SE8803469D0 - BEARING ELEMENT FOR AN IC MODULE - Google Patents

BEARING ELEMENT FOR AN IC MODULE

Info

Publication number
SE8803469D0
SE8803469D0 SE8803469A SE8803469A SE8803469D0 SE 8803469 D0 SE8803469 D0 SE 8803469D0 SE 8803469 A SE8803469 A SE 8803469A SE 8803469 A SE8803469 A SE 8803469A SE 8803469 D0 SE8803469 D0 SE 8803469D0
Authority
SE
Sweden
Prior art keywords
module
bearing element
bearing
Prior art date
Application number
SE8803469A
Other languages
Swedish (sv)
Other versions
SE8803469L (en
SE503924C2 (en
Inventor
Y Haghiri-Tehrani
J Hoppe
Original Assignee
Gao Ges Automation Org
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gao Ges Automation Org filed Critical Gao Ges Automation Org
Publication of SE8803469L publication Critical patent/SE8803469L/en
Publication of SE8803469D0 publication Critical patent/SE8803469D0/en
Publication of SE503924C2 publication Critical patent/SE503924C2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
SE8803469A 1980-12-08 1988-09-30 Carrier element consisting of a carrier film, an IC component and a film with recesses associated with the carrier film and an identity card comprising such a carrier element SE503924C2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3046193 1980-12-08

Publications (3)

Publication Number Publication Date
SE8803469L SE8803469L (en) 1988-09-30
SE8803469D0 true SE8803469D0 (en) 1988-09-30
SE503924C2 SE503924C2 (en) 1996-09-30

Family

ID=6118603

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8803469A SE503924C2 (en) 1980-12-08 1988-09-30 Carrier element consisting of a carrier film, an IC component and a film with recesses associated with the carrier film and an identity card comprising such a carrier element

Country Status (3)

Country Link
JP (1) JPS57122559A (en)
BE (1) BE891283A (en)
SE (1) SE503924C2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59222947A (en) * 1983-06-02 1984-12-14 Matsushita Electric Ind Co Ltd Semiconductor device and manufacture thereof
JPH0655554B2 (en) * 1984-12-13 1994-07-27 松下電器産業株式会社 IC card and method of manufacturing the same
JPS6283672U (en) * 1985-11-12 1987-05-28
JPH06101493B2 (en) * 1986-03-28 1994-12-12 松下電器産業株式会社 Plastic chip carrier
JP2796625B2 (en) * 1988-01-09 1998-09-10 カシオ計算機株式会社 Electronic jet
JP2519332B2 (en) * 1988-07-08 1996-07-31 沖電気工業株式会社 Semiconductor device
JP2606673B2 (en) * 1994-10-21 1997-05-07 松下電器産業株式会社 Mounted body
JP2777114B2 (en) * 1996-09-02 1998-07-16 株式会社日立製作所 Tape carrier
KR100447313B1 (en) * 1996-11-21 2004-09-07 가부시키가이샤 히타치세이사쿠쇼 Semiconductor device and process for manufacturing the same
WO1999048145A1 (en) * 1998-03-19 1999-09-23 Hitachi, Ltd. Semiconductor device, method for manufacturing the same, and mounting structure of the same
JP3931330B2 (en) 2001-09-14 2007-06-13 ソニー株式会社 Hot press plate and card manufacturing equipment

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50135062U (en) * 1974-04-23 1975-11-07
JPS50159262A (en) * 1974-06-12 1975-12-23

Also Published As

Publication number Publication date
JPS57122559A (en) 1982-07-30
SE8803469L (en) 1988-09-30
JPH0370374B2 (en) 1991-11-07
BE891283A (en) 1982-03-16
SE503924C2 (en) 1996-09-30

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