RU2011142629A - Самоорганизующиеся термоэлектрические материалы - Google Patents
Самоорганизующиеся термоэлектрические материалы Download PDFInfo
- Publication number
- RU2011142629A RU2011142629A RU2011142629/05A RU2011142629A RU2011142629A RU 2011142629 A RU2011142629 A RU 2011142629A RU 2011142629/05 A RU2011142629/05 A RU 2011142629/05A RU 2011142629 A RU2011142629 A RU 2011142629A RU 2011142629 A RU2011142629 A RU 2011142629A
- Authority
- RU
- Russia
- Prior art keywords
- combination
- phase
- thermoelectric material
- metal
- particles
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims abstract 17
- 229910052751 metal Inorganic materials 0.000 claims abstract 14
- 239000002184 metal Substances 0.000 claims abstract 14
- 239000002245 particle Substances 0.000 claims abstract 10
- 229910052735 hafnium Inorganic materials 0.000 claims abstract 8
- 229910052742 iron Inorganic materials 0.000 claims abstract 8
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract 8
- 229910052758 niobium Inorganic materials 0.000 claims abstract 8
- 229910052697 platinum Inorganic materials 0.000 claims abstract 8
- 229910052711 selenium Inorganic materials 0.000 claims abstract 8
- 229910052717 sulfur Inorganic materials 0.000 claims abstract 8
- 229910052715 tantalum Inorganic materials 0.000 claims abstract 8
- 229910052714 tellurium Inorganic materials 0.000 claims abstract 8
- 229910052719 titanium Inorganic materials 0.000 claims abstract 8
- 229910052721 tungsten Inorganic materials 0.000 claims abstract 8
- 229910052726 zirconium Inorganic materials 0.000 claims abstract 8
- 150000004770 chalcogenides Chemical class 0.000 claims abstract 7
- 229910052759 nickel Inorganic materials 0.000 claims abstract 7
- 229910052763 palladium Inorganic materials 0.000 claims abstract 7
- 238000000034 method Methods 0.000 claims abstract 6
- 229910052709 silver Inorganic materials 0.000 claims abstract 5
- 229910052782 aluminium Inorganic materials 0.000 claims abstract 4
- 229910052787 antimony Inorganic materials 0.000 claims abstract 4
- 229910052785 arsenic Inorganic materials 0.000 claims abstract 4
- 229910052797 bismuth Inorganic materials 0.000 claims abstract 4
- 229910052793 cadmium Inorganic materials 0.000 claims abstract 4
- 229910052804 chromium Inorganic materials 0.000 claims abstract 4
- 229910052802 copper Inorganic materials 0.000 claims abstract 4
- 229910052733 gallium Inorganic materials 0.000 claims abstract 4
- 229910052732 germanium Inorganic materials 0.000 claims abstract 4
- 229910052737 gold Inorganic materials 0.000 claims abstract 4
- 229910052738 indium Inorganic materials 0.000 claims abstract 4
- 229910052741 iridium Inorganic materials 0.000 claims abstract 4
- 229910052745 lead Inorganic materials 0.000 claims abstract 4
- 229910052748 manganese Inorganic materials 0.000 claims abstract 4
- 239000011159 matrix material Substances 0.000 claims abstract 4
- 229910052762 osmium Inorganic materials 0.000 claims abstract 4
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract 4
- 229910052703 rhodium Inorganic materials 0.000 claims abstract 4
- 229910052707 ruthenium Inorganic materials 0.000 claims abstract 4
- 229910052710 silicon Inorganic materials 0.000 claims abstract 4
- 229910052718 tin Inorganic materials 0.000 claims abstract 4
- 229910052720 vanadium Inorganic materials 0.000 claims abstract 4
- 229910052725 zinc Inorganic materials 0.000 claims abstract 4
- 238000004519 manufacturing process Methods 0.000 claims abstract 2
- 238000009827 uniform distribution Methods 0.000 claims abstract 2
- 150000002739 metals Chemical class 0.000 claims 1
- 238000003801 milling Methods 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B19/00—Selenium; Tellurium; Compounds thereof
- C01B19/007—Tellurides or selenides of metals
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B17/00—Sulfur; Compounds thereof
- C01B17/20—Methods for preparing sulfides or polysulfides, in general
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B19/00—Selenium; Tellurium; Compounds thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B19/00—Selenium; Tellurium; Compounds thereof
- C01B19/002—Compounds containing, besides selenium or tellurium, more than one other element, with -O- and -OH not being considered as anions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/80—Particles consisting of a mixture of two or more inorganic phases
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/10—Process efficiency
- Y02P20/129—Energy recovery, e.g. by cogeneration, H2recovery or pressure recovery turbines
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP09156007.8 | 2009-03-24 | ||
| EP09156007 | 2009-03-24 | ||
| PCT/EP2010/053762 WO2010108912A2 (de) | 2009-03-24 | 2010-03-23 | Selbstorganisierende thermoelektrische materialien |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| RU2011142629A true RU2011142629A (ru) | 2013-04-27 |
Family
ID=42536435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2011142629/05A RU2011142629A (ru) | 2009-03-24 | 2010-03-23 | Самоорганизующиеся термоэлектрические материалы |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US8785762B2 (enExample) |
| EP (1) | EP2411324A2 (enExample) |
| JP (1) | JP5636419B2 (enExample) |
| KR (1) | KR20120001776A (enExample) |
| CN (1) | CN102414121A (enExample) |
| CA (1) | CA2756497A1 (enExample) |
| RU (1) | RU2011142629A (enExample) |
| SG (1) | SG174453A1 (enExample) |
| TW (1) | TW201039473A (enExample) |
| WO (1) | WO2010108912A2 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8513050B1 (en) * | 2010-06-15 | 2013-08-20 | U.S. Department Of Energy | Bi-Se doped with Cu, p-type semiconductor |
| WO2012157916A1 (ko) * | 2011-05-13 | 2012-11-22 | 주식회사 엘지화학 | 신규한 화합물 반도체 및 그 활용 |
| CN102867905B (zh) * | 2012-07-27 | 2015-10-28 | 清华大学 | 一种Sn-S基热电化合物及其制备方法 |
| CN102912333B (zh) * | 2012-09-20 | 2014-05-14 | 上海大学 | 利用层层自组装制备热电薄膜的方法 |
| WO2014063191A1 (en) * | 2012-10-26 | 2014-05-01 | Newcastle Innovation Limited | Alloys with inverse microstructures |
| TWI472070B (zh) * | 2012-12-13 | 2015-02-01 | Ind Tech Res Inst | 熱電複合材料及其製作方法 |
| KR102097064B1 (ko) | 2013-05-28 | 2020-04-03 | 삼성전자주식회사 | 복합열전재료, 이를 포함하는 열전소자 및 열전장치, 및 이의 제조방법 |
| JP6252413B2 (ja) * | 2013-11-19 | 2017-12-27 | 日立金属株式会社 | 熱電変換材料及びそれを用いた熱電変換モジュール |
| JP6292664B2 (ja) * | 2014-01-28 | 2018-03-14 | 株式会社豊島製作所 | 熱電変換材料 |
| CN104218143B (zh) * | 2014-08-20 | 2017-06-13 | 中国航空工业集团公司北京航空材料研究院 | 一种BiAgSeTe基热电材料的制备方法 |
| CN104388805A (zh) * | 2014-10-31 | 2015-03-04 | 无锡贺邦金属制品有限公司 | 一种具有发热功能的复合合金材料 |
| CN108886081B (zh) * | 2016-03-31 | 2022-05-13 | 住友化学株式会社 | 化合物及热电转换材料 |
| CN105755347A (zh) * | 2016-04-20 | 2016-07-13 | 苏州市相城区明达复合材料厂 | 一种铸造用表面强化镍基硬面合金 |
| CN105755348A (zh) * | 2016-04-20 | 2016-07-13 | 苏州市相城区明达复合材料厂 | 一种铸造用光亮镀层合金 |
| JP7056934B2 (ja) * | 2016-12-19 | 2022-04-19 | 国立大学法人東北大学 | 熱電材料および熱電モジュール |
| JPWO2018123899A1 (ja) | 2016-12-26 | 2019-10-31 | 国立大学法人名古屋大学 | 熱電変換材料および熱電変換素子 |
| CN108470817B (zh) * | 2018-01-19 | 2021-09-28 | 宁波工程学院 | 一种含Sb的P-型Cu2.856In4Te8基中高温热电材料及其制备工艺 |
| CN111162160B (zh) * | 2018-11-08 | 2023-09-26 | 中国科学院大连化学物理研究所 | 一种p型立方相Ge-Se基热电材料及制备方法 |
| CN113437208B (zh) * | 2020-03-23 | 2023-12-26 | 中国科学院上海硅酸盐研究所 | 一种制备热电厚膜的方法 |
| CN113956042B (zh) * | 2021-09-18 | 2023-02-03 | 深圳大学 | 一种菱方相GeSe基热电材料及其制备方法 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5439528A (en) | 1992-12-11 | 1995-08-08 | Miller; Joel | Laminated thermo element |
| US5448109B1 (en) | 1994-03-08 | 1997-10-07 | Tellurex Corp | Thermoelectric module |
| JPH0969653A (ja) * | 1995-08-31 | 1997-03-11 | Isuzu Motors Ltd | 熱電材料及びその製造方法 |
| JPH09100166A (ja) * | 1995-10-06 | 1997-04-15 | Tokuyama Corp | 複合焼結体 |
| AU6783598A (en) | 1997-03-31 | 1998-10-22 | Research Triangle Institute | Thin-film thermoelectric device and fabrication method of same |
| JP4324999B2 (ja) * | 1998-11-27 | 2009-09-02 | アイシン精機株式会社 | 熱電半導体組成物及びその製造方法 |
| DE19955788A1 (de) | 1999-11-19 | 2001-05-23 | Basf Ag | Thermoelektrisch aktive Materialien und diese enthaltende Generatoren |
| JP4459400B2 (ja) * | 2000-07-13 | 2010-04-28 | 旭化成株式会社 | 熱電材料およびその製造方法 |
| JP3559962B2 (ja) | 2000-09-04 | 2004-09-02 | 日本航空電子工業株式会社 | 熱電変換材料及びその製造方法 |
| JP2004281816A (ja) * | 2003-03-17 | 2004-10-07 | Niigata Tlo:Kk | 混合熱電材料 |
| US8481843B2 (en) * | 2003-09-12 | 2013-07-09 | Board Of Trustees Operating Michigan State University | Silver-containing p-type semiconductor |
| JP4415640B2 (ja) * | 2003-10-22 | 2010-02-17 | トヨタ自動車株式会社 | 熱電変換素子 |
| WO2006085929A2 (en) | 2004-06-14 | 2006-08-17 | Delphi Technologies, Inc. | Thermoelectric materials comprising nanoscale inclusions to enhance seebeck coefficient |
| US7465871B2 (en) * | 2004-10-29 | 2008-12-16 | Massachusetts Institute Of Technology | Nanocomposites with high thermoelectric figures of merit |
| US7847179B2 (en) * | 2005-06-06 | 2010-12-07 | Board Of Trustees Of Michigan State University | Thermoelectric compositions and process |
| US8716589B2 (en) * | 2006-03-16 | 2014-05-06 | Basf Aktiengesellschaft | Doped lead tellurides for thermoelectric applications |
| US7807917B2 (en) * | 2006-07-26 | 2010-10-05 | Translucent, Inc. | Thermoelectric and pyroelectric energy conversion devices |
| CN101681979B (zh) * | 2007-06-05 | 2012-10-24 | 丰田自动车株式会社 | 热电转换元件及其制造方法 |
| TW200933940A (en) | 2007-12-28 | 2009-08-01 | Basf Se | Extrusion process for preparing improved thermoelectric materials |
| DE102008005694B4 (de) | 2008-01-23 | 2015-05-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung eines thermoelektrischen Bauelementes |
| CN101965313A (zh) | 2008-02-07 | 2011-02-02 | 巴斯夫欧洲公司 | 用于热电应用的掺杂的碲化锡 |
| WO2010080279A2 (en) * | 2008-12-19 | 2010-07-15 | Carrier Corporation | Bulk-processed, enhanced figure-of-merit thermoelectric materials |
| RU2011138927A (ru) | 2009-02-25 | 2013-04-10 | Басф Се | Способ изготовления гибких металлических контактов |
| SG174559A1 (en) * | 2009-04-02 | 2011-10-28 | Basf Se | Thermoelectric module with insulated substrate |
| CA2768979A1 (en) * | 2009-07-27 | 2011-02-03 | Basf Se | Method for sintering thermoelectric materials |
-
2010
- 2010-03-23 SG SG2011067311A patent/SG174453A1/en unknown
- 2010-03-23 EP EP10709844A patent/EP2411324A2/de not_active Withdrawn
- 2010-03-23 WO PCT/EP2010/053762 patent/WO2010108912A2/de not_active Ceased
- 2010-03-23 JP JP2012501281A patent/JP5636419B2/ja not_active Expired - Fee Related
- 2010-03-23 KR KR1020117025012A patent/KR20120001776A/ko not_active Withdrawn
- 2010-03-23 CN CN2010800178818A patent/CN102414121A/zh active Pending
- 2010-03-23 RU RU2011142629/05A patent/RU2011142629A/ru unknown
- 2010-03-23 CA CA2756497A patent/CA2756497A1/en not_active Abandoned
- 2010-03-23 US US13/259,454 patent/US8785762B2/en not_active Expired - Fee Related
- 2010-03-24 TW TW099108766A patent/TW201039473A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010108912A2 (de) | 2010-09-30 |
| EP2411324A2 (de) | 2012-02-01 |
| US20120001117A1 (en) | 2012-01-05 |
| TW201039473A (en) | 2010-11-01 |
| WO2010108912A3 (de) | 2011-06-03 |
| JP5636419B2 (ja) | 2014-12-03 |
| US8785762B2 (en) | 2014-07-22 |
| CN102414121A (zh) | 2012-04-11 |
| JP2012521648A (ja) | 2012-09-13 |
| KR20120001776A (ko) | 2012-01-04 |
| SG174453A1 (en) | 2011-10-28 |
| CA2756497A1 (en) | 2010-09-30 |
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