JPS6283672U - - Google Patents
Info
- Publication number
- JPS6283672U JPS6283672U JP17406785U JP17406785U JPS6283672U JP S6283672 U JPS6283672 U JP S6283672U JP 17406785 U JP17406785 U JP 17406785U JP 17406785 U JP17406785 U JP 17406785U JP S6283672 U JPS6283672 U JP S6283672U
- Authority
- JP
- Japan
- Prior art keywords
- card
- semiconductor device
- arrangement
- cards
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 15
- 238000013500 data storage Methods 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17406785U JPS6283672U (sv) | 1985-11-12 | 1985-11-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17406785U JPS6283672U (sv) | 1985-11-12 | 1985-11-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6283672U true JPS6283672U (sv) | 1987-05-28 |
Family
ID=31112118
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17406785U Pending JPS6283672U (sv) | 1985-11-12 | 1985-11-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6283672U (sv) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5710258A (en) * | 1980-05-20 | 1982-01-19 | Gao Ges Automation Org | Integrated circuit chip carrier element for identification card |
JPS57122559A (en) * | 1980-12-08 | 1982-07-30 | Gao Ges Automation Org | Integrated circuit module support |
-
1985
- 1985-11-12 JP JP17406785U patent/JPS6283672U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5710258A (en) * | 1980-05-20 | 1982-01-19 | Gao Ges Automation Org | Integrated circuit chip carrier element for identification card |
JPS57122559A (en) * | 1980-12-08 | 1982-07-30 | Gao Ges Automation Org | Integrated circuit module support |
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