PL2720248T3 - Źródło próżniowego odparowania łukowego, a także komora odparowania łukowego ze źródłem próżniowego odparowania łukowego - Google Patents

Źródło próżniowego odparowania łukowego, a także komora odparowania łukowego ze źródłem próżniowego odparowania łukowego

Info

Publication number
PL2720248T3
PL2720248T3 PL14150384T PL14150384T PL2720248T3 PL 2720248 T3 PL2720248 T3 PL 2720248T3 PL 14150384 T PL14150384 T PL 14150384T PL 14150384 T PL14150384 T PL 14150384T PL 2720248 T3 PL2720248 T3 PL 2720248T3
Authority
PL
Poland
Prior art keywords
arc evaporation
evaporation source
vacuum arc
vacuum
chamber
Prior art date
Application number
PL14150384T
Other languages
English (en)
Inventor
Jörg Vetter
Original Assignee
Oerlikon Surface Solutions Ag Pfaeffikon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Surface Solutions Ag Pfaeffikon filed Critical Oerlikon Surface Solutions Ag Pfaeffikon
Publication of PL2720248T3 publication Critical patent/PL2720248T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/31—Processing objects on a macro-scale
    • H01J2237/3132—Evaporating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
PL14150384T 2007-04-17 2008-03-11 Źródło próżniowego odparowania łukowego, a także komora odparowania łukowego ze źródłem próżniowego odparowania łukowego PL2720248T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP07106345 2007-04-17
EP08717591.5A EP2140476B1 (de) 2007-04-17 2008-03-11 Vakuum lichtbogenverdampfungsquelle, sowie eine lichtbogenverdampfungskammer mit einer vakuum lichtbogenverdampfungsquelle
EP14150384.7A EP2720248B1 (de) 2007-04-17 2008-03-11 Vakuum-lichtbogenverdampfungsquelle, sowie eine lichtbogenverdampfungskammer mit einer vakuum -lichtbogenverdampfungsquelle

Publications (1)

Publication Number Publication Date
PL2720248T3 true PL2720248T3 (pl) 2018-01-31

Family

ID=39319667

Family Applications (2)

Application Number Title Priority Date Filing Date
PL08717591.5T PL2140476T3 (pl) 2007-04-17 2008-03-11 Źródło do próżniowo-łukowego osadzania z fazy gazowej oraz komora do łukowego osadzania z fazy gazowej ze źródłem do próżniowo-łukowego osadzania z fazy gazowej
PL14150384T PL2720248T3 (pl) 2007-04-17 2008-03-11 Źródło próżniowego odparowania łukowego, a także komora odparowania łukowego ze źródłem próżniowego odparowania łukowego

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PL08717591.5T PL2140476T3 (pl) 2007-04-17 2008-03-11 Źródło do próżniowo-łukowego osadzania z fazy gazowej oraz komora do łukowego osadzania z fazy gazowej ze źródłem do próżniowo-łukowego osadzania z fazy gazowej

Country Status (9)

Country Link
US (1) US9269545B2 (pl)
EP (3) EP2720248B1 (pl)
JP (1) JP5291086B2 (pl)
KR (2) KR101641991B1 (pl)
CN (2) CN105632859B (pl)
ES (3) ES2749721T3 (pl)
HU (2) HUE028868T2 (pl)
PL (2) PL2140476T3 (pl)
WO (1) WO2008125397A1 (pl)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008057020A1 (de) 2008-11-12 2010-05-20 Oerlikon Trading Ag, Trübbach Zündvorrichtung für Arc Quellen
JP5649308B2 (ja) * 2009-04-28 2015-01-07 株式会社神戸製鋼所 成膜速度が速いアーク式蒸発源及びこのアーク式蒸発源を用いた皮膜の製造方法
US9856556B2 (en) 2010-04-23 2018-01-02 Oerlikon Surface Solutions Ag, Pfaeffikon PVD coating for metal machining
US20130220800A1 (en) * 2010-05-04 2013-08-29 Oerlikon Trading Ag, Trubbach Method for spark deposition using ceramic targets
JP5318052B2 (ja) 2010-06-23 2013-10-16 株式会社神戸製鋼所 成膜速度が速いアーク式蒸発源、このアーク式蒸発源を用いた皮膜の製造方法及び成膜装置
JP5644676B2 (ja) * 2011-05-26 2014-12-24 三菱マテリアル株式会社 アークイオンプレーティング装置および成膜方法
JP5644675B2 (ja) * 2011-05-26 2014-12-24 三菱マテリアル株式会社 アークイオンプレーティング装置および成膜方法
JP5652348B2 (ja) * 2011-07-22 2015-01-14 三菱マテリアル株式会社 アークイオンプレーティング装置
UA101443C2 (ru) * 2011-11-29 2013-03-25 Национальный Научный Центр "Харьковский Физико-Технический Институт" Анодный УЗЕЛ вакуумно-дугового ИСТОЧНИКа катодной ПЛАЗМЫ
JP5946337B2 (ja) * 2012-06-20 2016-07-06 株式会社神戸製鋼所 アーク式蒸発源
EP2746424B1 (de) * 2012-12-21 2018-10-17 Oerlikon Surface Solutions AG, Pfäffikon Verdampfungsquelle
JP6403269B2 (ja) * 2014-07-30 2018-10-10 株式会社神戸製鋼所 アーク蒸発源
JP2018028109A (ja) * 2014-12-22 2018-02-22 旭硝子株式会社 プラズマｃｖｄ装置
SG10201705059TA (en) 2016-06-24 2018-01-30 Veeco Instr Inc Enhanced cathodic arc source for arc plasma deposition
EP3583619B1 (de) * 2017-02-14 2021-10-27 Oerlikon Surface Solutions AG, Pfäffikon Lichtbogenkathodenverdampfung mit vorbestimmtem kathodenmaterialabtrag
CN110846623A (zh) * 2019-12-12 2020-02-28 大连理工大学 一种用于提高金属蒸发镀膜均匀性的装置及方法
CN111621751B (zh) * 2020-05-15 2023-03-21 温州职业技术学院 一种多模式调制弧源装置
CN114657518A (zh) * 2022-02-24 2022-06-24 北京茂孚工业控制技术中心 带有多级可控复合磁场电弧离子源的难溶金属沉积设备
KR102529505B1 (ko) * 2022-06-08 2023-05-10 주식회사 한국나노오트 세리아 입자 제조 장치 및 이를 이용한 세리아 입자의 제조방법

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JPS6247477A (ja) 1985-08-28 1987-03-02 Tokuda Seisakusho Ltd スパツタリング装置
US4620913A (en) * 1985-11-15 1986-11-04 Multi-Arc Vacuum Systems, Inc. Electric arc vapor deposition method and apparatus
JPS63446U (pl) * 1986-06-19 1988-01-05
US5298136A (en) * 1987-08-18 1994-03-29 Regents Of The University Of Minnesota Steered arc coating with thick targets
DE58909180D1 (de) * 1988-03-23 1995-05-24 Balzers Hochvakuum Verfahren und Anlage zur Beschichtung von Werkstücken.
JP2851320B2 (ja) 1988-09-26 1999-01-27 株式会社神戸製鋼所 真空アーク蒸着装置及び方法
DD293145A5 (de) 1989-03-23 1991-08-22 Tu Chemnitz,De Verfahren zur herstellung von mehrkomponentenschichten
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JPH063446A (ja) 1992-06-23 1994-01-11 Meidensha Corp 位置センサ
DE4223592C2 (de) * 1992-06-24 2001-05-17 Leybold Ag Lichtbogen-Verdampfungsvorrichtung
JP3924832B2 (ja) 1997-02-19 2007-06-06 日新電機株式会社 真空アーク蒸着装置
DE19739527C2 (de) * 1997-09-09 2003-10-16 Rossendorf Forschzent Vakuumbogen-Plasmaquelle mit Magnet-Partikelfilter
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JP4109503B2 (ja) * 2002-07-22 2008-07-02 日新電機株式会社 真空アーク蒸着装置
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JP4344640B2 (ja) 2004-03-31 2009-10-14 株式会社栗田製作所 真空アーク蒸発装置およびその運転方法
US9997338B2 (en) * 2005-03-24 2018-06-12 Oerlikon Surface Solutions Ag, Pfäffikon Method for operating a pulsed arc source
US7857948B2 (en) * 2006-07-19 2010-12-28 Oerlikon Trading Ag, Trubbach Method for manufacturing poorly conductive layers

Also Published As

Publication number Publication date
EP2720249B1 (de) 2019-07-10
EP2720248A2 (de) 2014-04-16
EP2720249A2 (de) 2014-04-16
ES2575119T3 (es) 2016-06-24
JP5291086B2 (ja) 2013-09-18
HUE028868T2 (en) 2017-01-30
WO2008125397A1 (de) 2008-10-23
EP2720249A3 (de) 2014-06-18
KR20100015634A (ko) 2010-02-12
CN105632859A (zh) 2016-06-01
EP2720248A3 (de) 2014-06-18
EP2140476B1 (de) 2016-05-18
JP2010525158A (ja) 2010-07-22
KR101698413B1 (ko) 2017-01-20
HUE037336T2 (hu) 2018-08-28
PL2140476T3 (pl) 2016-11-30
KR20160036094A (ko) 2016-04-01
ES2749721T3 (es) 2020-03-23
EP2140476A1 (de) 2010-01-06
US20100213055A1 (en) 2010-08-26
US9269545B2 (en) 2016-02-23
CN105632859B (zh) 2018-03-30
KR101641991B1 (ko) 2016-07-29
EP2720248B1 (de) 2017-08-23
CN101689468A (zh) 2010-03-31
ES2648995T3 (es) 2018-01-09

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