SE8803469D0 - Baerelement foer en ic-modul - Google Patents
Baerelement foer en ic-modulInfo
- Publication number
- SE8803469D0 SE8803469D0 SE8803469A SE8803469A SE8803469D0 SE 8803469 D0 SE8803469 D0 SE 8803469D0 SE 8803469 A SE8803469 A SE 8803469A SE 8803469 A SE8803469 A SE 8803469A SE 8803469 D0 SE8803469 D0 SE 8803469D0
- Authority
- SE
- Sweden
- Prior art keywords
- module
- bearing element
- bearing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01051—Antimony [Sb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Wire Bonding (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3046193 | 1980-12-08 |
Publications (3)
Publication Number | Publication Date |
---|---|
SE8803469D0 true SE8803469D0 (sv) | 1988-09-30 |
SE8803469L SE8803469L (sv) | 1988-09-30 |
SE503924C2 SE503924C2 (sv) | 1996-09-30 |
Family
ID=6118603
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE8803469A SE503924C2 (sv) | 1980-12-08 | 1988-09-30 | Bärelement bestående av en bärfilm, en IC-komponent och en film med ursparningar som är förbunden med bärfilmen samt ett identitetskort innefattande ett sådant bärelement |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS57122559A (sv) |
BE (1) | BE891283A (sv) |
SE (1) | SE503924C2 (sv) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59222947A (ja) * | 1983-06-02 | 1984-12-14 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JPH0655554B2 (ja) * | 1984-12-13 | 1994-07-27 | 松下電器産業株式会社 | Icカードおよびその製造方法 |
JPS6283672U (sv) * | 1985-11-12 | 1987-05-28 | ||
JPH06101493B2 (ja) * | 1986-03-28 | 1994-12-12 | 松下電器産業株式会社 | プラスチツクチツプキヤリア |
JP2796625B2 (ja) * | 1988-01-09 | 1998-09-10 | カシオ計算機株式会社 | 電子桟器 |
JP2519332B2 (ja) * | 1988-07-08 | 1996-07-31 | 沖電気工業株式会社 | 半導体装置 |
JP2606673B2 (ja) * | 1994-10-21 | 1997-05-07 | 松下電器産業株式会社 | 実装体 |
JP2777114B2 (ja) * | 1996-09-02 | 1998-07-16 | 株式会社日立製作所 | テープキャリア |
KR100447035B1 (ko) | 1996-11-21 | 2004-09-07 | 가부시키가이샤 히타치세이사쿠쇼 | 반도체 장치의 제조방법 |
WO1999048145A1 (fr) * | 1998-03-19 | 1999-09-23 | Hitachi, Ltd. | Dispositif a semi-conducteur, procede de fabrication et structure de montage associes |
JP3931330B2 (ja) | 2001-09-14 | 2007-06-13 | ソニー株式会社 | 熱プレス用プレートおよびカード製造装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50135062U (sv) * | 1974-04-23 | 1975-11-07 | ||
JPS50159262A (sv) * | 1974-06-12 | 1975-12-23 |
-
1981
- 1981-11-30 BE BE0/206683A patent/BE891283A/fr not_active IP Right Cessation
- 1981-12-08 JP JP56197585A patent/JPS57122559A/ja active Granted
-
1988
- 1988-09-30 SE SE8803469A patent/SE503924C2/sv not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPS57122559A (en) | 1982-07-30 |
SE503924C2 (sv) | 1996-09-30 |
BE891283A (fr) | 1982-03-16 |
SE8803469L (sv) | 1988-09-30 |
JPH0370374B2 (sv) | 1991-11-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |
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