BR9806065A - Composições de resina termossensível ·teis como vedantes entre camadas - Google Patents
Composições de resina termossensível ·teis como vedantes entre camadasInfo
- Publication number
- BR9806065A BR9806065A BR9806065-1A BR9806065A BR9806065A BR 9806065 A BR9806065 A BR 9806065A BR 9806065 A BR9806065 A BR 9806065A BR 9806065 A BR9806065 A BR 9806065A
- Authority
- BR
- Brazil
- Prior art keywords
- component
- semiconductor device
- useful
- circuit board
- thermosetting resin
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 abstract 5
- 239000004849 latent hardener Substances 0.000 abstract 2
- 239000000565 sealant Substances 0.000 abstract 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract 2
- 239000004643 cyanate ester Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 238000013007 heat curing Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 230000035939 shock Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01037—Rubidium [Rb]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Sealing Material Composition (AREA)
Abstract
<B>COMPOSIçõES DE RESINA TERMOSSENSìVEL úTEIS COMO VEDANTES ENTRE CAMADAS"<D>. A presente invenção fornece uma composição de resina termossensível útil como uma composição vedante entre camadas que rapidamente enche o espaço entre camadas em um dispositivo semicondutor, como um conjunto de terminais em um único lado o qual inclui um chip semicondutor montado em um substrato de protadora, permite que o semicondutor seja conectado de forma segura a um painel de circuitos por cura térmica em curto tempo e com boa produtividade, e demonstra propriedades de choque térmico aceitáveis (ou propriedades de ciclo térmico). A composição de resina termossensível que é utilizada como um vendante entre camadas entre tal dispositivo semicondutor e um painel de circuito ao qual o dispositivo semidondutor é eletricamente conectado, inclui um componente de resina de epóxi e um componente endurecedor latente. O componente endurecedor latente inclui um componente de éster de cianato e um componente de imidizol.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US5359297P | 1997-07-24 | 1997-07-24 | |
PCT/US1998/015578 WO1999005196A1 (en) | 1997-07-24 | 1998-07-22 | Thermosetting resin compositions useful as underfill sealants |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9806065A true BR9806065A (pt) | 1999-08-31 |
Family
ID=21985312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9806065-1A BR9806065A (pt) | 1997-07-24 | 1998-07-22 | Composições de resina termossensível ·teis como vedantes entre camadas |
Country Status (13)
Country | Link |
---|---|
US (1) | US6342577B1 (pt) |
EP (1) | EP0929592B1 (pt) |
JP (1) | JP2001506313A (pt) |
KR (1) | KR100571334B1 (pt) |
CN (1) | CN1197893C (pt) |
AT (1) | ATE320460T1 (pt) |
AU (1) | AU728193B2 (pt) |
BR (1) | BR9806065A (pt) |
CA (1) | CA2266314A1 (pt) |
DE (1) | DE69833865T2 (pt) |
ID (1) | ID21928A (pt) |
RU (1) | RU2195474C2 (pt) |
WO (1) | WO1999005196A1 (pt) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG88747A1 (en) * | 1999-03-01 | 2002-05-21 | Motorola Inc | A method and machine for underfilling an assembly to form a semiconductor package |
US6617399B2 (en) * | 1999-12-17 | 2003-09-09 | Henkel Loctite Corporation | Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide tougheners |
US6670430B1 (en) * | 1999-12-17 | 2003-12-30 | Henkel Loctite Corporation | Thermosetting resin compositions comprising epoxy resins, adhesion promoters, and curatives based on the combination of nitrogen compounds and transition metal complexes |
US20050288458A1 (en) | 2002-07-29 | 2005-12-29 | Klemarczyk Philip T | Reworkable thermosetting resin composition |
US7012120B2 (en) | 2000-03-31 | 2006-03-14 | Henkel Corporation | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent |
JP3711842B2 (ja) * | 2000-06-01 | 2005-11-02 | ソニーケミカル株式会社 | 異方性導電接続材料及び接続構造体 |
US6548575B2 (en) | 2000-12-13 | 2003-04-15 | National Starch And Chemical Investment Holding Corporation | High temperature underfilling material with low exotherm during use |
JP3566680B2 (ja) * | 2001-09-11 | 2004-09-15 | 富士通株式会社 | 半導体装置の製造方法 |
JP3866591B2 (ja) * | 2001-10-29 | 2007-01-10 | 富士通株式会社 | 電極間接続構造体の形成方法および電極間接続構造体 |
US6893736B2 (en) * | 2001-11-19 | 2005-05-17 | Henkel Corporation | Thermosetting resin compositions useful as underfill sealants |
US6951907B1 (en) | 2001-11-19 | 2005-10-04 | Henkel Corporation | Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex |
US6833629B2 (en) | 2001-12-14 | 2004-12-21 | National Starch And Chemical Investment Holding Corporation | Dual cure B-stageable underfill for wafer level |
US20040094751A1 (en) * | 2002-03-25 | 2004-05-20 | Toshiaki Ogiwara | Composition for filling through-holes in printed wiring boards |
JP2006216720A (ja) * | 2005-02-02 | 2006-08-17 | Sharp Corp | 半導体装置及びその製造方法 |
KR101148051B1 (ko) * | 2005-12-26 | 2012-05-25 | 에스케이케미칼주식회사 | 에폭시 수지 조성물 |
MX2009013058A (es) * | 2007-06-11 | 2010-01-15 | Basf Se | Catalizadores para el curado de epoxidos. |
JP5475223B2 (ja) * | 2007-10-09 | 2014-04-16 | 株式会社Adeka | 一液型シアネート−エポキシ複合樹脂組成物、その硬化物及びその製造方法、並びにそれを用いた封止用材料及び接着剤 |
US20110237633A1 (en) * | 2008-12-11 | 2011-09-29 | Bijoy Panicker | Small molecule modulators of hepatocyte growth factor (scatter factor) activity |
DE102009012195A1 (de) * | 2009-03-06 | 2010-09-09 | Siemens Aktiengesellschaft | Gießharzsystem für Isolatoren mit erhöhter Wärmeformbeständigkeit |
DE102009003132A1 (de) * | 2009-05-15 | 2010-11-18 | Robert Bosch Gmbh | Kunststoffformmasse sowie Verfahren zu deren Herstellung |
US8698320B2 (en) * | 2009-12-07 | 2014-04-15 | Henkel IP & Holding GmbH | Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices |
JP6085172B2 (ja) * | 2010-04-21 | 2017-02-22 | 三菱瓦斯化学株式会社 | 熱硬化性組成物 |
RU2447093C1 (ru) * | 2011-01-19 | 2012-04-10 | Открытое акционерное общество "Институт пластмасс имени Г.С. Петрова" | Способ получения орто-крезолноволачной эпоксидной смолы и полимерная композиция на ее основе |
CN102559119A (zh) * | 2011-12-13 | 2012-07-11 | 北京海斯迪克新材料有限公司 | 一种具有良好流变稳定性的单组份环氧包封胶及制备方法 |
RU2492549C1 (ru) * | 2012-03-20 | 2013-09-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана" (МГТУ им. Н.Э. Баумана) | Способ сборки трехмерного электронного модуля |
TWI568764B (zh) * | 2012-06-08 | 2017-02-01 | Adeka股份有限公司 | 硬化性樹脂組成物、樹脂組成物、使用此等而成之樹脂片、及此等之硬化物 |
JP6202857B2 (ja) | 2013-04-02 | 2017-09-27 | 株式会社東芝 | 電気機器用コーティング材 |
RU2597916C2 (ru) * | 2014-11-18 | 2016-09-20 | Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" (Госкорпорация "Росатом") | Полимерный матричный материал для кондиционирования низко- и среднеактивных отработанных ионообменных смол |
CN107406582B (zh) * | 2015-03-31 | 2020-01-17 | 三菱瓦斯化学株式会社 | 氰酸酯化合物、包含该化合物的固化性树脂组合物和其固化物 |
CN105356479B (zh) * | 2015-11-13 | 2017-12-08 | 湖南大学 | 一种c型串联滤波式级联svg及其负序补偿控制方法 |
KR102246076B1 (ko) * | 2015-11-17 | 2021-05-03 | 한국전자통신연구원 | 반도체 패키지의 제조 방법 |
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EP4029896A4 (en) * | 2019-09-09 | 2023-07-05 | Adeka Corporation | CURING RESIN COMPOSITION |
EP4130090A4 (en) | 2020-03-25 | 2024-03-20 | Adeka Corporation | CURABLE RESIN COMPOSITION AND METHOD FOR SUPPRESSING SHRINKAGE WHEN CURING A CURABLE RESIN COMPOSITION |
US20240141094A1 (en) | 2021-03-08 | 2024-05-02 | Adeka Corporation | Curable resin composition, cured product, and adhesive |
CN114214019A (zh) * | 2021-12-02 | 2022-03-22 | 深圳斯多福新材料科技有限公司 | 一种可耐高低温的单组分胶黏剂的制备方法 |
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-
1998
- 1998-07-22 DE DE69833865T patent/DE69833865T2/de not_active Expired - Fee Related
- 1998-07-22 AU AU85959/98A patent/AU728193B2/en not_active Ceased
- 1998-07-22 JP JP51020999A patent/JP2001506313A/ja not_active Ceased
- 1998-07-22 ID IDW990113A patent/ID21928A/id unknown
- 1998-07-22 BR BR9806065-1A patent/BR9806065A/pt not_active Application Discontinuation
- 1998-07-22 EP EP98937187A patent/EP0929592B1/en not_active Expired - Lifetime
- 1998-07-22 AT AT98937187T patent/ATE320460T1/de not_active IP Right Cessation
- 1998-07-22 CN CNB988012065A patent/CN1197893C/zh not_active Expired - Fee Related
- 1998-07-22 CA CA002266314A patent/CA2266314A1/en not_active Abandoned
- 1998-07-22 RU RU99108717/04A patent/RU2195474C2/ru not_active IP Right Cessation
- 1998-07-22 WO PCT/US1998/015578 patent/WO1999005196A1/en active IP Right Grant
- 1998-07-22 US US09/269,067 patent/US6342577B1/en not_active Expired - Lifetime
- 1998-07-22 KR KR1019997002498A patent/KR100571334B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE69833865D1 (de) | 2006-05-11 |
JP2001506313A (ja) | 2001-05-15 |
WO1999005196A1 (en) | 1999-02-04 |
EP0929592A4 (en) | 2000-09-13 |
AU728193B2 (en) | 2001-01-04 |
ATE320460T1 (de) | 2006-04-15 |
DE69833865T2 (de) | 2006-10-05 |
KR100571334B1 (ko) | 2006-04-14 |
ID21928A (id) | 1999-08-12 |
US6342577B1 (en) | 2002-01-29 |
EP0929592B1 (en) | 2006-03-15 |
AU8595998A (en) | 1999-02-16 |
EP0929592A1 (en) | 1999-07-21 |
CA2266314A1 (en) | 1999-02-04 |
KR20000068623A (ko) | 2000-11-25 |
CN1197893C (zh) | 2005-04-20 |
RU2195474C2 (ru) | 2002-12-27 |
CN1237186A (zh) | 1999-12-01 |
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FA10 | Dismissal: dismissal - article 33 of industrial property law | ||
B11Y | Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette] |