JPH0655554B2 - IC card and method of manufacturing the same - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card having a built-in IC or LSI chip or a device.

2. Description of the Related Art In recent years, a cash card that is portable and has a relatively large capacity memory function with a built-in IC, LSI, etc.
ID cards such as credit cards are being developed. If importance is attached to portability, these cards have a thickness of at least 1 mm or less, like conventional so-called magnetic stripe cards provided with a magnetic recording medium on the back surface or so-called embossed cards having holes in the cards. Needs to be thinned to 0,76 mm. In addition, when the card is bent, the mounting area must be remarkably reduced in order to prevent damage to a semiconductor device such as an IC or LSI built in the card and disconnection of a circuit conductor. FIG. 6 shows a mounting module of a semiconductor chip such as an IC or LSI embedded in a conventional card.

On a glass epoxy substrate or the like 1, an _Au- plated conductor wiring portion 3 is formed, and I is formed on one surface of the substrate 1.
A semiconductor chip 2 such as C or LSI is die-bonded, and the chip 2 is electrically connected to a conductor wiring portion 3 by a wire 4. Further, as shown in FIG. 7, a plurality of terminal portions 5 for connecting to an external circuit for inputting / outputting electric signals are formed on the chip mounting surface of the substrate 1.
FIG. 7 is a plan view of the mounting module shown in FIG. The substrate 1 on which the chip 2 is placed and processed for wiring is embedded or mounted in a card 6 made of resin, and is molded so that only the terminal portion 5 is exposed to the outside as shown in FIG. The card is completed.

Problems to be Solved by the Invention However, in such a conventional card configuration,
Since the area for mounting a semiconductor chip such as an IC or LSI and the area for the connection terminal are located on the same plane, the size of the substrate 1 becomes large, and the conductor wiring is easily broken due to bending or the like. Further, since die bonding and wire bonding are used for mounting the semiconductor chip, there are two connection points, that is, the electrode part of the chip and the conductor wiring part on the substrate, which reduces the reliability of the connection. In addition, since the connection is made by wire bonding, the wire is at least 0,3 from the surface of the chip.
The thickness of the substrate 1 must be set to 0, 2 mm or more in order to protrude the mm or to perform die bonding. If the thickness of the chip is 0.2mm, the thickness of the mounting module reaches 0.7mm, and when the card is mounted on the card 6, the thickness of the resin film that forms the card for protection is also added. The length is over 1 mm, which is extremely impractical.

Therefore, the present invention is such that, when a semiconductor chip is mounted on and built in a card, the mounting module is thin, the mounting area is small, and the reliability is high.

Means for Solving the Problems In order to solve the above problems, the present invention uses first and second tape-shaped bodies, and mounts a semiconductor device on one of the tape-shaped bodies.
An electrode portion is formed on the other side, and the first and second tape-shaped bodies are bent at the conductor wiring portion connecting the two, and are mounted in the card in a superposed state.

Further, a plurality of sprocket holes are formed on both side edges, first and second openings are formed between the sprocket holes on both side edges, and the first and second openings are interposed between the sprocket holes to extend to both sides. A conductor wiring portion is formed, and one end of the conductor wiring portion is formed of a tape-shaped body protruding into the second opening. A semiconductor device is arranged in the second opening of the tape-shaped body, and an electrode of the semiconductor device is arranged. A step of electrically connecting to an end portion of the conductor wiring portion protruding into the second opening portion, the conductor wiring portion, the second opening portion,
A step of cutting the tape-shaped body into a frame shape so that the semiconductor device is not cut and both ends of the first opening are cut, and two tape-shaped bodies formed after the cutting are cut into both tapes. It is a manufacturing method comprising a step of bending the conductor wiring portion connecting the strips so that they overlap each other, and a step of disposing the overlapped tape strips at predetermined positions of the card body.

Effect The present invention can reduce the area of the IC card mounting module and reduce the thickness by the above-described configuration and method, and can reduce the number of connection points.

Embodiment FIG. 1 shows the configuration of an IC card according to an embodiment of the present invention.

Carrier tapes 10 and 11 made of glass-filled epoxy resin film or polyimide resin film are folded in two by a flexible conductor wiring portion 12 formed on the carrier tapes 10 and 11 so as to connect both tapes. Overlaid on top of each other. A plurality of electrode portions 13 for contacting external terminals (not shown) are formed on the one carrier tape 10, and an opening is formed in the other carrier tape 11 installed on the opposite side of the carrier tape 10. The part 14 is formed. An end portion 15 of the conductor wiring portion 12 is projected into the opening portion 14. A semiconductor device (chip) 16 such as an IC or LSI is installed in the opening portion at the protruding end portion 15 and its electrode is provided. 17 is connected.

The conductor wiring portion 12 includes a semiconductor device 16 and the electrode portion 13.
The end portion 15 connected to the electrode 17 may be formed integrally or separately, but they are electrically connected to each other. The configuration shown in FIG. 1 is maintained, that is, the tapes 10 and 11 are superposed on each other, and are built in or installed in a predetermined position of the card.

Next, a method for manufacturing the above card will be described with reference to FIGS.

The film carrier tape body 20 is made of glass-filled epoxy, polyester, or polyimide, and has a thickness of 100 to 125 μm. An opening 14 is provided in the tape 20 approximately at the center in the width direction, and an end portion 15 of the conductor wiring portion 12 formed by etching a Cu foil and subjecting it to Sn plating is projected in the opening 14. Tape body 20
Is provided with an electrode portion 13 for contacting an external terminal, and an opening portion 21 is provided between the opening portion 14 and the electrode portion 13.
Is provided. Further, the electrode portion 13 and the end portion 15 of the conductor wiring portion 12 protruding into the opening portion 14 are electrically connected across the opening portion 21 through the conductor wiring portion 12.

The electrode 17 of the semiconductor chip 16 is connected to the protruding end 15 of the conductor wiring portion 12. This state is shown in FIG. Next, when the tape 20 is cut along the frame-shaped cut portion 24 indicated by a broken line, a structure in which the film carrier tape 10 having the electrode 13 and the film carrier tape 11 having the chip 17 mounted thereon are connected by the conductor wiring portion 12 is formed. To obtain (Fig. 3). The two film carrier tapes 10 and 11 are bent around the opening 21 as a center, and the two film carrier tapes 10 and 11 are stacked and mounted on a card 22 made of resin so that the electrodes 13 are exposed (FIG. 4).

Since the chip 16 is located on the opposite surface of the electrode 13 in the bent state, the mounting area is remarkably reduced. Further, the chip 16 is formed in the opening 14 of the film carrier tape 11.
The thickness of the chip can be ignored because it is housed in. FIG. 5 is a plan view of the completed card.

The tape 20 has sprocket holes 23 on both side edges as shown in FIG. 2, and the tape 20 can be fed in the longitudinal direction by a sprocket mechanism. Therefore, the openings 14 and 21 are formed, the conductor wiring portion 12 and the copper foil to be the electrode 13 are attached to the tape 21, the etching treatment for forming the conductor wiring portion 12 and the electrode 13 is performed, and the chip 1 is used.
6 arrangement, connection of the end portion 15 and the electrode 17, and frame-shaped cutting of the broken line 21 (cutting so as to cut both ends of the opening portion 21 without cutting the conductor wiring portion 12, the electrode 13 and the opening portion 14) It is also possible to perform the above step without sending the tape 20. The module shown in FIG. 3 is integrally molded and embedded when the card 22 is formed.

EFFECTS OF THE INVENTION As described above, according to the present invention, the following effects can be obtained.

(1) Since the IC card of the present invention has a structure in which the semiconductor device is arranged on the side opposite to the electrode portion in contact with the external terminal, the plane area of the mounting module can be significantly reduced, and the reliability of the card such as bending can be improved. Can be improved.

(2) Further, the semiconductor device is arranged in the tape-shaped body opening, and by directly connecting the conductor and the semiconductor device, the thickness of the mounting module can be significantly reduced,
The thickness of the card itself can be reduced.

(3) Furthermore, by directly connecting the conductor provided on the tape-shaped body and the semiconductor device, the number of connecting points is only one, and the reliability of the connection can be improved.

(4) Further, the semiconductor device can be mounted on the film-shaped body in one bonding step, and all wiring to the electrode portion can be completed. Further, after the bonding step, it can be mounted in the card by punching it into a predetermined size and simply bending it. That is, the semiconductor device can be continuously mounted by the tape-shaped body, and the number of manufacturing steps can be significantly reduced, so that the manufacturing cost can be reduced.

(5) As shown in FIG. 1, since the entire surface of the semiconductor device is covered with the film carrier tape, the semiconductor device is protected from mechanical damage and is also protected from radiation emitted from, for example, a metal member. Can be protected.

(6) Since the electrode portion is formed on the film carrier tape covering the entire surface of the semiconductor device, the area of this electrode portion can be made large and the reliability of the connection with the external terminal can be improved.

[Brief description of drawings]

FIG. 1 is a sectional view of a mounting module incorporated in an IC card according to an embodiment of the present invention, and FIGS. 2 to 5 are views showing a manufacturing process of an IC card according to an embodiment of the present invention.
The figure shows a cross-sectional view of a conventional IC card mounting module.
FIG. 8 is a plan view of the mounting module, and FIG. 8 is a plan view showing the mounting module mounted on a card. 10, 11 ... Carrier tape, 12 ... Conductor wiring part,
13 ... Electrode part, 14 ... Opening part, 15 ... End part, 16
...... Semiconductor device (chip), 20 …… Carrier tape,
21 ... Opening part, 22 ... card, 23 ... sprocket hole.

Claims (3)

[Claims] 1. An IC card having a card body having a recess formed therein and a semiconductor device housed in the recess, wherein the semiconductor device has a second wiring formed with conductor wiring to which a semiconductor chip is connected. A film-like body, a first film-like body having substantially the same dimensions as the second film-like body, on the surface of which an electrode portion corresponding to the conductor wiring is formed, the conductor wiring and the electrode portion And a flexible conductor wiring part that integrally connects the electrodes, the electrode portion has a width portion larger than the width of the conductor wiring, and the first film-shaped body is the flexible conductor wiring portion. In one direction, is overlapped with the second film-like body so as to cover the semiconductor chip, and is housed in the recess with the electrode portion facing the surface.
C card. 2. A second film-shaped body is formed with an opening for accommodating a semiconductor chip therein, and a conductor wiring to which the semiconductor chip is connected is formed from the end of the opening to the opening. The IC card according to claim 1, wherein the IC card is extended toward the inner side of the substrate and is connected to the semiconductor chip at the extended end portion. 3. An opening is formed in the tape-shaped body, and a conductor wiring to which a semiconductor chip is connected is formed on one side of the opening and the boundary, and an electrode corresponding to the conductor wiring is formed on the opposite side. A portion is formed, the conductor wiring and the electrode portion are connected by a flexible conductor wiring so as to straddle the opening, a semiconductor chip is connected to the conductor wiring, and then the semiconductor chip, the conductor When cutting the region including the wiring, the electrode portion, and the flexible conductor wiring from the tape-shaped body, the upper and lower portions of the opening are cut in the left-right direction, and the region is defined by the electrode portion. The formed first film-like body and the second film-like body having the conductor wiring and the semiconductor chip are separated from each other, and the first and second film-like bodies are formed by the flexible conductor wiring. Cut to be connected Out, after the cutting, the first, the second film-like body, IC card manufacturing method of disposing a predetermined recess of the folding card body in the flexible conductor wiring so as to overlap each other.