JPH04319497A - Module for ic card - Google Patents
Module for ic cardInfo
- Publication number
- JPH04319497A JPH04319497A JP3086562A JP8656291A JPH04319497A JP H04319497 A JPH04319497 A JP H04319497A JP 3086562 A JP3086562 A JP 3086562A JP 8656291 A JP8656291 A JP 8656291A JP H04319497 A JPH04319497 A JP H04319497A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- wiring board
- card
- sided wiring
- continuous hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 10
- 230000001070 adhesive effect Effects 0.000 claims abstract description 10
- 238000004891 communication Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 description 18
- 238000007789 sealing Methods 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48235—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a via metallisation of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Abstract
Description
［発明の目的］ [Purpose of the invention]
【０００１】0001
【産業上の利用分野】本発明は、ＩＣカードに内蔵させ
るＩＣカード用モジュールに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card module built into an IC card.
【０００２】0002
【従来の技術】近年、図６に示したような０．７６ｍｍ
厚のプラスチックカードにＩＣカード用モジュール６１
を内蔵させたＩＣカード６２を、銀行のキャッシュカー
ドに採用して通帳の機能も装備させようという方向にあ
る。[Prior Art] In recent years, 0.76 mm as shown in FIG.
IC card module 61 on thick plastic card
There is a trend toward adopting the IC card 62 with a built-in function in a bank cash card, which also has the function of a passbook.
【０００３】従来のＩＣカードに内蔵されていたＩＣカ
ード用モジュールは両面配線基板を利用して製造されて
いた。図３は、この両面配線基板を利用して製造したＩ
Ｃカード用モジュールを示した一部断面図である。これ
は、両面配線基板２５の片面に外部機器（図示しない）
との通信用のコンタクト面３０を備えた接続端子２９ａ
，２９ｂを設け、他面にはＩＣチップ２１及びＩＣチッ
プ２１の電極部２３を電気的に導通させるためのボンデ
ィング面２８を備えた電極パターン２７ａ，２７ｂを設
けてある。そして電極パターン２７ｂと接続端子２９ｂ
は、両面配線基板２５を貫通するかたちで形成されたス
ルーホール２６により電気的に導通するように形成され
ている。ＩＣチップ２１は、電極パターン２７ａに塗布
された導電性接着剤２４を介して直接導通固定され、電
極部２３は、電極パターン２７ｂのボンディング面２８
とボンディングワイヤ２２で導通される。そしてＩＣチ
ップ２１と電極部２３がそれぞれ所定の電極パターン２
７ａ，２７ｂと電気的導通を得た後、ＩＣチップ２１を
封止樹脂で封止してＩＣカード用モジュール３１を製造
していた。[0003] IC card modules built into conventional IC cards have been manufactured using double-sided wiring boards. Figure 3 shows an I manufactured using this double-sided wiring board.
It is a partial sectional view showing a module for C cards. This is an external device (not shown) on one side of the double-sided wiring board 25.
connection terminal 29a with a contact surface 30 for communication with
, 29b are provided, and electrode patterns 27a and 27b having bonding surfaces 28 for electrically connecting the IC chip 21 and the electrode portion 23 of the IC chip 21 are provided on the other surface. And electrode pattern 27b and connection terminal 29b
are formed to be electrically conductive through a through hole 26 formed to penetrate the double-sided wiring board 25. The IC chip 21 is directly electrically fixed via the conductive adhesive 24 applied to the electrode pattern 27a, and the electrode portion 23 is connected to the bonding surface 28 of the electrode pattern 27b.
They are electrically connected to each other by a bonding wire 22. Then, the IC chip 21 and the electrode section 23 are arranged in a predetermined electrode pattern 2.
After establishing electrical continuity with the IC chips 7a and 27b, the IC chip 21 is sealed with a sealing resin to produce an IC card module 31.
【０００４】しかし、上記したような両面配線基板２５
を利用したＩＣカード用モジュールでは製造コストが高
く、必然的にＩＣカードの価格も高くなってしまいキャ
ッシュカードに採用するのは困難であった。そこで製造
コストの低減をはかるために、製造コストの高い両面配
線基板を利用しないで、製造コストの低いリードフレー
ムに直接ＩＣチップを載置してＩＣカード用モジュール
を製造する方法や、片面配線基板を利用してＩＣカード
用モジュールを製造するという方法が試みられてきた。
図４は、リードフレームに導電性接着剤を介して直接Ｉ
Ｃチップを導通固定させたＩＣカード用モジュールを示
した一部断面図である。これは、片面にＩＣチップ４１
やＩＣチップ４１の電極部４３と接続するためのボンデ
ィング面４６が形成され、他面に外部機器（図示しない
）との通信用のコンタクト面４７が形成されたリードフ
レーム４５ａ，４５ｂを使用した方法である。ＩＣチッ
プ４１は、リードフレーム４５ａのボンディング面４６
に塗布された導電性接着剤４４を介して直接導電固定さ
れ、電極部４３は、リードフレーム４５ｂのボンディン
グ面１６とボンディングワイヤ４２で導通される。そし
て、ＩＣチップ４１と電極部４３がそれぞれ所定のリー
ドフレーム４５ａ，４５ｂと電気的導通を得た後、ＩＣ
チップ４１を封止樹脂で封止してＩＣカード用モジュー
ル４８を製造していた。However, the above-mentioned double-sided wiring board 25
An IC card module using this technology has a high manufacturing cost, which inevitably increases the price of the IC card, making it difficult to use it in cash cards. Therefore, in order to reduce manufacturing costs, we have developed a method for manufacturing IC card modules by directly mounting IC chips on lead frames, which are low in manufacturing cost, without using double-sided wiring boards, which are expensive to manufacture, and a method for manufacturing IC card modules using single-sided wiring boards. Attempts have been made to manufacture IC card modules using the same method. Figure 4 shows an example of direct I
FIG. 2 is a partial cross-sectional view showing an IC card module in which a C chip is conductively fixed. This has 41 IC chips on one side.
A method using lead frames 45a and 45b on which a bonding surface 46 for connection with the electrode section 43 of the IC chip 41 is formed, and a contact surface 47 for communication with an external device (not shown) is formed on the other surface. It is. The IC chip 41 is attached to the bonding surface 46 of the lead frame 45a.
The electrode portion 43 is electrically connected to the bonding surface 16 of the lead frame 45b through the bonding wire 42. Then, after the IC chip 41 and the electrode section 43 have obtained electrical continuity with the respective predetermined lead frames 45a and 45b, the IC chip 41 and the electrode section 43 are
An IC card module 48 was manufactured by sealing the chip 41 with a sealing resin.
【０００５】また図５は、片面配線基板を使用したＩＣ
カード用モジュールを示した一部断面図である。接続端
子５６ａ，５６ｂは、外部機器（図示しない）との通信
用のコンタクト面５８を有し、このコンタクト面５８の
裏面にはＩＣチップ５１の電極部５３及びＩＣチップ５
１と電気的に導通させるためのボンディング面５７を有
している。そしてこの片面配線基板５５には接続端子５
６ａ，５６ｂのボンディング面５７を露出させるように
接続孔５９ａ，５９ｂが形成されている。ＩＣチップ５
１は、露出させた接続孔５９ａのボンディング面５７に
導電性接着剤５４を介して直接載置固定されて電気的導
通を得ており、電極部５３は、接続端子５６ｂのボンデ
ィング面５７とボンディングワイヤ５２でボンディング
されて電気的導通を得ている。ＩＣチップ５１と電極部
５３がそれぞれ所定の接続端子５６ａ，５６ｂと電気的
導通を得た後、ＩＣチップ５１を封止樹脂で封止してＩ
Ｃカード用モジュール６０を製造していた。FIG. 5 also shows an IC using a single-sided wiring board.
It is a partial sectional view showing a module for cards. The connection terminals 56a, 56b have a contact surface 58 for communication with an external device (not shown), and the electrode portion 53 of the IC chip 51 and the IC chip 5 are provided on the back surface of this contact surface 58.
It has a bonding surface 57 for electrically conducting with 1. This single-sided wiring board 55 has connection terminals 5
Connection holes 59a and 59b are formed to expose bonding surfaces 57 of 6a and 56b. IC chip 5
1 is directly placed and fixed on the bonding surface 57 of the exposed connection hole 59a via a conductive adhesive 54 to obtain electrical continuity, and the electrode portion 53 is bonded to the bonding surface 57 of the connection terminal 56b. They are bonded with wires 52 to obtain electrical continuity. After the IC chip 51 and the electrode part 53 are electrically connected to the respective connection terminals 56a and 56b, the IC chip 51 is sealed with a sealing resin and the I.
The company was manufacturing a module 60 for C cards.
【０００６】しかし、上述したリードフレームや片面配
線基板を利用したＩＣカード用モジュールであると、利
用出来るＩＣチップのチップサイズが対応するリードフ
レーム４５ａ及び接続端子５６ａの大きさ以下に制限さ
れてしまい、両面配線基板を利用して得ていた通帳の機
能を装備したキャッシュカードに必要な情報記憶容量を
維持することができなくなってしまった。However, in the case of an IC card module using the above-mentioned lead frame or single-sided wiring board, the chip size of the IC chip that can be used is limited to the size of the corresponding lead frame 45a and connection terminal 56a. It became impossible to maintain the information storage capacity required for cash cards equipped with passbook functions, which had been achieved by using double-sided printed circuit boards.
【０００７】[0007]
【発明が解決しようとする課題】上述した従来のＩＣカ
ード用モジュールでは、以下に述べるような問題点が発
生してくる。[Problems to be Solved by the Invention] The conventional IC card module described above has the following problems.
【０００８】まず、両面配線基板を用いた従来技術であ
るが、上述したような前者の方法であると基板の製造コ
ストが高く、必然的にＩＣカードの価格も高くなりＩＣ
カードの普及を妨げていた。そこで後者として説明した
製造コストを低減させるために考えられた両面配線基板
を使用せずに、リードフレームや片面配線基板を使用し
てＩＣカード用モジュールを製造する方法では、基板の
製造コストの低減をはかることは実現できたが、利用出
来るＩＣチップのチップサイズが制限されてしまい、両
面配線基板を利用していたときに用いていたＩＣチップ
を使用することは出来ず、両面配線基板を利用していた
ときの情報記憶容量を維持することが出来なかった。
［発明の構成］First, there is a conventional technique using a double-sided wiring board, but the former method described above requires a high manufacturing cost for the board, which inevitably increases the price of the IC card.
This hindered the spread of cards. Therefore, the latter method of manufacturing IC card modules using a lead frame or a single-sided wiring board without using a double-sided wiring board, which was designed to reduce manufacturing costs, reduces the manufacturing cost of the board. However, the chip size of the IC chips that can be used is limited, and it is not possible to use the IC chips that were used when double-sided wiring boards were used. I was unable to maintain the information storage capacity I had when I was working. [Structure of the invention]
【０００９】[0009]
【課題を解決するための手段】上述したような技術的課
題を解決するために、本発明は、外部機器との通信用の
コンタクト面を形成した複数の接続端子とＩＣチップと
を導電性接着剤を介して固定してなるＩＣカード用モジ
ュールにおいて、前記片面配線基板には前記複数の接続
端子の前記コンタクト面の裏面の一部をそれぞれ露出さ
せる接続孔が穿孔されており、前記ＩＣチップは前記片
面配線基板の前記複数の接続端子を設けた面の裏面の所
定の接続孔上に載置され、少なくとも前記所定の接続孔
に設けられた前記導電性接着剤を介して固定されている
ことを特徴とするＩＣカード用モジュールを提供するも
のである。[Means for Solving the Problems] In order to solve the above-mentioned technical problems, the present invention provides a method for connecting an IC chip and a plurality of connection terminals forming contact surfaces for communication with external equipment by conductive bonding. In the IC card module fixed via an agent, the single-sided wiring board is provided with a connection hole that exposes a part of the back surface of the contact surface of the plurality of connection terminals, and the IC chip is Placed on a predetermined connection hole on the back side of the surface on which the plurality of connection terminals are provided of the single-sided wiring board, and fixed via at least the conductive adhesive provided in the predetermined connection hole. The present invention provides an IC card module having the following features.
【００１０】0010
【作用】本発明は上記構成により両面配線基板を利用し
て得ていた情報記憶容量を持ったＩＣチップの利用が可
能となり、かつＩＣカードの製造コストを低減させるこ
とが可能となる。[Function] With the above-described structure, the present invention makes it possible to use an IC chip with the information storage capacity obtained by using a double-sided wiring board, and also to reduce the manufacturing cost of the IC card.
【００１１】[0011]
【実施例】以下、本発明の一実施例を図１及び図２を参
照しながら説明する。Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.
【００１２】図１は、片面配線基板を利用し、かつ通帳
機能に必要な情報記憶容量の維持を可能にしたＩＣカー
ド用モジュールを示した一部断面図である。図２は、Ｉ
Ｃカード用モジュールの製造にＴＡＢ（Ｔａｐｅ Ａｕ
ｔｏｍａｔｅｄＢｏｎｄｉｎｇ）テープを利用したとき
の状態を示した図である。片面配線基板５は、片面にＩ
Ｃチップ１とＩＣチップ１の電極部３との電気的導通、
及び外部機器（図示しない）との通信用の接続端子６ａ
，６ｂａを有しており、この接続端子６ａ，６ｂには外
部機器との通信をするためのコンタクト面８が形成され
ており、コンタクト面８の裏面にはＩＣチップ１及び電
極部３と電気的導通を得るためのボンディング面７が形
成されている。片面配線基板５にはＩＣチップ１の電極
部３を形成していない面と導通を得る接続端子６ａのボ
ンディング面７を露出させる接続孔９ａと、電極部３と
ボンディングワイヤ２によって導通を得る接続端子６ｂ
のボンディング面７を露出させる接続孔９ｂが形成され
ている。ＩＣチップ１の一部は片面配線基板５上に位置
しており、ＩＣチップ１の電極部３を形成していない面
の全面と接続孔９ａとに設けられた、例えばダイボンデ
ィング用ペーストなどの導電性接着剤４を介して固定さ
れ、接続端子６ａのボンディング面７と導通を得ている
。このような方法でＩＣチップ１を固定しているため、
接続端子６ａの大きさよりチップサイズの大きいＩＣチ
ップ１を使用することが可能となる。ＩＣチップ１が導
電性接着剤４で固定された後、電極部３は接続孔９ｂに
よって露出された接続端子６ｂのボンディング面７とボ
ンディングワイヤ２によりボンディングされて電気的導
通を得る。ＩＣチップ１と電極部３が対応する接続端子
６ａ，６ｂとそれぞれ電気的導通を得た後、ＩＣチップ
１を例えばエポキシ樹脂などの封止樹脂を用いて、ポッ
ティング方法あるいはトランスファーモールド方法など
により樹脂封止してＩＣカード用モジュール１０を製造
する。このとき、図２に示したようにＴＡＢテープ１１
を利用して複数のＩＣカード用モジュール１０を連続し
て製造するようにすることも可能である。FIG. 1 is a partial cross-sectional view showing an IC card module that uses a single-sided wiring board and can maintain the information storage capacity necessary for the bankbook function. Figure 2 shows the I
TAB (Tape Au) is used to manufacture C card modules.
FIG. 3 is a diagram showing a state when using a bonding tape. The single-sided wiring board 5 has I on one side.
Electrical continuity between the C chip 1 and the electrode part 3 of the IC chip 1;
and a connection terminal 6a for communication with external equipment (not shown)
, 6ba, and a contact surface 8 for communicating with an external device is formed on the connection terminals 6a and 6b, and the back surface of the contact surface 8 has an electrical contact with the IC chip 1 and the electrode part 3. A bonding surface 7 is formed to obtain electrical conduction. The single-sided wiring board 5 has a connection hole 9a that exposes the bonding surface 7 of the connection terminal 6a that establishes conduction with the surface of the IC chip 1 on which the electrode section 3 is not formed, and a connection that establishes conduction between the electrode section 3 and the bonding wire 2. terminal 6b
A connection hole 9b is formed to expose the bonding surface 7 of. A part of the IC chip 1 is located on a single-sided wiring board 5, and a paste such as die bonding paste is provided on the entire surface of the IC chip 1 on which the electrode part 3 is not formed and in the connection hole 9a. It is fixed via a conductive adhesive 4 and electrically connected to the bonding surface 7 of the connecting terminal 6a. Since the IC chip 1 is fixed in this way,
It becomes possible to use an IC chip 1 whose chip size is larger than the size of the connection terminal 6a. After the IC chip 1 is fixed with the conductive adhesive 4, the electrode portion 3 is bonded to the bonding surface 7 of the connection terminal 6b exposed through the connection hole 9b by the bonding wire 2 to obtain electrical continuity. After the IC chip 1 and the electrode section 3 are electrically connected to the corresponding connection terminals 6a and 6b, the IC chip 1 is sealed with a sealing resin such as epoxy resin by a potting method or a transfer molding method. The IC card module 10 is manufactured by sealing. At this time, as shown in FIG.
It is also possible to continuously manufacture a plurality of IC card modules 10 using the method.
【００１３】上記したような方法でＩＣカード用モジュ
ールを製造すると、製造コストの低減をはかることがで
き、かつ通帳機能に必要な情報記憶容量を内蔵したＩＣ
チップを片面配線基板上に載置することが可能となった
。[0013] By manufacturing an IC card module using the method described above, manufacturing costs can be reduced and an IC can be manufactured that has a built-in information storage capacity necessary for the passbook function.
It has become possible to mount the chip on a single-sided wiring board.
【００１４】上記実施例では、ＩＣチップの電極部を形
成した面の裏面と、対応する接続端子とをつなぐ接続孔
は１つであったが、複数個の接続孔にしても実施可能で
ある。[0014] In the above embodiment, there is one connection hole that connects the back side of the surface on which the electrode portion of the IC chip is formed and the corresponding connection terminal, but it is also possible to use a plurality of connection holes. .
【００１５】[0015]
【発明の効果】本発明のＩＣカード用モジュールでは、
片面配線基板を利用することによりＩＣカードを安価に
提供すると共に、通帳機能に必要な情報記憶容量を持っ
たＩＣカード用モジュールも提供が可能になった。[Effect of the invention] In the IC card module of the present invention,
By using a single-sided wiring board, it has become possible to provide an IC card at a low cost, and also to provide an IC card module that has the information storage capacity necessary for the passbook function.
【図１】本発明の一実施例を示す一部断面図[Fig. 1] A partial cross-sectional view showing one embodiment of the present invention.
【図２】Ｉ
Ｃカード用モジュールの製造にＴＡＢテープを利用した
図[Figure 2] I
Diagram of using TAB tape to manufacture C-card modules
【図３】両面配線基板を用いた従来技術を示す一部断面
図[Figure 3] Partial cross-sectional view showing conventional technology using a double-sided wiring board
【図４】リードフレームを用いた従来技術を示す一部断
面図[Fig. 4] Partial cross-sectional view showing conventional technology using a lead frame
【図５】片面配線基板を用いた従来技術を示す一部断面
図[Figure 5] Partial cross-sectional view showing conventional technology using a single-sided wiring board
【図６】ＩＣカードの断面図[Figure 6] Cross-sectional view of IC card
１ ＩＣチップ ４ 導電性接着剤 ５ 片面配線基板 ６ａ，６ｂ 接続端子 ８ コンタクト面 ９ａ，９ｂ 接続孔 １０ ＩＣカード用モジュール 1 IC chip 4 Conductive adhesive 5 Single-sided wiring board 6a, 6b connection terminal 8 Contact surface 9a, 9b connection hole 10 IC card module
Claims (1)
した複数の接続端子を有する片面配線基板とＩＣチップ
とを導電性接着剤を介して固定してなるＩＣカード用モ
ジュールにおいて、前記片面配線基板には前記複数の接
続端子の前記コンタクト面の裏面の一部をそれぞれ露出
させる接続孔が穿孔されており、前記ＩＣチップは前記
片面配線基板の前記複数の接続端子を設けた面の裏面の
所定の接続孔上に載置され、少なくとも前記所定の接続
孔に設けられた前記導電性接着剤を介して固定されてい
ることを特徴とするＩＣカード用モジュール。1. An IC card module comprising an IC chip and a single-sided wiring board having a plurality of connection terminals forming a contact surface for communication with an external device, fixed together via a conductive adhesive. Connection holes are formed in the wiring board to expose a part of the back surface of the contact surfaces of the plurality of connection terminals, and the IC chip is connected to the back surface of the surface on which the plurality of connection terminals of the single-sided wiring board are provided. An IC card module, wherein the IC card module is placed on a predetermined connection hole, and is fixed via at least the conductive adhesive provided in the predetermined connection hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3086562A JPH04319497A (en) | 1991-04-18 | 1991-04-18 | Module for ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3086562A JPH04319497A (en) | 1991-04-18 | 1991-04-18 | Module for ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04319497A true JPH04319497A (en) | 1992-11-10 |
Family
ID=13890455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3086562A Pending JPH04319497A (en) | 1991-04-18 | 1991-04-18 | Module for ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04319497A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007538298A (en) * | 2003-10-28 | 2007-12-27 | ジェムプリュス | Manufacturing method of electronic key provided with USB connector and electronic key obtained |
-
1991
- 1991-04-18 JP JP3086562A patent/JPH04319497A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007538298A (en) * | 2003-10-28 | 2007-12-27 | ジェムプリュス | Manufacturing method of electronic key provided with USB connector and electronic key obtained |
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