PL3807041T3 - System i sposób monitorowania i/lub sterowania przetwarzaniem z oscylacją z obrazowaniem koherentnym w linii (ici) - Google Patents

System i sposób monitorowania i/lub sterowania przetwarzaniem z oscylacją z obrazowaniem koherentnym w linii (ici)

Info

Publication number
PL3807041T3
PL3807041T3 PL19837754.1T PL19837754T PL3807041T3 PL 3807041 T3 PL3807041 T3 PL 3807041T3 PL 19837754 T PL19837754 T PL 19837754T PL 3807041 T3 PL3807041 T3 PL 3807041T3
Authority
PL
Poland
Prior art keywords
ici
monitoring
processing
coherent imaging
inline coherent
Prior art date
Application number
PL19837754.1T
Other languages
English (en)
Inventor
Christopher M. GALBRAITH
Jordan A. KANKO
Paul J.L. Webster
Original Assignee
Ipg Photonics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ipg Photonics Corporation filed Critical Ipg Photonics Corporation
Publication of PL3807041T3 publication Critical patent/PL3807041T3/pl

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/21Bonding by welding
    • B23K26/24Seam welding
    • B23K26/242Fillet welding, i.e. involving a weld of substantially triangular cross section joining two parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/21Bonding by welding
    • B23K26/24Seam welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/21Bonding by welding
    • B23K26/24Seam welding
    • B23K26/26Seam welding of rectilinear seams
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/32Bonding taking account of the properties of the material involved
    • B23K26/323Bonding taking account of the properties of the material involved involving parts made of dissimilar metallic material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10Scanning systems
    • G02B26/105Scanning systems with one or more pivoting mirrors or galvano-mirrors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06Construction or shape of active medium
    • H01S3/063Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
    • H01S3/067Fibre lasers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/18Sheet panels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/02Iron or ferrous alloys
    • B23K2103/04Steel or steel alloys
    • B23K2103/05Stainless steel
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/10Aluminium or alloys thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/12Copper or alloys thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/18Dissimilar materials

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
PL19837754.1T 2018-07-19 2019-07-18 System i sposób monitorowania i/lub sterowania przetwarzaniem z oscylacją z obrazowaniem koherentnym w linii (ici) PL3807041T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862700606P 2018-07-19 2018-07-19
US201962853368P 2019-05-28 2019-05-28
PCT/US2019/042436 WO2020018814A1 (en) 2018-07-19 2019-07-18 Systems and methods for monitoring and/or controlling wobble-processing using inline coherent imaging (ici)

Publications (1)

Publication Number Publication Date
PL3807041T3 true PL3807041T3 (pl) 2026-01-26

Family

ID=69148038

Family Applications (1)

Application Number Title Priority Date Filing Date
PL19837754.1T PL3807041T3 (pl) 2018-07-19 2019-07-18 System i sposób monitorowania i/lub sterowania przetwarzaniem z oscylacją z obrazowaniem koherentnym w linii (ici)

Country Status (12)

Country Link
US (2) US12097572B2 (pl)
EP (2) EP3807041B1 (pl)
JP (1) JP7502261B2 (pl)
KR (2) KR102730151B1 (pl)
CN (2) CN112469526B (pl)
CA (1) CA3106370A1 (pl)
DE (1) DE102019210618A1 (pl)
ES (1) ES3053133T3 (pl)
MX (1) MX2021000687A (pl)
PL (1) PL3807041T3 (pl)
SG (1) SG11202100407UA (pl)
WO (1) WO2020018814A1 (pl)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017211982B4 (de) * 2017-07-13 2019-04-18 Trumpf Laser- Und Systemtechnik Gmbh Verfahren und Vorrichtung zum Fügen von mindestens zwei Werkstücken
FR3089442B1 (fr) * 2018-12-05 2020-12-18 Airbus Operations Sas Procédé d’assemblage d’au moins deux pièces par soudage par transparence, procédé d’assemblage d’une structure primaire d’un mât d’aéronef par soudage par transparence, structure primaire d’un mât d’aéronef ainsi obtenue et aéronef comprenant ladite structure primaire
WO2020132282A1 (en) 2018-12-19 2020-06-25 Ipg Photonics Corporation Monitoring material processing using imaging signal density determined from inline coherent imaging (ici)
JP7332149B2 (ja) * 2019-09-27 2023-08-23 株式会社トヨコー レーザ照射装置
JP7396851B2 (ja) * 2019-10-18 2023-12-12 ファナック株式会社 制御装置、制御システム、及びプログラム
US11305377B2 (en) * 2019-12-23 2022-04-19 Precitec Gmbh & Co. Kg Add-on module for interposing between a control device and a laser machining head of a laser machining system
BR112022020803A2 (pt) 2020-04-16 2022-11-29 Ipg Photonics Corp Calibração estática e dinâmica para sistemas e métodos de medição de imagem de coerência
TWI723877B (zh) * 2020-05-13 2021-04-01 國家中山科學研究院 插件式同軸熱輻射影像量測系統
CN120572129A (zh) * 2020-05-14 2025-09-02 伊雷克托科学工业股份有限公司 促进激光加工工件的导引检测的激光加工设备以及其操作的方法
JP7641460B2 (ja) * 2020-05-27 2025-03-07 パナソニックIpマネジメント株式会社 レーザ溶接方法及びレーザ溶接装置
JP7515074B2 (ja) * 2020-06-19 2024-07-12 パナソニックIpマネジメント株式会社 レーザ溶接方法および装置
US12403548B2 (en) * 2020-08-19 2025-09-02 Panasonic Intellectual Property Management Co., Ltd. Laser processing apparatus and laser processing method
JP2022060808A (ja) * 2020-10-05 2022-04-15 パナソニックIpマネジメント株式会社 レーザ溶接方法及びレーザ溶接装置
CN116368420B (zh) * 2020-10-13 2026-03-20 发那科株式会社 检流计扫描器以及使用该检流计扫描器的激光加工装置
JP7503754B2 (ja) * 2020-11-09 2024-06-21 パナソニックIpマネジメント株式会社 評価方法、評価システム及びレーザ加工システム
WO2022117207A1 (de) 2020-12-04 2022-06-09 Lessmueller Lasertechnik Gmbh Verfahren, vorrichtung und bearbeitungssystem zum überwachen eines bearbeitungsprozesses eines werkstücks mittels eines hochenergetischen bearbeitungsstrahls
EP4032652B1 (de) 2021-01-26 2024-10-09 Precitec GmbH & Co. KG Materialbearbeitungssystem und -verfahren mittels laserstrahl mit wobbel-bewegung
CN112894138B (zh) * 2021-03-04 2023-06-16 武汉逸飞激光股份有限公司 软包电池极耳焊接方法及系统
GB2605409A (en) * 2021-03-31 2022-10-05 Jaguar Land Rover Ltd Laser welding penetration monitoring
GB2605412B (en) * 2021-03-31 2025-05-14 Jaguar Land Rover Ltd Methods for Welding Components of Battery Modules
GB2605410B (en) * 2021-03-31 2025-03-12 Jaguar Land Rover Ltd Methods for Welding Components of Battery Modules
DE102021108662A1 (de) 2021-04-07 2022-10-13 Precitec Gmbh & Co. Kg Verfahren zum Überwachen eines Laserbearbeitungsprozesses und dazugehöriges Laserbearbeitungssystem
KR102642403B1 (ko) * 2021-04-16 2024-02-29 한국기계연구원 레이저 클리닝 장치 및 속도 가변 틸팅 레이저 광학계
US12123743B2 (en) 2021-04-23 2024-10-22 Honeywell International Inc. Methods and systems for detecting wind shear conditions in an urban airspace
JP2023042497A (ja) * 2021-11-17 2023-03-27 株式会社キーエンス レーザ加工装置
WO2023110584A1 (de) * 2021-12-17 2023-06-22 Trumpf Laser- Und Systemtechnik Gmbh VERFAHREN ZUM SCHWEIßEN VON BLECHEN MIT BESCHICHTUNGEN, DIE EINE LEGIERUNG AUS ALUMINIUM UND SILIZIUM UMFASSEN
DE102022100230A1 (de) 2022-01-05 2023-07-06 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Fügen von zwei Komponenten einer Batterie mittels Scannerschweißens
DE102022109848A1 (de) * 2022-04-25 2023-10-26 TRUMPF Werkzeugmaschinen SE + Co. KG Laserbearbeitungskopf und Verfahren zum Bearbeiten eines Werkstücks
US12397376B2 (en) 2022-04-28 2025-08-26 Rtx Corporation Off-axis laser beam measurement for laser powder bed fusion
CN115079404B (zh) * 2022-06-01 2024-04-02 武汉欧毅光学有限公司 一种具备双维扫描功能的激光振镜扫描系统
JP2024002820A (ja) * 2022-06-24 2024-01-11 株式会社タマリ工業 レーザ溶接装置
CN119855675A (zh) * 2022-09-15 2025-04-18 株式会社 尼康 加工系统、数据结构以及加工方法
TWI834396B (zh) * 2022-11-23 2024-03-01 財團法人工業技術研究院 銲接方法
DE102023112512B3 (de) 2023-05-11 2024-06-20 Lessmüller Lasertechnik GmbH Messvorrichtung und Verfahren zur Durchführung von Messungen an einem Werkstück, Bearbeitungssystem zum Erzeugen einer Schweißnaht sowie Verfahren zum Bearbeiten eines Werkstücks
DE102024130668A1 (de) * 2024-10-22 2026-04-23 TRUMPF Laser- und Systemtechnik SE Verfahren zum Bestimmen der Einschweißtiefe bei einem Laserschweißprozess
CN119703361B (zh) * 2025-01-09 2026-02-10 上海交通大学 不锈钢超厚板激光焊接方法及装置

Family Cites Families (126)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1298851B (de) 1963-12-02 1969-07-03 Steigerwald Verfahren zur Materialbearbeitung mittels Strahlungsenergie
US3471215A (en) 1965-07-16 1969-10-07 American Optical Corp Fiber laser device provided with long flexible energy-directing probe-like structure
US3622743A (en) 1969-04-28 1971-11-23 Hrand M Muncheryan Laser eraser and microwelder
US3699334A (en) 1969-06-16 1972-10-17 Kollsman Instr Corp Apparatus using a beam of positive ions for controlled erosion of surfaces
JPS57167692A (en) 1981-04-09 1982-10-15 Toshiba Corp Laser device
US4618262A (en) 1984-04-13 1986-10-21 Applied Materials, Inc. Laser interferometer system and method for monitoring and controlling IC processing
WO1986004847A1 (en) * 1985-02-23 1986-08-28 N.I.S. Engineering Limited Laser apparatus
US4892098A (en) 1985-06-26 1990-01-09 Sauer Jude S Tubular tissue welding device without moving parts
US4733397A (en) 1985-08-12 1988-03-22 Electrical Power Research Institute, Inc. Resonant cavity optical modulator
US4859826A (en) 1987-07-17 1989-08-22 Laser Applications, Inc. Simultaneously cutting and welding sheet metal using laser energy
DE4026759A1 (de) 1989-09-14 1991-03-28 Gen Electric Mit schweissstossverfolgung arbeitendes laserschweisssystem
JP2619737B2 (ja) 1990-09-28 1997-06-11 三菱電機株式会社 レ−ザ加工装置
US6485413B1 (en) 1991-04-29 2002-11-26 The General Hospital Corporation Methods and apparatus for forward-directed optical scanning instruments
US5446547A (en) 1991-06-12 1995-08-29 Wyko Corporation Combination of motorized and piezoelectric translation for long-range vertical scanning interferometry
US5249192A (en) 1991-06-27 1993-09-28 Laserscope Multiple frequency medical laser
US5494829A (en) 1992-07-31 1996-02-27 Biostar, Inc. Devices and methods for detection of an analyte based upon light interference
US5339323A (en) 1993-04-30 1994-08-16 Lumonics Corporation Laser system for controlling emitted pulse energy
US5387969A (en) 1993-06-22 1995-02-07 Optima Industries, Inc. Machine tool position measurement employing multiple laser distance measurements
DE69528024T2 (de) 1994-08-18 2003-10-09 Carl Zeiss Mit optischer Kohärenz-Tomographie gesteuerter chirurgischer Apparat
CN2196529Y (zh) * 1994-08-23 1995-05-10 北京汇佳物产技术公司 光焊机电源电压监视报警器电路
JP2690466B2 (ja) 1995-01-11 1997-12-10 住友電気工業株式会社 レーザビームスピンナ
US6454761B1 (en) 1995-01-30 2002-09-24 Philip D. Freedman Laser surgery device and method
US5961861A (en) 1996-01-15 1999-10-05 The University Of Tennessee Research Corporation Apparatus for laser alloying induced improvement of surfaces
US6043870A (en) 1996-07-01 2000-03-28 Cybernet Systems Corporation Compact fiber optic electronic laser speckle pattern interferometer
US6476343B2 (en) 1996-07-08 2002-11-05 Sandia Corporation Energy-beam-driven rapid fabrication system
US5991319A (en) 1997-11-21 1999-11-23 Trw Inc. Mirror failure detector for high power lasers
JPH11320159A (ja) 1998-05-18 1999-11-24 Hitachi Constr Mach Co Ltd レーザ溶接方法及び装置
JP2000263276A (ja) 1999-03-16 2000-09-26 Sekisui Chem Co Ltd レーザー加工ヘッド
DE19930408A1 (de) 1999-07-02 2001-01-04 Zeiss Carl Fa OCT-gestütztes Chirurgiesystem
GB2352401B (en) 1999-07-20 2001-06-06 Ajoy Inder Singh Atheroma ablation
DE50015215D1 (de) 1999-09-10 2008-07-31 Haag Ag Streit Vorrichtung zur fotoablation der kornea mit einem laserstrahl
WO2001064591A1 (en) 2000-03-01 2001-09-07 Heraeus Amersil, Inc. Method, apparatus, and article of manufacture for determining an amount of energy needed to bring a quartz workpiece to a fusion weldable condition
DE10020559A1 (de) 2000-04-27 2001-10-31 Hannover Laser Zentrum Laser-Bearbeitung von Materialien
US6720567B2 (en) 2001-01-30 2004-04-13 Gsi Lumonics Corporation Apparatus and method for focal point control for laser machining
US6531675B2 (en) 2001-01-31 2003-03-11 Unova Ip Corp. Laser welding method and apparatus
JP3603843B2 (ja) 2001-02-23 2004-12-22 日産自動車株式会社 レーザー溶接部の品質モニタリング方法およびその装置
WO2002083003A1 (en) 2001-04-11 2002-10-24 Clarke Dana S Tissue structure identification in advance of instrument
JP2002317808A (ja) 2001-04-20 2002-10-31 Wakai & Co Ltd 板ナット体
US6723090B2 (en) 2001-07-02 2004-04-20 Palomar Medical Technologies, Inc. Fiber laser device for medical/cosmetic procedures
DE10155203A1 (de) 2001-11-09 2003-06-18 Bosch Gmbh Robert Laserbearbeitungsvorrichtung
JP4320524B2 (ja) 2002-04-04 2009-08-26 三菱電機株式会社 レーザ加工装置
IL149016A0 (en) 2002-04-07 2004-03-28 Green Vision Systems Ltd Green Method and device for real time high speed high resolution spectral imaging
JP3941104B2 (ja) 2002-06-11 2007-07-04 ブラザー工業株式会社 インクジェット記録装置
DE10300091A1 (de) 2003-01-04 2004-07-29 Lubatschowski, Holger, Dr. Mikrotom
US6940039B2 (en) 2003-12-22 2005-09-06 Lincoln Global, Inc. Quality control module for tandem arc welding
US7436520B1 (en) 2005-01-18 2008-10-14 Carl Zeiss Smt Ag Method of calibrating an interferometer optics and of processing an optical element having an optical surface
JP5135672B2 (ja) 2005-09-30 2013-02-06 日産自動車株式会社 レーザ照射状態の検出方法およびレーザ照射状態検出システム
WO2007038975A1 (en) 2005-10-05 2007-04-12 Alexandre Carpentier Method for cutting a biological tissue, and installation for cutting a biological tissue
JP4850495B2 (ja) 2005-10-12 2012-01-11 株式会社トプコン 眼底観察装置及び眼底観察プログラム
JP4840110B2 (ja) 2006-03-09 2011-12-21 日産自動車株式会社 レーザ溶接装置およびレーザ溶接方法
JP5266647B2 (ja) 2006-03-23 2013-08-21 日産自動車株式会社 レーザ溶接装置およびその調整方法
US20070291382A1 (en) 2006-06-16 2007-12-20 Pinard Adam I Mirror mounting structures and methods employing shape memory materials for limited rotation motors and scanners
JP4958489B2 (ja) 2006-06-30 2012-06-20 株式会社キーエンス レーザ加工装置、レーザ加工条件設定装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム
JP5654234B2 (ja) 2006-08-22 2015-01-14 ケンブリッジ テクノロジー インコーポレイテッド X−y高速穴あけシステム
JP3126788U (ja) 2006-08-28 2006-11-09 大阪シーリング印刷株式会社 組合せ容器
JP4328349B2 (ja) 2006-11-29 2009-09-09 株式会社日立製作所 残留応力測定方法及び装置
AU2007336799B2 (en) 2006-12-21 2013-10-24 Arizona Board Of Regents On Behalf Of The University Of Arizona Interferometry testing of lenses, and systems and devices for same
KR101519932B1 (ko) 2006-12-22 2015-05-13 지고 코포레이션 표면 특징물의 특성을 측정하기 위한 장치 및 방법
EP2649971B1 (en) 2007-03-13 2016-08-31 Optimedica Corporation Apparatus for creating ocular surgical and relaxing incisions
DE102007016444B4 (de) 2007-04-05 2024-08-22 Precitec Optronik Gmbh Bearbeitungseinrichtung
DE102007032743A1 (de) 2007-07-13 2009-01-15 Robert Bosch Gmbh Messvorrichtung, Messverfahren, Laserstrahlbearbeitungsvorrichtung, Laserstrahlbearbeitungsverfahren
US7619746B2 (en) 2007-07-19 2009-11-17 Zygo Corporation Generating model signals for interferometry
US7542492B2 (en) 2007-08-01 2009-06-02 Corning Incorporated Controlled misalignment in wavelength-converted laser sources
US20100324542A1 (en) 2007-11-02 2010-12-23 Kurtz Ronald M Method to Guide a Cataract Procedure by Corneal Imaging
US8426768B2 (en) 2008-02-20 2013-04-23 Aerotech, Inc. Position-based laser triggering for scanner
JP4612076B2 (ja) 2008-04-24 2011-01-12 東亜工業株式会社 金属メッキ板のレーザー溶接方法
DE102008022014B3 (de) 2008-05-02 2009-11-26 Trumpf Laser- Und Systemtechnik Gmbh Dynamische Strahlumlenkung eines Laserstrahls
DE502008001155D1 (de) 2008-05-02 2010-09-30 Leister Process Tech Verfahren und Laservorrichtung zum Bearbeiten und/oder Verbinden von Werkstücken mittels Laserstrahlung mit Leistungswirk- und Pilotlaser und mindestens einem diffraktiven optischen Element
DE102008027524B3 (de) 2008-06-04 2009-09-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zum schneidenden Bearbeiten von Werkstücken mit einem Laserstrahl
KR101318819B1 (ko) 2008-06-23 2013-10-17 제이에프이 스틸 가부시키가이샤 레이저 용접 강관의 제조 방법
CN101623867B (zh) * 2008-07-11 2010-12-01 中国科学院沈阳自动化研究所 一种使机器人高精度跟踪指定路径的设备和方法
GB0816308D0 (en) 2008-09-05 2008-10-15 Mtt Technologies Ltd Optical module
DE102008048323B3 (de) 2008-09-22 2009-12-17 Precitec Kg Modulares Laserbearbeitungssystem und Funktionsmodul
US20100078419A1 (en) 2008-09-26 2010-04-01 Electro Scientific Industries, Inc Post-lens steering of a laser beam for micro-machining applications
US8723078B2 (en) 2008-11-21 2014-05-13 The Regents Of The University Of Michigan Monitoring of a welding process
JP5245844B2 (ja) 2009-01-14 2013-07-24 新日鐵住金株式会社 レーザ切断方法および装置
JP5316124B2 (ja) 2009-03-13 2013-10-16 日産自動車株式会社 レーザー溶接装置
US8264694B2 (en) 2009-03-16 2012-09-11 Ut-Battelle, Llc Quantitative phase-contrast and excitation-emission systems
CN101526483A (zh) * 2009-04-13 2009-09-09 电子科技大学 一种利用光声干涉成像进行无损检测方法
KR20100124039A (ko) * 2009-05-18 2010-11-26 삼성전기주식회사 레이저 가공장치
US8897779B2 (en) 2009-08-05 2014-11-25 Qualcomm Incorporated Message-based exchange of access point pilot signature indicators
DE102009042986B3 (de) 2009-09-25 2011-03-03 Precitec Kg Schweißkopf und Verfahren zum Fügen eines Werkstücks
US8503840B2 (en) 2010-08-23 2013-08-06 Lockheed Martin Corporation Optical-fiber array method and apparatus
ES2514520T3 (es) 2009-12-04 2014-10-28 Slm Solutions Gmbh Unidad de irradiación óptica para una planta para la producción de piezas de trabajo mediante la irradiación de capas de polvo con radiación de láser
JP5527526B2 (ja) 2010-02-24 2014-06-18 マツダ株式会社 レーザ溶接方法
US20110222024A1 (en) 2010-03-15 2011-09-15 Walsin Lihwa Corporation Illumination system for projection display
DE102010016862B3 (de) 2010-05-10 2011-09-22 Precitec Optronik Gmbh Materialbearbeitungsvorrichtung mit in-situ Messen des Bearbeitungsabstands
US20110284508A1 (en) 2010-05-21 2011-11-24 Kabushiki Kaisha Toshiba Welding system and welding method
JP5642445B2 (ja) 2010-07-23 2014-12-17 株式会社アマダミヤチ スキャニング方式のレーザ加工装置
CA3190196A1 (en) 2010-09-25 2012-03-25 Ipg Photonics Corporation Methods and systems for coherent imaging and feedback control for modification of materials
EP4306235B1 (en) 2010-09-25 2025-10-29 IPG Photonics (Canada) Inc. Aparatus and method for coherent imaging and feedback control for modification of materials
US10124410B2 (en) * 2010-09-25 2018-11-13 Ipg Photonics Corporation Methods and systems for coherent imaging and feedback control for modification of materials
JP5570396B2 (ja) 2010-11-22 2014-08-13 パナソニック株式会社 溶接方法および溶接装置
JP5252026B2 (ja) 2011-05-10 2013-07-31 パナソニック株式会社 レーザ溶接装置及びレーザ溶接方法
WO2012152881A1 (de) 2011-05-11 2012-11-15 Arges Gmbh Verfahren und vorrichtung zur überwachung eines laserbearbeitungsprozesses
DE102011104550B4 (de) 2011-06-17 2014-04-30 Precitec Kg Optische Messvorrichtung zur Überwachung einer Fügenaht, Fügekopf und Laserschweißkopf mit der selben
US20140249517A1 (en) 2011-10-17 2014-09-04 Ajoy I. SINGH Method and apparatus for eliminating atherosclerosis from a region of the arterial tree
JP2014046330A (ja) 2012-08-30 2014-03-17 Keyence Corp レーザマーキング装置及びウォブル印字端部処理パターン生成プログラム並びにコンピュータで読取可能な記録媒体
JP2014050462A (ja) * 2012-09-05 2014-03-20 Canon Inc 眼科撮影装置
EP2708307A1 (de) 2012-09-14 2014-03-19 Trumpf Laser Marking Systems AG Einrichtung zum Ablenken eines Laserstrahls
CA2905616C (en) 2013-03-13 2021-08-24 Queen's University At Kingston Methods and systems for characterizing laser machining properties by measuring keyhole dynamics using interferometry
US9878399B2 (en) 2013-03-15 2018-01-30 Jian Liu Method and apparatus for welding dissimilar material with a high energy high power ultrafast laser
US9364167B2 (en) 2013-03-15 2016-06-14 Lx Medical Corporation Tissue imaging and image guidance in luminal anatomic structures and body cavities
US9690107B2 (en) 2013-03-15 2017-06-27 Trumpf Laser Gmbh Device for wavelength combining of laser beams
US9067278B2 (en) 2013-03-29 2015-06-30 Photon Automation, Inc. Pulse spread laser
JP5849985B2 (ja) * 2013-04-15 2016-02-03 トヨタ自動車株式会社 溶接部の検査装置とその検査方法
DE102013008269C5 (de) 2013-05-15 2019-01-24 Precitec Optronik Gmbh Bearbeitungskopf für eine Laserbearbeitungsvorrichtung
JP6354415B2 (ja) * 2013-08-14 2018-07-11 富士電機株式会社 レーザ溶接機とそれを用いたレーザ溶接方法
DE102013015656B4 (de) 2013-09-23 2016-02-18 Precitec Optronik Gmbh Verfahren zum Messen der Eindringtiefe eines Laserstrahls in ein Werkstück, Verfahren zum Bearbeiten eines Werkstücks sowie Laserbearbeitungsvorrichtung
DE102013110524B4 (de) * 2013-09-24 2017-02-16 Scansonic Mi Gmbh Fügevorrichtung mit Nahtführungssensorik
DE102014113283B4 (de) * 2014-09-15 2016-11-03 Blackbird Robotersysteme Gmbh Vorrichtung zur Remote-Laserbearbeitung mit Sensor-Scannereinrichtung
DE102014007887B4 (de) 2014-05-26 2015-12-10 Lessmüller Lasertechnik GmbH Laserbearbeitungsvorrichtung mit einer Messvorrichtung zum Erfassen von Oberflächendaten und/oder Grenzflächen eines durch eine Laserbearbeitungsvorrichtung zu bearbeitenden Werkstücks
US20160039046A1 (en) * 2014-08-06 2016-02-11 Scansonic Mi Gmbh Method of Beam-Type Joining
RU2700723C2 (ru) 2014-08-13 2019-09-19 Айпиджи Фотоникс Корпорэйшн Волоконная лазерная система со множеством пучков
CN105699492B (zh) * 2014-11-27 2018-11-13 中国科学院声学研究所 一种用于焊缝检测的超声成像方法
US10195688B2 (en) 2015-01-05 2019-02-05 Johnson Controls Technology Company Laser welding system for a battery module
ES2887211T3 (es) 2015-06-19 2021-12-22 Ipg Photonics Corp Sistema de soldadura láser con un cabezal de soldadura láser dotado de espejos móviles duales que proporcionan movimiento de haz con campo de visión limitado
DE102015015330B4 (de) * 2015-11-25 2024-03-21 Lessmüller Lasertechnik GmbH Bearbeitungsvorrichtung und Verfahren zum Überwachen eines mit einer Bearbeitungsvorrichtung ausgeführten Bearbeitungsprozesses
JP2017113789A (ja) * 2015-12-24 2017-06-29 アイシン精機株式会社 レーザ溶接装置
MX392679B (es) 2016-02-12 2025-03-24 Ipg Photonics Corp Cabezal de corte con laser con dos espejos moviles que proporcionan alineacion de haz y/o movimiento de bamboleo.
US20170297144A1 (en) * 2016-04-14 2017-10-19 Murata Machinery, Ltd. Laser beam machine and laser beam machining method
KR20210134087A (ko) * 2016-04-29 2021-11-08 누부루 인크. 반도체 패키징, 자동차 전기 장치, 배터리 및 기타 부품에 대한 가시 레이저 용접 방법
DE102016010508A1 (de) 2016-08-26 2018-03-01 Lessmüller Lasertechnik GmbH Vorrichtung, Bearbeitungsvorrichtung und Verfahren zum Durchführen eines Bearbeitungsprozesses mittels eines hochenergetischen Bearbeitungsstrahls unter Anpassung des Bearbeitstrahls nach Maßgabe einer aktuellen Bearbeitungssituation
US10007001B1 (en) * 2017-03-28 2018-06-26 Luminar Technologies, Inc. Active short-wave infrared four-dimensional camera
DE102017126867A1 (de) 2017-11-15 2019-05-16 Precitec Gmbh & Co. Kg Laserbearbeitungssystem und Verfahren zur Laserbearbeitung
CN107931850B (zh) * 2017-12-12 2024-03-26 佛山科学技术学院 一种基于扫频oct的激光打标装置

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