JPS6283672U - - Google Patents

Info

Publication number
JPS6283672U
JPS6283672U JP17406785U JP17406785U JPS6283672U JP S6283672 U JPS6283672 U JP S6283672U JP 17406785 U JP17406785 U JP 17406785U JP 17406785 U JP17406785 U JP 17406785U JP S6283672 U JPS6283672 U JP S6283672U
Authority
JP
Japan
Prior art keywords
card
semiconductor device
arrangement
cards
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17406785U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17406785U priority Critical patent/JPS6283672U/ja
Publication of JPS6283672U publication Critical patent/JPS6283672U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
JP17406785U 1985-11-12 1985-11-12 Pending JPS6283672U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17406785U JPS6283672U (fr) 1985-11-12 1985-11-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17406785U JPS6283672U (fr) 1985-11-12 1985-11-12

Publications (1)

Publication Number Publication Date
JPS6283672U true JPS6283672U (fr) 1987-05-28

Family

ID=31112118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17406785U Pending JPS6283672U (fr) 1985-11-12 1985-11-12

Country Status (1)

Country Link
JP (1) JPS6283672U (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710258A (en) * 1980-05-20 1982-01-19 Gao Ges Automation Org Integrated circuit chip carrier element for identification card
JPS57122559A (en) * 1980-12-08 1982-07-30 Gao Ges Automation Org Integrated circuit module support

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710258A (en) * 1980-05-20 1982-01-19 Gao Ges Automation Org Integrated circuit chip carrier element for identification card
JPS57122559A (en) * 1980-12-08 1982-07-30 Gao Ges Automation Org Integrated circuit module support

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