NO20020060L - Underfyllingsmateriale for halvlederpakke - Google Patents
Underfyllingsmateriale for halvlederpakkeInfo
- Publication number
- NO20020060L NO20020060L NO20020060A NO20020060A NO20020060L NO 20020060 L NO20020060 L NO 20020060L NO 20020060 A NO20020060 A NO 20020060A NO 20020060 A NO20020060 A NO 20020060A NO 20020060 L NO20020060 L NO 20020060L
- Authority
- NO
- Norway
- Prior art keywords
- fine powder
- curing agent
- semi
- filler material
- composition
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/98—Methods for disconnecting semiconductor or solid-state bodies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Abstract
Et underfyllingsmateriale for en halvlederpakke som holder halvlederelementer på et bærersubstrat montert på et kretskort, som inneholder en en-pakke type termoherdende uretansammensetning som foretrukket innbefatter en uretan prepolymer som har en terminal isocyanatgruppe, som oppnås ved å reagere et polyol med en overskuddsmengde polyisocyanat, og et finpulverbelagt herdemiddel som innbefatter et herdemiddel som er i fast tilstand ved romtemperatur og overflateaktive seter av hvilket er dekket med et fint pulver. Denne sammensetningen kan oppnå både lavtemperatur herdeegenskaper og lagringsstabilitet.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19450199 | 1999-07-08 | ||
PCT/JP2000/004490 WO2001005203A1 (en) | 1999-07-08 | 2000-07-06 | Underfilling material for semiconductor package |
Publications (2)
Publication Number | Publication Date |
---|---|
NO20020060D0 NO20020060D0 (no) | 2002-01-07 |
NO20020060L true NO20020060L (no) | 2002-02-22 |
Family
ID=16325577
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20020060A NO20020060L (no) | 1999-07-08 | 2002-01-07 | Underfyllingsmateriale for halvlederpakke |
Country Status (13)
Country | Link |
---|---|
US (2) | US6660943B1 (no) |
EP (1) | EP1195083B1 (no) |
JP (1) | JP4611588B2 (no) |
KR (1) | KR100672130B1 (no) |
CN (1) | CN1198493C (no) |
AT (1) | ATE315886T1 (no) |
BR (1) | BR0012273A (no) |
DE (1) | DE60025489T2 (no) |
MY (2) | MY126046A (no) |
NO (1) | NO20020060L (no) |
PL (1) | PL353034A1 (no) |
TW (1) | TWI282806B (no) |
WO (1) | WO2001005203A1 (no) |
Families Citing this family (34)
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US20050014313A1 (en) * | 2003-03-26 | 2005-01-20 | Workman Derek B. | Underfill method |
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US7213739B2 (en) * | 2004-04-02 | 2007-05-08 | Fry's Metals, Inc. | Underfill fluxing curative |
KR100662176B1 (ko) * | 2004-12-30 | 2006-12-27 | 제일모직주식회사 | 이방성 도전 필름용 조성물 |
JP4883996B2 (ja) * | 2005-05-24 | 2012-02-22 | 四国化成工業株式会社 | 水溶性プレフラックス及びその利用 |
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JP2007281173A (ja) * | 2006-04-06 | 2007-10-25 | Alps Electric Co Ltd | 配線基板 |
KR100813286B1 (ko) * | 2006-12-21 | 2008-03-13 | 한국생산기술연구원 | 언더필 주입방법 |
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KR100893024B1 (ko) * | 2007-08-24 | 2009-04-15 | 트리포드 테크놀로지 코포레이션 | 전자소자의 장착에 사용되는 무공동장착방법 |
JP5571568B2 (ja) * | 2007-12-18 | 2014-08-13 | ダウ グローバル テクノロジーズ エルエルシー | シリコーンポリエーテルを含む熱硬化性組成物、それらの製造及び用途 |
US20120156474A1 (en) * | 2010-12-20 | 2012-06-21 | E. I. Du Pont De Nemours And Company | Article having curable coating comprising imidazolium monocarboxylate salt |
US20150159062A1 (en) * | 2011-07-22 | 2015-06-11 | Albert M. Giorgini | Two part dual-cure adhesive for use in electronics |
JP2013224362A (ja) * | 2012-04-20 | 2013-10-31 | Nitto Denko Corp | 接合シート、電子部品およびそれらの製造方法 |
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EP3094661B1 (en) * | 2014-01-17 | 2019-06-19 | Momentive Performance Materials Inc. | Compositions with enhanced flexibility |
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CN105038137B (zh) * | 2015-08-31 | 2017-03-15 | 四川大学 | 一种兼具结构强度和阻尼性能的复合材料及其制备方法与用途 |
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KR102162495B1 (ko) * | 2018-03-28 | 2020-10-07 | 주식회사 엘지화학 | 수지 조성물 |
JP7330768B2 (ja) * | 2018-06-06 | 2023-08-22 | デクセリアルズ株式会社 | 接続体の製造方法、接続方法 |
KR102157633B1 (ko) | 2018-12-27 | 2020-09-18 | 주식회사 케이씨씨 | 반도체 소자 언더필용 에폭시 수지 조성물 |
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-
2000
- 2000-07-06 AT AT00944284T patent/ATE315886T1/de not_active IP Right Cessation
- 2000-07-06 DE DE60025489T patent/DE60025489T2/de not_active Expired - Lifetime
- 2000-07-06 PL PL00353034A patent/PL353034A1/xx unknown
- 2000-07-06 KR KR1020017016723A patent/KR100672130B1/ko not_active IP Right Cessation
- 2000-07-06 US US10/019,299 patent/US6660943B1/en not_active Expired - Lifetime
- 2000-07-06 EP EP00944284A patent/EP1195083B1/en not_active Expired - Lifetime
- 2000-07-06 BR BR0012273-4A patent/BR0012273A/pt not_active Application Discontinuation
- 2000-07-06 MY MYPI20003088A patent/MY126046A/en unknown
- 2000-07-06 WO PCT/JP2000/004490 patent/WO2001005203A1/en active IP Right Grant
- 2000-07-06 JP JP2001510284A patent/JP4611588B2/ja not_active Expired - Lifetime
- 2000-07-06 MY MYPI20051149A patent/MY140714A/en unknown
- 2000-07-06 CN CNB008099839A patent/CN1198493C/zh not_active Expired - Lifetime
- 2000-07-07 TW TW089113592A patent/TWI282806B/zh not_active IP Right Cessation
-
2002
- 2002-01-07 NO NO20020060A patent/NO20020060L/no not_active Application Discontinuation
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2003
- 2003-11-26 US US10/721,263 patent/US6881591B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6660943B1 (en) | 2003-12-09 |
MY140714A (en) | 2010-01-15 |
CN1360815A (zh) | 2002-07-24 |
DE60025489D1 (de) | 2006-04-06 |
EP1195083A1 (en) | 2002-04-10 |
US20040112631A1 (en) | 2004-06-17 |
MY126046A (en) | 2006-09-29 |
NO20020060D0 (no) | 2002-01-07 |
DE60025489T2 (de) | 2006-08-03 |
PL353034A1 (en) | 2003-10-06 |
CN1198493C (zh) | 2005-04-20 |
US6881591B2 (en) | 2005-04-19 |
WO2001005203A1 (en) | 2001-01-18 |
KR20020036965A (ko) | 2002-05-17 |
TWI282806B (en) | 2007-06-21 |
EP1195083B1 (en) | 2006-01-11 |
ATE315886T1 (de) | 2006-02-15 |
KR100672130B1 (ko) | 2007-01-19 |
JP2003504893A (ja) | 2003-02-04 |
BR0012273A (pt) | 2002-04-02 |
JP4611588B2 (ja) | 2011-01-12 |
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