PL2140476T3 - Źródło do próżniowo-łukowego osadzania z fazy gazowej oraz komora do łukowego osadzania z fazy gazowej ze źródłem do próżniowo-łukowego osadzania z fazy gazowej - Google Patents

Źródło do próżniowo-łukowego osadzania z fazy gazowej oraz komora do łukowego osadzania z fazy gazowej ze źródłem do próżniowo-łukowego osadzania z fazy gazowej

Info

Publication number
PL2140476T3
PL2140476T3 PL08717591.5T PL08717591T PL2140476T3 PL 2140476 T3 PL2140476 T3 PL 2140476T3 PL 08717591 T PL08717591 T PL 08717591T PL 2140476 T3 PL2140476 T3 PL 2140476T3
Authority
PL
Poland
Prior art keywords
arc vaporization
vacuum arc
source
vaporization source
vacuum
Prior art date
Application number
PL08717591.5T
Other languages
English (en)
Inventor
Jörg Vetter
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of PL2140476T3 publication Critical patent/PL2140476T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/31—Processing objects on a macro-scale
    • H01J2237/3132—Evaporating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
PL08717591.5T 2007-04-17 2008-03-11 Źródło do próżniowo-łukowego osadzania z fazy gazowej oraz komora do łukowego osadzania z fazy gazowej ze źródłem do próżniowo-łukowego osadzania z fazy gazowej PL2140476T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP07106345 2007-04-17

Publications (1)

Publication Number Publication Date
PL2140476T3 true PL2140476T3 (pl) 2016-11-30

Family

ID=39319667

Family Applications (2)

Application Number Title Priority Date Filing Date
PL08717591.5T PL2140476T3 (pl) 2007-04-17 2008-03-11 Źródło do próżniowo-łukowego osadzania z fazy gazowej oraz komora do łukowego osadzania z fazy gazowej ze źródłem do próżniowo-łukowego osadzania z fazy gazowej
PL14150384T PL2720248T3 (pl) 2007-04-17 2008-03-11 Źródło próżniowego odparowania łukowego, a także komora odparowania łukowego ze źródłem próżniowego odparowania łukowego

Family Applications After (1)

Application Number Title Priority Date Filing Date
PL14150384T PL2720248T3 (pl) 2007-04-17 2008-03-11 Źródło próżniowego odparowania łukowego, a także komora odparowania łukowego ze źródłem próżniowego odparowania łukowego

Country Status (9)

Country Link
US (1) US9269545B2 (pl)
EP (3) EP2720249B1 (pl)
JP (1) JP5291086B2 (pl)
KR (2) KR101698413B1 (pl)
CN (2) CN105632859B (pl)
ES (3) ES2749721T3 (pl)
HU (2) HUE037336T2 (pl)
PL (2) PL2140476T3 (pl)
WO (1) WO2008125397A1 (pl)

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DE102008057020A1 (de) 2008-11-12 2010-05-20 Oerlikon Trading Ag, Trübbach Zündvorrichtung für Arc Quellen
JP5649308B2 (ja) * 2009-04-28 2015-01-07 株式会社神戸製鋼所 成膜速度が速いアーク式蒸発源及びこのアーク式蒸発源を用いた皮膜の製造方法
EP2835445A1 (en) 2010-04-23 2015-02-11 Sulzer Metaplas GmbH PVD coating for metal machining
CN102859027A (zh) * 2010-05-04 2013-01-02 欧瑞康贸易股份公司(特吕巴赫) 用于借助陶瓷靶进行电弧气相沉积的方法
JP5318052B2 (ja) * 2010-06-23 2013-10-16 株式会社神戸製鋼所 成膜速度が速いアーク式蒸発源、このアーク式蒸発源を用いた皮膜の製造方法及び成膜装置
JP5644675B2 (ja) * 2011-05-26 2014-12-24 三菱マテリアル株式会社 アークイオンプレーティング装置および成膜方法
JP5644676B2 (ja) * 2011-05-26 2014-12-24 三菱マテリアル株式会社 アークイオンプレーティング装置および成膜方法
JP5652348B2 (ja) * 2011-07-22 2015-01-14 三菱マテリアル株式会社 アークイオンプレーティング装置
UA101443C2 (ru) * 2011-11-29 2013-03-25 Национальный Научный Центр "Харьковский Физико-Технический Институт" Анодный УЗЕЛ вакуумно-дугового ИСТОЧНИКа катодной ПЛАЗМЫ
JP5946337B2 (ja) 2012-06-20 2016-07-06 株式会社神戸製鋼所 アーク式蒸発源
EP2746424B1 (de) * 2012-12-21 2018-10-17 Oerlikon Surface Solutions AG, Pfäffikon Verdampfungsquelle
JP6403269B2 (ja) * 2014-07-30 2018-10-10 株式会社神戸製鋼所 アーク蒸発源
JP2018028109A (ja) * 2014-12-22 2018-02-22 旭硝子株式会社 プラズマｃｖｄ装置
SG10201705059TA (en) 2016-06-24 2018-01-30 Veeco Instr Inc Enhanced cathodic arc source for arc plasma deposition
ES2906875T3 (es) * 2017-02-14 2022-04-20 Oerlikon Surface Solutions Ag Pfaeffikon Evaporación de cátodo de arco voltaico con remoción de material de cátodo predeterminada
CN110846623A (zh) * 2019-12-12 2020-02-28 大连理工大学 一种用于提高金属蒸发镀膜均匀性的装置及方法
CN111621751B (zh) * 2020-05-15 2023-03-21 温州职业技术学院 一种多模式调制弧源装置
CN114657518A (zh) * 2022-02-24 2022-06-24 北京茂孚工业控制技术中心 带有多级可控复合磁场电弧离子源的难溶金属沉积设备
KR102529505B1 (ko) * 2022-06-08 2023-05-10 주식회사 한국나노오트 세리아 입자 제조 장치 및 이를 이용한 세리아 입자의 제조방법

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JPS6247477A (ja) * 1985-08-28 1987-03-02 Tokuda Seisakusho Ltd スパツタリング装置
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Also Published As

Publication number Publication date
EP2720249B1 (de) 2019-07-10
EP2720248A2 (de) 2014-04-16
EP2720249A2 (de) 2014-04-16
EP2140476A1 (de) 2010-01-06
KR101641991B1 (ko) 2016-07-29
JP2010525158A (ja) 2010-07-22
EP2720248A3 (de) 2014-06-18
KR20100015634A (ko) 2010-02-12
EP2720248B1 (de) 2017-08-23
WO2008125397A1 (de) 2008-10-23
CN105632859B (zh) 2018-03-30
EP2140476B1 (de) 2016-05-18
US9269545B2 (en) 2016-02-23
ES2575119T3 (es) 2016-06-24
KR20160036094A (ko) 2016-04-01
CN101689468A (zh) 2010-03-31
ES2648995T3 (es) 2018-01-09
CN105632859A (zh) 2016-06-01
JP5291086B2 (ja) 2013-09-18
US20100213055A1 (en) 2010-08-26
KR101698413B1 (ko) 2017-01-20
PL2720248T3 (pl) 2018-01-31
EP2720249A3 (de) 2014-06-18
HUE028868T2 (en) 2017-01-30
HUE037336T2 (hu) 2018-08-28
ES2749721T3 (es) 2020-03-23

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