PL2414130T3 - Sposób i urządzenie do strukturyzowania powierzchni obiektu litego z twardą powłoką pierwszym laserem o impulsach w zakresie nanosekundowym i drugim laserem o impulsach w zakresie piko- lub femtosekundowym; folia opakowaniowa - Google Patents

Sposób i urządzenie do strukturyzowania powierzchni obiektu litego z twardą powłoką pierwszym laserem o impulsach w zakresie nanosekundowym i drugim laserem o impulsach w zakresie piko- lub femtosekundowym; folia opakowaniowa

Info

Publication number
PL2414130T3
PL2414130T3 PL10710161T PL10710161T PL2414130T3 PL 2414130 T3 PL2414130 T3 PL 2414130T3 PL 10710161 T PL10710161 T PL 10710161T PL 10710161 T PL10710161 T PL 10710161T PL 2414130 T3 PL2414130 T3 PL 2414130T3
Authority
PL
Poland
Prior art keywords
pulses
laser
field
femtosecond
pico
Prior art date
Application number
PL10710161T
Other languages
English (en)
Other versions
PL2414130T5 (pl
Inventor
Charles Boegli
Steffen Weissmantel
Günter Reisse
Andy Engel
Rene Boettcher
Werner Steffen
Original Assignee
Boegli Gravures Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=42112303&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL2414130(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from EP09405203A external-priority patent/EP2327503A1/de
Application filed by Boegli Gravures Sa filed Critical Boegli Gravures Sa
Publication of PL2414130T3 publication Critical patent/PL2414130T3/pl
Publication of PL2414130T5 publication Critical patent/PL2414130T5/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355—Texturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/24—Ablative recording, e.g. by burning marks; Spark recording
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B42D25/425—Marking by deformation, e.g. embossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
    • B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
    • B44B5/02—Dies; Accessories
    • B44B5/026—Dies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/328—Diffraction gratings; Holograms

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
PL10710161T 2009-03-30 2010-03-18 Sposób i urządzenie do strukturyzowania powierzchni obiektu litego z twardą powłoką pierwszym laserem o impulsach w zakresie nanosekundowym i drugim laserem o impulsach w zakresie piko- lub femtosekundowym; folia opakowaniowa PL2414130T5 (pl)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP09156583 2009-03-30
EP09405203A EP2327503A1 (de) 2009-11-25 2009-11-25 Verfahren und Vorrichtung zur Strukturierung einer mit einer Hartstoff-Beschichtung versehenen Festkörper-Oberfläche mit einem Nanosekundenbereich-Pulslängen erzeugenden Laser und mit einem zweiten Piko- oder Femetosekundenbereich-Pulslängen erzeugenden Laser
EP10710161.0A EP2414130B2 (en) 2009-03-30 2010-03-18 Method and device for structuring a solid body surface with a hard coating with a first laser with pulses in the nanosecond field and a second laser with pulses in the pico- or femtosecond field ; packaging foil
PCT/CH2010/000074 WO2010111798A1 (en) 2009-03-30 2010-03-18 Method and device for structuring a solid body surface with a hard coating with a first laser with pulses in the nanosecond field and a second laser with pulses in the pico- or femtosecond field

Publications (2)

Publication Number Publication Date
PL2414130T3 true PL2414130T3 (pl) 2015-07-31
PL2414130T5 PL2414130T5 (pl) 2019-10-31

Family

ID=42112303

Family Applications (1)

Application Number Title Priority Date Filing Date
PL10710161T PL2414130T5 (pl) 2009-03-30 2010-03-18 Sposób i urządzenie do strukturyzowania powierzchni obiektu litego z twardą powłoką pierwszym laserem o impulsach w zakresie nanosekundowym i drugim laserem o impulsach w zakresie piko- lub femtosekundowym; folia opakowaniowa

Country Status (11)

Country Link
US (1) US9993895B2 (pl)
EP (1) EP2414130B2 (pl)
JP (1) JP5414884B2 (pl)
CN (1) CN102369081B (pl)
BR (1) BRPI1009990B1 (pl)
CA (1) CA2756840C (pl)
ES (1) ES2534982T5 (pl)
PL (1) PL2414130T5 (pl)
PT (1) PT2414130E (pl)
RU (1) RU2567138C2 (pl)
WO (1) WO2010111798A1 (pl)

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JP2012521892A (ja) 2012-09-20
BRPI1009990A2 (pt) 2016-03-15
CA2756840A1 (en) 2010-10-07
CN102369081B (zh) 2015-09-02
RU2011139388A (ru) 2014-02-10
WO2010111798A1 (en) 2010-10-07
EP2414130B2 (en) 2019-04-24
CA2756840C (en) 2018-10-23
EP2414130B1 (en) 2015-02-18
US20120018993A1 (en) 2012-01-26
ES2534982T3 (es) 2015-05-04
ES2534982T5 (es) 2019-12-12
EP2414130A1 (en) 2012-02-08
JP5414884B2 (ja) 2014-02-12
US9993895B2 (en) 2018-06-12
PL2414130T5 (pl) 2019-10-31
CN102369081A (zh) 2012-03-07
RU2567138C2 (ru) 2015-11-10

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