RU2014142050A - Светоизлучающее устройство, выращенное на кремниевой подложке - Google Patents
Светоизлучающее устройство, выращенное на кремниевой подложке Download PDFInfo
- Publication number
- RU2014142050A RU2014142050A RU2014142050A RU2014142050A RU2014142050A RU 2014142050 A RU2014142050 A RU 2014142050A RU 2014142050 A RU2014142050 A RU 2014142050A RU 2014142050 A RU2014142050 A RU 2014142050A RU 2014142050 A RU2014142050 A RU 2014142050A
- Authority
- RU
- Russia
- Prior art keywords
- layer
- aluminum
- type region
- iii
- transparent material
- Prior art date
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract 3
- 229910052710 silicon Inorganic materials 0.000 title claims abstract 3
- 239000010703 silicon Substances 0.000 title claims abstract 3
- 239000000758 substrate Substances 0.000 title claims abstract 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract 15
- 229910052782 aluminium Inorganic materials 0.000 claims abstract 15
- 239000012780 transparent material Substances 0.000 claims abstract 11
- 229910002704 AlGaN Inorganic materials 0.000 claims abstract 10
- 239000004065 semiconductor Substances 0.000 claims abstract 8
- 239000000463 material Substances 0.000 claims abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
- H01L33/002—Devices characterised by their operation having heterojunctions or graded gap
- H01L33/0025—Devices characterised by their operation having heterojunctions or graded gap comprising only AIIIBV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/12—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/16—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/382—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
1. Устройство, содержащее:полупроводниковую структуру, включающую в себя:III-нитридный светоизлучающий слой, размещенный между областью n-типа и областью p-типа; иалюминийсодержащие слои, AlGaN-слой, расположенный на области n-типа, и AlN-слой, расположенный на AlGaN-слое;прозрачный материал, расположенный на AlN-слое.2. Устройство по п. 1, в котором поверхность прозрачного материала снабжена рисунком.3. Устройство по п. 1, в котором поверхность прозрачного материала структурирована.4. Устройство по п. 1, в котором поверхность пропускающего свет материала выполнена шероховатой.5. Устройство по п. 1, в котором граница раздела, расположенная между алюминийсодержащими слоями и светоизлучающей областью, неплоская.6. Устройство по п. 5, в котором неплоская граница раздела является границей раздела между AlGaN-слоем и областью n-типа.7. Устройство по п. 1, дополнительно включающее в себя пористый полупроводниковый слой, расположенный между алюминийсодержащими слоями и III-нитридным светоизлучающим слоем.8. Устройство, содержащее:полупроводниковую структуру, которая включает в себя:III-нитридный светоизлучающий слой, расположенный между областью n-типа и областью p-типа; иалюминийсодержащий слой; инепрерывную пористую III-нитридную область, расположенную между алюминийсодержащим слоем и III-нитридным светоизлучающим слоем.9. Устройство по п. 8, в котором пористым III-нитридным слоем является GaN, и полупроводниковая структура выращена на кремниевой подложке.10. Устройство по п. 8, в котором алюминийсодержащим слоем являются AlGaN-слой, расположенный на области n-типа, и AlN-слой, расположенный на AlGaN-слое.11. Устройство по п. 8, дополнительно включающее в себя прозрачный материал, расположенный на алюминийсодержащем сло
Claims (15)
1. Устройство, содержащее:
полупроводниковую структуру, включающую в себя:
III-нитридный светоизлучающий слой, размещенный между областью n-типа и областью p-типа; и
алюминийсодержащие слои, AlGaN-слой, расположенный на области n-типа, и AlN-слой, расположенный на AlGaN-слое;
прозрачный материал, расположенный на AlN-слое.
2. Устройство по п. 1, в котором поверхность прозрачного материала снабжена рисунком.
3. Устройство по п. 1, в котором поверхность прозрачного материала структурирована.
4. Устройство по п. 1, в котором поверхность пропускающего свет материала выполнена шероховатой.
5. Устройство по п. 1, в котором граница раздела, расположенная между алюминийсодержащими слоями и светоизлучающей областью, неплоская.
6. Устройство по п. 5, в котором неплоская граница раздела является границей раздела между AlGaN-слоем и областью n-типа.
7. Устройство по п. 1, дополнительно включающее в себя пористый полупроводниковый слой, расположенный между алюминийсодержащими слоями и III-нитридным светоизлучающим слоем.
8. Устройство, содержащее:
полупроводниковую структуру, которая включает в себя:
III-нитридный светоизлучающий слой, расположенный между областью n-типа и областью p-типа; и
алюминийсодержащий слой; и
непрерывную пористую III-нитридную область, расположенную между алюминийсодержащим слоем и III-нитридным светоизлучающим слоем.
9. Устройство по п. 8, в котором пористым III-нитридным слоем является GaN, и полупроводниковая структура выращена на кремниевой подложке.
10. Устройство по п. 8, в котором алюминийсодержащим слоем являются AlGaN-слой, расположенный на области n-типа, и AlN-слой, расположенный на AlGaN-слое.
11. Устройство по п. 8, дополнительно включающее в себя прозрачный материал, расположенный на алюминийсодержащем слое.
12. Устройство по п. 11, в котором поверхность прозрачного материала снабжена рисунком.
13. Устройство по п. 11, в котором поверхность прозрачного материала структурирована.
14. Устройство по п. 11, в котором поверхность прозрачного материала выполнена шероховатой.
15. Устройство по п. 1, в котором граница раздела, расположенная между алюминийсодержащими слоями и светоизлучающей областью, является неплоской.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261612536P | 2012-03-19 | 2012-03-19 | |
US61/612,536 | 2012-03-19 | ||
PCT/IB2013/052137 WO2013140320A1 (en) | 2012-03-19 | 2013-03-18 | Light emitting device grown on a silicon substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
RU2014142050A true RU2014142050A (ru) | 2016-05-20 |
RU2657335C2 RU2657335C2 (ru) | 2018-06-13 |
Family
ID=48326360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
RU2014142050A RU2657335C2 (ru) | 2012-03-19 | 2013-03-18 | Светоизлучающее устройство, выращенное на кремниевой подложке |
Country Status (8)
Country | Link |
---|---|
US (1) | US20150084058A1 (ru) |
EP (1) | EP2828899B1 (ru) |
JP (2) | JP6574130B2 (ru) |
KR (1) | KR102116152B1 (ru) |
CN (2) | CN104205369A (ru) |
RU (1) | RU2657335C2 (ru) |
TW (2) | TWI594457B (ru) |
WO (1) | WO2013140320A1 (ru) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11095096B2 (en) | 2014-04-16 | 2021-08-17 | Yale University | Method for a GaN vertical microcavity surface emitting laser (VCSEL) |
JP7016259B6 (ja) | 2014-09-30 | 2023-12-15 | イェール ユニバーシティー | 多孔質窒化ガリウム層およびそれを含む半導体発光デバイス |
US11018231B2 (en) | 2014-12-01 | 2021-05-25 | Yale University | Method to make buried, highly conductive p-type III-nitride layers |
WO2016187421A1 (en) * | 2015-05-19 | 2016-11-24 | Yale University | A method and device concerning iii-nitride edge emitting laser diode of high confinement factor with lattice matched cladding layer |
US10096975B1 (en) | 2017-03-27 | 2018-10-09 | International Business Machines Corporation | Laterally grown edge emitting laser |
KR20220140749A (ko) * | 2020-01-22 | 2022-10-18 | 포로 테크놀로지스 리미티드 | 적색 led 및 제작 방법 |
GB2593693B (en) * | 2020-03-30 | 2022-08-03 | Plessey Semiconductors Ltd | LED precursor |
Family Cites Families (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3325479B2 (ja) * | 1997-01-30 | 2002-09-17 | 株式会社東芝 | 化合物半導体素子及びその製造方法 |
US6266355B1 (en) * | 1997-09-12 | 2001-07-24 | Sdl, Inc. | Group III-V nitride laser devices with cladding layers to suppress defects such as cracking |
JP5965095B2 (ja) * | 1999-12-03 | 2016-08-10 | クリー インコーポレイテッドCree Inc. | 内部および外部光学要素による光取出しを向上させた発光ダイオード |
JP2001223165A (ja) * | 2000-02-10 | 2001-08-17 | Hitachi Cable Ltd | 窒化物半導体及びその製造方法 |
JP2003218396A (ja) * | 2001-11-15 | 2003-07-31 | Mitsubishi Cable Ind Ltd | 紫外線発光素子 |
JP3960815B2 (ja) * | 2002-02-12 | 2007-08-15 | シャープ株式会社 | 半導体発光素子 |
JP2003347601A (ja) * | 2002-05-28 | 2003-12-05 | Matsushita Electric Works Ltd | 発光ダイオード照明装置 |
JP4329374B2 (ja) * | 2002-07-29 | 2009-09-09 | パナソニック電工株式会社 | 発光素子およびその製造方法 |
CN100375301C (zh) * | 2002-11-06 | 2008-03-12 | 三垦电气株式会社 | 半导体发光元件及其制造方法 |
JP4590905B2 (ja) * | 2003-10-31 | 2010-12-01 | 豊田合成株式会社 | 発光素子および発光装置 |
JP2005244201A (ja) * | 2004-01-28 | 2005-09-08 | Matsushita Electric Ind Co Ltd | 半導体発光素子及びその製造方法 |
JP4843235B2 (ja) * | 2004-03-18 | 2011-12-21 | 昭和電工株式会社 | Iii族窒化物半導体発光素子の製造方法 |
WO2005091390A1 (en) * | 2004-03-18 | 2005-09-29 | Showa Denko K.K. | Group iii nitride semiconductor light-emitting device and producing method thereof |
JP2007533164A (ja) * | 2004-04-15 | 2007-11-15 | トラスティーズ オブ ボストン ユニバーシティ | テクスチャ出しされた半導体層を特徴とする光学装置 |
JP2006093602A (ja) * | 2004-09-27 | 2006-04-06 | Toyoda Gosei Co Ltd | 発光素子 |
JP4857596B2 (ja) * | 2004-06-24 | 2012-01-18 | 豊田合成株式会社 | 発光素子の製造方法 |
US7256483B2 (en) | 2004-10-28 | 2007-08-14 | Philips Lumileds Lighting Company, Llc | Package-integrated thin film LED |
KR100712753B1 (ko) * | 2005-03-09 | 2007-04-30 | 주식회사 실트론 | 화합물 반도체 장치 및 그 제조방법 |
US8674375B2 (en) * | 2005-07-21 | 2014-03-18 | Cree, Inc. | Roughened high refractive index layer/LED for high light extraction |
JP4476912B2 (ja) * | 2005-09-29 | 2010-06-09 | 株式会社東芝 | 半導体発光素子およびその製造方法 |
TWI270222B (en) * | 2005-10-07 | 2007-01-01 | Formosa Epitaxy Inc | Light emitting diode chip |
JP2007134388A (ja) * | 2005-11-08 | 2007-05-31 | Sharp Corp | 窒化物系半導体素子とその製造方法 |
US8729580B2 (en) * | 2005-12-06 | 2014-05-20 | Toshiba Techno Center, Inc. | Light emitter with metal-oxide coating |
JP2007266571A (ja) * | 2006-02-28 | 2007-10-11 | Mitsubishi Cable Ind Ltd | Ledチップ、その製造方法および発光装置 |
CN101043059A (zh) * | 2006-03-24 | 2007-09-26 | 中国科学院半导体研究所 | 采用衬底表面粗化技术的倒装结构发光二极管制作方法 |
JP2007329464A (ja) * | 2006-05-09 | 2007-12-20 | Mitsubishi Chemicals Corp | 半導体発光素子 |
JP2008117922A (ja) * | 2006-11-02 | 2008-05-22 | Yamaguchi Univ | 半導体発光素子及びその製造方法 |
TWI369009B (en) * | 2007-09-21 | 2012-07-21 | Nat Univ Chung Hsing | Light-emitting chip device with high thermal conductivity |
JP5437253B2 (ja) * | 2007-10-12 | 2014-03-12 | エイジェンシー フォア サイエンス テクノロジー アンド リサーチ | 蛍光体を含まない赤色及び白色窒化物ベースのledの作製 |
CN101257075B (zh) * | 2008-03-13 | 2010-05-12 | 鹤山丽得电子实业有限公司 | 一种发光二极管器件及其制造方法 |
JP5164641B2 (ja) * | 2008-04-02 | 2013-03-21 | Dowaエレクトロニクス株式会社 | 電流狭窄型半導体発光素子の製造方法 |
JP4719244B2 (ja) * | 2008-04-25 | 2011-07-06 | シャープ株式会社 | 窒化物系化合物半導体発光素子およびその製造方法 |
JP2009289947A (ja) * | 2008-05-29 | 2009-12-10 | Kyocera Corp | 発光素子及び照明装置 |
DE102008030584A1 (de) * | 2008-06-27 | 2009-12-31 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Bauelementes und optoelektronisches Bauelement |
CN102067339B (zh) * | 2008-08-19 | 2013-03-06 | 晶能光电(江西)有限公司 | 一种制备具有金属衬底的InGaAlN发光二极管的方法 |
TWI401729B (zh) * | 2008-10-16 | 2013-07-11 | Advanced Optoelectronic Tech | 阻斷半導體差排缺陷之方法 |
US8809893B2 (en) * | 2008-11-14 | 2014-08-19 | Samsung Electronics Co., Ltd. | Semiconductor light emitting device |
JP5311408B2 (ja) * | 2008-12-26 | 2013-10-09 | シャープ株式会社 | 窒化物半導体発光素子 |
WO2010112980A1 (en) * | 2009-04-02 | 2010-10-07 | Philips Lumileds Lighting Company, Llc | Iii-nitride light emitting device including porous semiconductor layer |
JP5597933B2 (ja) * | 2009-05-01 | 2014-10-01 | 住友電気工業株式会社 | Iii族窒化物半導体層貼り合わせ基板およびその製造方法 |
JP2011082233A (ja) * | 2009-10-05 | 2011-04-21 | Hitachi Cable Ltd | 発光素子 |
KR101082788B1 (ko) * | 2009-10-16 | 2011-11-14 | 한국산업기술대학교산학협력단 | 다공성 질화물 반도체 상의 고품질 비극성/반극성 반도체 소자 및 그 제조 방법 |
EP2529394A4 (en) * | 2010-01-27 | 2017-11-15 | Yale University | Conductivity based selective etch for gan devices and applications thereof |
US8642368B2 (en) * | 2010-03-12 | 2014-02-04 | Applied Materials, Inc. | Enhancement of LED light extraction with in-situ surface roughening |
US8692198B2 (en) * | 2010-04-21 | 2014-04-08 | Sionyx, Inc. | Photosensitive imaging devices and associated methods |
US8154052B2 (en) * | 2010-05-06 | 2012-04-10 | Koninklijke Philips Electronics N.V. | Light emitting device grown on wavelength converting substrate |
JP5277270B2 (ja) * | 2010-07-08 | 2013-08-28 | 学校法人立命館 | 結晶成長方法および半導体素子 |
US8723201B2 (en) * | 2010-08-20 | 2014-05-13 | Invenlux Corporation | Light-emitting devices with substrate coated with optically denser material |
JP2012124306A (ja) * | 2010-12-08 | 2012-06-28 | Toyoda Gosei Co Ltd | 半導体発光素子 |
US20130026480A1 (en) * | 2011-07-25 | 2013-01-31 | Bridgelux, Inc. | Nucleation of Aluminum Nitride on a Silicon Substrate Using an Ammonia Preflow |
US20130082274A1 (en) * | 2011-09-29 | 2013-04-04 | Bridgelux, Inc. | Light emitting devices having dislocation density maintaining buffer layers |
JP5803708B2 (ja) * | 2012-02-03 | 2015-11-04 | 豊田合成株式会社 | 半導体発光素子の製造方法 |
US8946747B2 (en) * | 2012-02-13 | 2015-02-03 | Cree, Inc. | Lighting device including multiple encapsulant material layers |
-
2013
- 2013-03-18 US US14/384,173 patent/US20150084058A1/en not_active Abandoned
- 2013-03-18 CN CN201380015388.6A patent/CN104205369A/zh active Pending
- 2013-03-18 WO PCT/IB2013/052137 patent/WO2013140320A1/en active Application Filing
- 2013-03-18 EP EP13721400.3A patent/EP2828899B1/en active Active
- 2013-03-18 KR KR1020147029213A patent/KR102116152B1/ko active IP Right Grant
- 2013-03-18 JP JP2015501026A patent/JP6574130B2/ja active Active
- 2013-03-18 CN CN201910406069.7A patent/CN110246941A/zh active Pending
- 2013-03-18 RU RU2014142050A patent/RU2657335C2/ru active
- 2013-03-19 TW TW102109746A patent/TWI594457B/zh active
- 2013-03-19 TW TW106114060A patent/TW201735398A/zh unknown
-
2018
- 2018-08-10 JP JP2018150949A patent/JP2019004164A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP2828899A1 (en) | 2015-01-28 |
EP2828899B1 (en) | 2018-12-26 |
TW201349574A (zh) | 2013-12-01 |
TW201735398A (zh) | 2017-10-01 |
TWI594457B (zh) | 2017-08-01 |
US20150084058A1 (en) | 2015-03-26 |
KR20140144228A (ko) | 2014-12-18 |
CN104205369A (zh) | 2014-12-10 |
JP6574130B2 (ja) | 2019-09-11 |
KR102116152B1 (ko) | 2020-05-28 |
JP2019004164A (ja) | 2019-01-10 |
RU2657335C2 (ru) | 2018-06-13 |
CN110246941A (zh) | 2019-09-17 |
JP2015514312A (ja) | 2015-05-18 |
WO2013140320A1 (en) | 2013-09-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
RU2014142050A (ru) | Светоизлучающее устройство, выращенное на кремниевой подложке | |
WO2013049415A3 (en) | P-type doping layers for use with light emitting devices | |
EA201890167A1 (ru) | Светодиоды и фотодетекторы, сформированные из нанопроводников/нанопирамид | |
TW200733419A (en) | Light emitting diode bonded with metal diffusion and manufacturing method thereof | |
TW200644287A (en) | Polarization-reversed III-nitride light-emitting device | |
WO2014167455A3 (en) | Top emitting semiconductor light emitting device | |
RU2012157560A (ru) | Светоизлучающее устройство и способ изготовления светоизлучающего устройства | |
JP2016518713A5 (ru) | ||
RU2012147484A (ru) | Светоизлучающий прибор и способ его изготовления | |
RU2014138822A (ru) | Интеграция светодиодов на нитриде галлия с приборами на нитриде алюминия-галлия/нитриде галлия на кремниевых подложках для светодиодов переменного тока | |
ATE535027T1 (de) | Lichtemittierende iii-nitrid-vorrichtung mit spannungsreduzierter lichtemittierender schicht | |
TW200705710A (en) | Light emitting diodes (LEDs) with improved light extraction by roughening | |
TW200635084A (en) | Light emitting device | |
TW200603436A (en) | Photonic crystal light emitting device | |
WO2008153130A1 (ja) | 窒化物半導体発光素子及び窒化物半導体の製造方法 | |
EP2731150A3 (en) | Light emitting device and method of fabricating the same | |
MY183934A (en) | Light emitting diode and fabrication method thereof | |
WO2012164437A3 (en) | Light emitting device bonded to a support substrate | |
GB2483388A (en) | Light emitting diodes | |
TR201111229A2 (tr) | Aşınma durdurma katmanlı n-tipi kapatma yapısına sahip dikey ışık yayan diyot (vled) kalıp ve bunun üretim yöntemi. | |
EP2509122A3 (en) | Encapsulating sheet, light emitting diode device, and a method for producing the same | |
JP2014067876A5 (ru) | ||
EP2519982A4 (en) | EPITAXIAL WAFERS, METHOD FOR THE PRODUCTION THEREOF, AND METHOD FOR PRODUCING AN LED CHIP | |
WO2009069785A1 (ja) | 発光素子及び照明装置 | |
WO2012173416A3 (en) | Semiconductor light emitting device and method of menufacturing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
HZ9A | Changing address for correspondence with an applicant |