MX2021000687A - Sistemas y metodos de monitoreo y/o control de procesamiento por oscilacion que utiliza formacion de imagen coherente en linea (ici). - Google Patents

Sistemas y metodos de monitoreo y/o control de procesamiento por oscilacion que utiliza formacion de imagen coherente en linea (ici).

Info

Publication number
MX2021000687A
MX2021000687A MX2021000687A MX2021000687A MX2021000687A MX 2021000687 A MX2021000687 A MX 2021000687A MX 2021000687 A MX2021000687 A MX 2021000687A MX 2021000687 A MX2021000687 A MX 2021000687A MX 2021000687 A MX2021000687 A MX 2021000687A
Authority
MX
Mexico
Prior art keywords
ici
wobble
processing
systems
monitoring
Prior art date
Application number
MX2021000687A
Other languages
English (en)
Inventor
Paul J L Webster
Christopher M Galbraith
Jordan A Kanko
Original Assignee
Ipg Photonics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ipg Photonics Corp filed Critical Ipg Photonics Corp
Publication of MX2021000687A publication Critical patent/MX2021000687A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/242—Fillet welding, i.e. involving a weld of substantially triangular cross section joining two parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/26—Seam welding of rectilinear seams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B23K26/323—Bonding taking account of the properties of the material involved involving parts made of dissimilar metallic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06—Construction or shape of active medium
    • H01S3/063—Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
    • H01S3/067—Fibre lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/18—Sheet panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B23K2103/05—Stainless steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)

Abstract

Podría utilizarse un sistema y método para monitorear y/o controlar el procesamiento de material donde un haz de proceso es movido en un patrón de oscilación, tal como un proceso de soldadura oscilante. Mientras al menos un haz de proceso es movido de acuerdo con un patrón de oscilación en un sitio de procesamiento (por ejemplo, un sitio de soldadura) de una pieza de trabajo, un sistema ICI mueve un haz de formación de imagen independientemente, al menos en forma parcial, del haz de proceso a una o más ubicaciones de medición en el patrón de oscilación y obtiene Mediciones ICI (por ejemplo, las mediciones de profundidad) en aquellas ubicaciones. Las mediciones ICI podrían utilizarse, por ejemplo, para evaluar las características de la ranura y/o piscina de fusión durante un proceso de soldadura. Aunque la presente solicitud describe procesos de soldadura de oscilación, los sistemas y métodos que se describen en la presente también podrían utilizarse con otras aplicaciones de procesamiento de material donde un láser u otro haz de energía es oscilado o vibrado durante el procesamiento que incluye, sin limitación, la fabricación aditiva, el marcado y remoción de material.
MX2021000687A 2018-07-19 2019-07-18 Sistemas y metodos de monitoreo y/o control de procesamiento por oscilacion que utiliza formacion de imagen coherente en linea (ici). MX2021000687A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862700606P 2018-07-19 2018-07-19
US201962853368P 2019-05-28 2019-05-28
PCT/US2019/042436 WO2020018814A1 (en) 2018-07-19 2019-07-18 Systems and methods for monitoring and/or controlling wobble-processing using inline coherent imaging (ici)

Publications (1)

Publication Number Publication Date
MX2021000687A true MX2021000687A (es) 2021-03-25

Family

ID=69148038

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2021000687A MX2021000687A (es) 2018-07-19 2019-07-18 Sistemas y metodos de monitoreo y/o control de procesamiento por oscilacion que utiliza formacion de imagen coherente en linea (ici).

Country Status (11)

Country Link
US (1) US20200023461A1 (es)
EP (1) EP3807041A4 (es)
JP (1) JP7502261B2 (es)
KR (1) KR20210032456A (es)
CN (2) CN117680810A (es)
BR (1) BR112021000911A2 (es)
CA (1) CA3106370A1 (es)
DE (1) DE102019210618A1 (es)
MX (1) MX2021000687A (es)
SG (1) SG11202100407UA (es)
WO (1) WO2020018814A1 (es)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017211982B4 (de) * 2017-07-13 2019-04-18 Trumpf Laser- Und Systemtechnik Gmbh Verfahren und Vorrichtung zum Fügen von mindestens zwei Werkstücken
FR3089442B1 (fr) * 2018-12-05 2020-12-18 Airbus Operations Sas Procédé d’assemblage d’au moins deux pièces par soudage par transparence, procédé d’assemblage d’une structure primaire d’un mât d’aéronef par soudage par transparence, structure primaire d’un mât d’aéronef ainsi obtenue et aéronef comprenant ladite structure primaire
US11458566B2 (en) 2018-12-19 2022-10-04 Ipg Photonics Corporation Monitoring material processing using imaging signal density determined from inline coherent imaging (ICI)
JP7396851B2 (ja) * 2019-10-18 2023-12-12 ファナック株式会社 制御装置、制御システム、及びプログラム
US11305377B2 (en) * 2019-12-23 2022-04-19 Precitec Gmbh & Co. Kg Add-on module for interposing between a control device and a laser machining head of a laser machining system
CA3175379A1 (en) 2020-04-16 2021-10-21 Jordan A. KANKO Static and dynamic calibration for coherence imaging measurement systems and methods
TWI723877B (zh) * 2020-05-13 2021-04-01 國家中山科學研究院 插件式同軸熱輻射影像量測系統
WO2021241387A1 (ja) * 2020-05-27 2021-12-02 パナソニックＩｐマネジメント株式会社 レーザ溶接方法及びレーザ溶接装置
US20210394305A1 (en) * 2020-06-19 2021-12-23 Panasonic Intellectual Property Management Co., Ltd. Laser welding method and apparatus
JP7445013B2 (ja) 2020-10-13 2024-03-06 ファナック株式会社 ガルバノスキャナ及びこれを用いたレーザ加工装置
JP7503754B2 (ja) * 2020-11-09 2024-06-21 パナソニックＩｐマネジメント株式会社 評価方法、評価システム及びレーザ加工システム
WO2022117207A1 (de) 2020-12-04 2022-06-09 Lessmueller Lasertechnik Gmbh Verfahren, vorrichtung und bearbeitungssystem zum überwachen eines bearbeitungsprozesses eines werkstücks mittels eines hochenergetischen bearbeitungsstrahls
EP4032652A1 (de) 2021-01-26 2022-07-27 Precitec GmbH & Co. KG Materialbearbeitung mittels laserstrahl mit wobbel-bewegung
CN112894138B (zh) * 2021-03-04 2023-06-16 武汉逸飞激光股份有限公司 软包电池极耳焊接方法及系统
GB2605410A (en) * 2021-03-31 2022-10-05 Jaguar Land Rover Ltd Methods for welding components of battery modules
GB2605412A (en) * 2021-03-31 2022-10-05 Jaguar Land Rover Ltd Methods for welding components of battery modules
GB2605409A (en) * 2021-03-31 2022-10-05 Jaguar Land Rover Ltd Laser welding penetration monitoring
KR102642403B1 (ko) * 2021-04-16 2024-02-29 한국기계연구원 레이저 클리닝 장치 및 속도 가변 틸팅 레이저 광학계
DE102022100230A1 (de) 2022-01-05 2023-07-06 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Fügen von zwei Komponenten einer Batterie mittels Scannerschweißens
DE102022109848A1 (de) * 2022-04-25 2023-10-26 TRUMPF Werkzeugmaschinen SE + Co. KG Laserbearbeitungskopf und Verfahren zum Bearbeiten eines Werkstücks
CN115079404B (zh) * 2022-06-01 2024-04-02 武汉欧毅光学有限公司 一种具备双维扫描功能的激光振镜扫描系统
WO2024057496A1 (ja) * 2022-09-15 2024-03-21 株式会社ニコン 加工システム、データ構造及び加工方法
TWI834396B (zh) * 2022-11-23 2024-03-01 財團法人工業技術研究院 銲接方法
DE102023112512B3 (de) 2023-05-11 2024-06-20 Lessmüller Lasertechnik GmbH Messvorrichtung und Verfahren zur Durchführung von Messungen an einem Werkstück, Bearbeitungssystem zum Erzeugen einer Schweißnaht sowie Verfahren zum Bearbeiten eines Werkstücks

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0252082A1 (en) * 1985-02-23 1988-01-13 N.I.S. Engineering Limited Laser apparatus
CN2196529Y (zh) * 1994-08-23 1995-05-10 北京汇佳物产技术公司 光焊机电源电压监视报警器电路
JPH11320159A (ja) * 1998-05-18 1999-11-24 Hitachi Constr Mach Co Ltd レーザ溶接方法及び装置
JP5135672B2 (ja) * 2005-09-30 2013-02-06 日産自動車株式会社 レーザ照射状態の検出方法およびレーザ照射状態検出システム
CN101526483A (zh) * 2009-04-13 2009-09-09 电子科技大学 一种利用光声干涉成像进行无损检测方法
KR20100124039A (ko) * 2009-05-18 2010-11-26 삼성전기주식회사 레이저 가공장치
US8897779B2 (en) 2009-08-05 2014-11-25 Qualcomm Incorporated Message-based exchange of access point pilot signature indicators
US8822875B2 (en) * 2010-09-25 2014-09-02 Queen's University At Kingston Methods and systems for coherent imaging and feedback control for modification of materials
US10124410B2 (en) * 2010-09-25 2018-11-13 Ipg Photonics Corporation Methods and systems for coherent imaging and feedback control for modification of materials
JP5252026B2 (ja) * 2011-05-10 2013-07-31 パナソニック株式会社 レーザ溶接装置及びレーザ溶接方法
JP2014050462A (ja) * 2012-09-05 2014-03-20 Canon Inc 眼科撮影装置
DE14764437T1 (de) * 2013-03-13 2019-09-12 Ipg Photonics (Canada) Inc. Verfahren und systeme zur kennzeichnung von laserbearbeitungseigenschaften durch messung von schlüssellochdynamiken mittels interferometrie
JP5849985B2 (ja) 2013-04-15 2016-02-03 トヨタ自動車株式会社 溶接部の検査装置とその検査方法
JP6354415B2 (ja) * 2013-08-14 2018-07-11 富士電機株式会社 レーザ溶接機とそれを用いたレーザ溶接方法
US20160039046A1 (en) * 2014-08-06 2016-02-11 Scansonic Mi Gmbh Method of Beam-Type Joining
CN105699492B (zh) * 2014-11-27 2018-11-13 中国科学院声学研究所 一种用于焊缝检测的超声成像方法
EP3310518B1 (en) 2015-06-19 2021-06-16 IPG Photonics Corporation Laser welding system with a laser welding head having with dual movable mirrors providing beam movement with limited field of view
DE102015015330B4 (de) * 2015-11-25 2024-03-21 Lessmüller Lasertechnik GmbH Bearbeitungsvorrichtung und Verfahren zum Überwachen eines mit einer Bearbeitungsvorrichtung ausgeführten Bearbeitungsprozesses
JP2017113789A (ja) * 2015-12-24 2017-06-29 アイシン精機株式会社 レーザ溶接装置
CN116727841A (zh) * 2016-02-12 2023-09-12 Ipg光子公司 具有提供光束对准和/或摇摆运动的双可移动反射镜的激光切割头
US20170297144A1 (en) * 2016-04-14 2017-10-19 Murata Machinery, Ltd. Laser beam machine and laser beam machining method
CN109715339A (zh) * 2016-04-29 2019-05-03 努布鲁有限公司 电子封装、机动电子设备、电池以及其它组件的可见激光焊接
DE102016010508A1 (de) * 2016-08-26 2018-03-01 Lessmüller Lasertechnik GmbH Vorrichtung, Bearbeitungsvorrichtung und Verfahren zum Durchführen eines Bearbeitungsprozesses mittels eines hochenergetischen Bearbeitungsstrahls unter Anpassung des Bearbeitstrahls nach Maßgabe einer aktuellen Bearbeitungssituation
US10007001B1 (en) * 2017-03-28 2018-06-26 Luminar Technologies, Inc. Active short-wave infrared four-dimensional camera
DE102017126867A1 (de) 2017-11-15 2019-05-16 Precitec Gmbh & Co. Kg Laserbearbeitungssystem und Verfahren zur Laserbearbeitung
CN107931850B (zh) * 2017-12-12 2024-03-26 佛山科学技术学院 一种基于扫频oct的激光打标装置

Also Published As

Publication number Publication date
JP7502261B2 (ja) 2024-06-18
CN112469526B (zh) 2024-01-09
EP3807041A4 (en) 2022-04-06
KR20210032456A (ko) 2021-03-24
CA3106370A1 (en) 2020-01-23
DE102019210618A1 (de) 2020-01-23
US20200023461A1 (en) 2020-01-23
EP3807041A1 (en) 2021-04-21
CN117680810A (zh) 2024-03-12
BR112021000911A2 (pt) 2021-04-13
JP2021530360A (ja) 2021-11-11
WO2020018814A1 (en) 2020-01-23
CN112469526A (zh) 2021-03-09
SG11202100407UA (en) 2021-02-25

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