PL1969160T3 - Elektrolit i sposób osadzania matowej warstwy metalu - Google Patents
Elektrolit i sposób osadzania matowej warstwy metaluInfo
- Publication number
- PL1969160T3 PL1969160T3 PL06701821T PL06701821T PL1969160T3 PL 1969160 T3 PL1969160 T3 PL 1969160T3 PL 06701821 T PL06701821 T PL 06701821T PL 06701821 T PL06701821 T PL 06701821T PL 1969160 T3 PL1969160 T3 PL 1969160T3
- Authority
- PL
- Poland
- Prior art keywords
- metal layer
- electrolyte
- depositing
- polyalkylene oxide
- dispersion
- Prior art date
Links
- 239000002184 metal Substances 0.000 title abstract 3
- 229910052751 metal Inorganic materials 0.000 title abstract 3
- 238000000151 deposition Methods 0.000 title 1
- 239000003792 electrolyte Substances 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000203 mixture Substances 0.000 abstract 3
- 239000006185 dispersion Substances 0.000 abstract 2
- 229920000233 poly(alkylene oxides) Polymers 0.000 abstract 2
- 229910052787 antimony Inorganic materials 0.000 abstract 1
- 229910052797 bismuth Inorganic materials 0.000 abstract 1
- 229910052804 chromium Inorganic materials 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 238000005137 deposition process Methods 0.000 abstract 1
- 239000000839 emulsion Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 230000002209 hydrophobic effect Effects 0.000 abstract 1
- 229910052738 indium Inorganic materials 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 229910052748 manganese Inorganic materials 0.000 abstract 1
- 239000004530 micro-emulsion Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 abstract 1
- 229910052702 rhenium Inorganic materials 0.000 abstract 1
- 229910052703 rhodium Inorganic materials 0.000 abstract 1
- 229910052707 ruthenium Inorganic materials 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- 239000000080 wetting agent Substances 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Manufacture And Refinement Of Metals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06701821A EP1969160B1 (de) | 2006-01-06 | 2006-01-06 | Elektrolyt und verfahren zur abscheidung einer matten metallschicht |
| PCT/EP2006/000076 WO2007076898A1 (de) | 2006-01-06 | 2006-01-06 | Elektrolyt und verfahren zur abscheidung einer matten metallschicht |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL1969160T3 true PL1969160T3 (pl) | 2011-09-30 |
Family
ID=36956125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL06701821T PL1969160T3 (pl) | 2006-01-06 | 2006-01-06 | Elektrolit i sposób osadzania matowej warstwy metalu |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US8192607B2 (pl) |
| EP (1) | EP1969160B1 (pl) |
| JP (1) | JP4811880B2 (pl) |
| KR (1) | KR101234429B1 (pl) |
| CN (1) | CN101400830B (pl) |
| AT (1) | ATE507327T1 (pl) |
| DE (1) | DE502006009414D1 (pl) |
| ES (1) | ES2361500T3 (pl) |
| PL (1) | PL1969160T3 (pl) |
| WO (1) | WO2007076898A1 (pl) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2143828B1 (en) * | 2008-07-08 | 2016-12-28 | Enthone, Inc. | Electrolyte and method for the deposition of a matt metal layer |
| US7951600B2 (en) | 2008-11-07 | 2011-05-31 | Xtalic Corporation | Electrodeposition baths, systems and methods |
| EP2568063A1 (en) * | 2011-09-09 | 2013-03-13 | Rohm and Haas Electronic Materials LLC | Low internal stress copper electroplating method |
| US20130220819A1 (en) * | 2012-02-27 | 2013-08-29 | Faraday Technology, Inc. | Electrodeposition of chromium from trivalent chromium using modulated electric fields |
| CN105229204A (zh) * | 2013-03-15 | 2016-01-06 | 恩索恩公司 | 银与含氟聚合物纳米粒子的电沉积 |
| CN103382564B (zh) * | 2013-07-18 | 2016-10-05 | 华南理工大学 | 金属表面超疏水钴镀层及其制备方法 |
| KR101636361B1 (ko) * | 2014-07-31 | 2016-07-06 | 주식회사 에이피씨티 | 과불소화알킬 계면활성제를 함유하는 솔더범프용 주석합금 전기도금액 |
| GB2534120A (en) * | 2014-11-28 | 2016-07-20 | Daido Ind Bearings Europe Ltd | Bismuth-based composite coating for overlay applications in plain bearings |
| AT516876B1 (de) * | 2015-03-09 | 2016-11-15 | Ing W Garhöfer Ges M B H | Abscheidung von dekorativen Palladium-Eisen-Legierungsbeschichtungen auf metallischen Substanzen |
| JP6631349B2 (ja) | 2015-03-26 | 2020-01-15 | 三菱マテリアル株式会社 | アンモニウム塩を用いためっき液 |
| CN105648490B (zh) * | 2016-01-07 | 2017-08-15 | 东南大学 | 一种无低表面能物质改性的超疏水表面及其制备方法 |
| CN105862093B (zh) * | 2016-05-26 | 2018-03-06 | 安庆师范大学 | 一种离子液体中电镀Ni‑Cr‑PTFE复合镀层的方法 |
| CN109652829B (zh) * | 2019-01-04 | 2021-07-09 | 中国计量大学 | 一种无稀土Bi基磁性电镀液及其制备方法 |
| CN109680310B (zh) * | 2019-01-04 | 2020-07-07 | 中国计量大学 | 一种镍锑电镀液及其制备方法 |
| FR3092589A1 (fr) * | 2019-02-08 | 2020-08-14 | Aveni | Electrodéposition d’un alliage de cobalt et utilisation en microélectronique |
| CN110714212B (zh) * | 2019-10-12 | 2021-04-30 | 常州大学 | 一种水溶液体系中由氯化镍一步法制备超疏水镍薄膜的方法 |
| AT523922B1 (de) * | 2020-09-08 | 2022-01-15 | Iwg Ing W Garhoefer Ges M B H | Elektrolytbad für Palladium-Ruthenium-Beschichtungen |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3839166A (en) * | 1967-05-16 | 1974-10-01 | Henkel & Cie Gmbh | Method for obtaining nickel deposits with satin finish |
| US3839165A (en) * | 1967-08-26 | 1974-10-01 | Henkel & Cie Gmbh | Nickel electroplating method |
| US3787294A (en) * | 1971-12-07 | 1974-01-22 | S Kurosaki | Process for producing a solid lubricant self-supplying-type co-deposited metal film |
| FR2190940A1 (en) * | 1972-06-28 | 1974-02-01 | Rhone Poulenc Sa | Additives for tinplating baths - contg diethers and surfactants |
| DE2327881B2 (de) * | 1973-06-01 | 1978-06-22 | Langbein-Pfanhauser Werke Ag, 4040 Neuss | Verfahren zur galvanischen Abscheidung mattglänzender Nickel- bzw. Nickel/Kobalt-Niederschläge |
| JPS5856038B2 (ja) * | 1975-07-28 | 1983-12-13 | ソニー株式会社 | 酸性Ｎｉ電気メッキ浴 |
| US4444630A (en) * | 1977-07-11 | 1984-04-24 | Richardson Chemical Company | Acid bright zinc plating |
| US4381228A (en) * | 1981-06-16 | 1983-04-26 | Occidental Chemical Corporation | Process and composition for the electrodeposition of tin and tin alloys |
| AU559896B2 (en) * | 1983-06-10 | 1987-03-26 | Omi International Corp. | Electrolytic copper depositing processes |
| DE3909811A1 (de) | 1989-03-24 | 1990-09-27 | Lpw Chemie Gmbh | Verwendung von zumindest einer organischen sulfinsaeure und/oder von zumindest einem alkalisalz einer organischen sulfinsaeure als mittel ... |
| JP2626065B2 (ja) * | 1989-07-04 | 1997-07-02 | 上村工業株式会社 | サテンニッケル又はニッケル合金めっき浴及びめっき方法 |
| DE69110652T2 (de) * | 1991-01-07 | 1996-02-01 | Atochem Elf Sa | Verfahren zur Elektrogewinnung von Zink. |
| US5401590A (en) * | 1992-12-07 | 1995-03-28 | Duracell Inc. | Additives for electrochemical cells having zinc anodes |
| JP3263750B2 (ja) * | 1993-12-08 | 2002-03-11 | 奥野製薬工業株式会社 | 酸性銅めっき浴及びこれを使用するめっき方法 |
| DE19540011C2 (de) * | 1995-10-27 | 1998-09-10 | Lpw Chemie Gmbh | Verfahren zur galvanischen Abscheidung von blendfreien Nickel- oder Nickellegierungsniederschlägen |
| US5667659A (en) * | 1996-04-04 | 1997-09-16 | Handy & Harman | Low friction solder electrodeposits |
| EP1059333B1 (en) * | 1998-02-24 | 2006-10-11 | Asahi Glass Company, Limited | Aqueous polytetrafluoroethylene dispersion composition |
| JP2001089897A (ja) * | 1999-07-16 | 2001-04-03 | Toto Ltd | めっき製品 |
| JP2001125413A (ja) * | 1999-10-27 | 2001-05-11 | Shinwa Denki Kk | 電子写真用定着ロ−ラ−及びその製造法 |
| JP2001226798A (ja) * | 2000-02-14 | 2001-08-21 | Osaka Gas Co Ltd | 摺動部材 |
| US6491806B1 (en) * | 2000-04-27 | 2002-12-10 | Intel Corporation | Electroplating bath composition |
| DE10025552C1 (de) * | 2000-05-19 | 2001-08-02 | Atotech Deutschland Gmbh | Saures galvanisches Nickelbad und Verfahren zum Abscheiden eines satinglänzenden Nickel- oder Nickellegierungsüberzuges |
| CN1314839C (zh) * | 2000-10-19 | 2007-05-09 | 埃托特克德国有限公司 | 沉积无光泽铜镀层的铜浴及方法 |
| US6776893B1 (en) * | 2000-11-20 | 2004-08-17 | Enthone Inc. | Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect |
| WO2002047139A2 (en) * | 2000-12-04 | 2002-06-13 | Ebara Corporation | Methode of forming a copper film on a substrate |
| JP2002317298A (ja) * | 2001-04-17 | 2002-10-31 | Inax Corp | 撥水性サテンめっき製品及びその製造方法 |
| US20030066756A1 (en) * | 2001-10-04 | 2003-04-10 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| US6726827B2 (en) * | 2002-01-17 | 2004-04-27 | Lucent Technologies Inc. | Electroplating solution for high speed plating of tin-bismuth solder |
| DE10222962A1 (de) * | 2002-05-23 | 2003-12-11 | Atotech Deutschland Gmbh | Saurer galvanischer Badelektrolyt und Verfahren zur elektrolytischen Abscheidung satinglänzender Nickelniederschläge |
| JP4249438B2 (ja) * | 2002-07-05 | 2009-04-02 | 日本ニュークローム株式会社 | 銅―錫合金めっき用ピロリン酸浴 |
| US20050072683A1 (en) * | 2003-04-03 | 2005-04-07 | Ebara Corporation | Copper plating bath and plating method |
| JP4603812B2 (ja) * | 2003-05-12 | 2010-12-22 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | 改良されたスズめっき方法 |
| CN100348780C (zh) * | 2004-03-16 | 2007-11-14 | 天津大学 | 脉冲镀镍基纳米复合镀层的方法及设备 |
| TWI400365B (zh) * | 2004-11-12 | 2013-07-01 | 安頌股份有限公司 | 微電子裝置上的銅電沈積 |
-
2006
- 2006-01-06 CN CN2006800537299A patent/CN101400830B/zh not_active Expired - Lifetime
- 2006-01-06 PL PL06701821T patent/PL1969160T3/pl unknown
- 2006-01-06 EP EP06701821A patent/EP1969160B1/de not_active Expired - Lifetime
- 2006-01-06 KR KR1020087018950A patent/KR101234429B1/ko not_active Expired - Lifetime
- 2006-01-06 DE DE502006009414T patent/DE502006009414D1/de not_active Expired - Lifetime
- 2006-01-06 ES ES06701821T patent/ES2361500T3/es not_active Expired - Lifetime
- 2006-01-06 AT AT06701821T patent/ATE507327T1/de active
- 2006-01-06 JP JP2008539264A patent/JP4811880B2/ja not_active Expired - Lifetime
- 2006-01-06 WO PCT/EP2006/000076 patent/WO2007076898A1/de not_active Ceased
-
2008
- 2008-07-07 US US12/168,680 patent/US8192607B2/en not_active Expired - Lifetime
-
2012
- 2012-06-04 US US13/487,665 patent/US20120298519A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN101400830A (zh) | 2009-04-01 |
| US20080302668A1 (en) | 2008-12-11 |
| EP1969160B1 (de) | 2011-04-27 |
| CN101400830B (zh) | 2012-07-04 |
| ATE507327T1 (de) | 2011-05-15 |
| KR20080092399A (ko) | 2008-10-15 |
| US20120298519A1 (en) | 2012-11-29 |
| WO2007076898A1 (de) | 2007-07-12 |
| DE502006009414D1 (de) | 2011-06-09 |
| JP2009522441A (ja) | 2009-06-11 |
| JP4811880B2 (ja) | 2011-11-09 |
| US8192607B2 (en) | 2012-06-05 |
| KR101234429B1 (ko) | 2013-02-18 |
| ES2361500T3 (es) | 2011-06-17 |
| EP1969160A1 (de) | 2008-09-17 |
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