D. Method of assembling ultra high density integrated circuit packages
US5367766A (en) * 1990-08-01 1994-11-29 Staktek Corporation Ultra high density integrated circuit packages method
US5377077A (en) * 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5156716A (en) * 1991-04-26 1992-10-20 Olin Corporation Process for the manufacture of a three layer tape for tape automated bonding
US5234536A (en) * 1991-04-26 1993-08-10 Olin Corporation Process for the manufacture of an interconnect circuit
US5678301A (en) * 1991-06-04 1997-10-21 Micron Technology, Inc. Method for forming an interconnect for testing unpackaged semiconductor dice
US5133118A (en) * 1991-08-06 1992-07-28 Sheldahl, Inc. Surface mounted components on flex circuits
US5221642A (en) * 1991-08-15 1993-06-22 Staktek Corporation Lead-on-chip integrated circuit fabrication method
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
US5261989A (en) * 1992-01-22 1993-11-16 Intel Corporation Straddle mounting an electrical conductor to a printed circuit board
JPH0653277A (ja) * 1992-06-04 1994-02-25 Lsi Logic Corp 半導体装置アセンブリおよびその組立方法
US5702985A (en) * 1992-06-26 1997-12-30 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method
US5738928A (en) * 1992-08-08 1998-04-14 Shinko Electric Industries Co., Ltd. Tab tape and method for producing same
US6007668A (en) * 1992-08-08 1999-12-28 Shinko Electric Industries Co., Ltd. Tab tape and method for producing same
TW238419B (es) * 1992-08-21 1995-01-11 Olin Corp
US6205654B1 (en) * 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US5296651A (en) * 1993-02-09 1994-03-22 Hewlett-Packard Company Flexible circuit with ground plane
US5801437A (en) * 1993-03-29 1998-09-01 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5369056A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5644161A (en) * 1993-03-29 1997-07-01 Staktek Corporation Ultra-high density warp-resistant memory module
US5589668A (en) * 1993-05-12 1996-12-31 Hitachi Cable, Ltd. Multi-metal layer wiring tab tape carrier and process for fabricating the same
DE4404986B4 (de) * 1994-02-17 2008-08-21 Robert Bosch Gmbh Einrichtung zur Kontaktierung elektrischer Leiter sowie Verfahren zur Herstellung einer derartigen Einrichtung
US5629835A (en) * 1994-07-19 1997-05-13 Olin Corporation Metal ball grid array package with improved thermal conductivity
US6025642A (en) * 1995-08-17 2000-02-15 Staktek Corporation Ultra high density integrated circuit packages
US5681662A (en) * 1995-09-15 1997-10-28 Olin Corporation Copper alloy foils for flexible circuits
US5814174A (en) * 1996-06-17 1998-09-29 Hughes Electronics Corporation Method for repair of metallization on circuit board substrates
JP2933554B2 (ja) * 1996-11-28 1999-08-16 九州日本電気株式会社 半導体装置およびその製造方法
US5945732A (en) * 1997-03-12 1999-08-31 Staktek Corporation Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
DE19743365A1 (de) * 1997-09-30 1999-04-08 Siemens Ag Verfahren zur Herstellung eines Mehrebenen-Verdrahtungsträgers (Substrat), insbesondere für Multichipmodule
DE69842092D1 (de) * 1997-12-11 2011-02-17 Ibiden Co Ltd Verfahren zur Herstellung einer mehrschichtigen gedruckten Leiterplatte
US5976391A (en) * 1998-01-13 1999-11-02 Ford Motor Company Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same
US6339253B1 (en) * 1999-08-30 2002-01-15 Micron Technology, Inc. Semiconductor package
US6576988B2 (en) 1999-08-30 2003-06-10 Micron Technology, Inc. Semiconductor package
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US6608763B1 (en) 2000-09-15 2003-08-19 Staktek Group L.P. Stacking system and method
US6462408B1 (en) * 2001-03-27 2002-10-08 Staktek Group, L.P. Contact member stacking system and method
US7132158B2 (en) * 2003-10-22 2006-11-07 Olin Corporation Support layer for thin copper foil
US8414962B2 (en) 2005-10-28 2013-04-09 The Penn State Research Foundation Microcontact printed thin film capacitors

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DE1817434C3 (de) * 1967-12-30 1980-05-14 Sony Corp., Tokio Verfahren zur Herstellung einer elektrischen Leitungsanordnung
US3768986A (en) * 1971-10-08 1973-10-30 Micro Science Ass Laminated lead frame and method of producing same
US4480288A (en) * 1982-12-27 1984-10-30 International Business Machines Corporation Multi-layer flexible film module
US4607276A (en) * 1984-03-08 1986-08-19 Olin Corporation Tape packages
US4736236A (en) * 1984-03-08 1988-04-05 Olin Corporation Tape bonding material and structure for electronic circuit fabrication
US4647508A (en) * 1984-07-09 1987-03-03 Rogers Corporation Flexible circuit laminate
US4619741A (en) * 1985-04-11 1986-10-28 Olin Hunt Specialty Products Inc. Process for preparing a non-conductive substrate for electroplating
US4634631A (en) * 1985-07-15 1987-01-06 Rogers Corporation Flexible circuit laminate and method of making the same
US4642160A (en) * 1985-08-12 1987-02-10 Interconnect Technology Inc. Multilayer circuit board manufacturing
US4721993A (en) * 1986-01-31 1988-01-26 Olin Corporation Interconnect tape for use in tape automated bonding
US4814855A (en) * 1986-04-29 1989-03-21 International Business Machines Corporation Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape
US4806409A (en) * 1987-05-20 1989-02-21 Olin Corporation Process for providing an improved electroplated tape automated bonding tape and the product produced thereby
US4801999A (en) * 1987-07-15 1989-01-31 Advanced Micro Devices, Inc. Integrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layers
US4827376A (en) * 1987-10-05 1989-05-02 Olin Corporation Heat dissipating interconnect tape for use in tape automated bonding
US4849857A (en) * 1987-10-05 1989-07-18 Olin Corporation Heat dissipating interconnect tape for use in tape automated bonding

Also Published As

Publication number Publication date
WO1991010573A1 (en) 1991-07-25
PH27566A (en) 1993-08-18
AU7167091A (en) 1991-08-05
US4997517A (en) 1991-03-05

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