DE60227433D1 - Einkomponentige thermoset epoxidharzzusammensetzung und unterfüllungsmaterial für halbleitermontage - Google Patents
Einkomponentige thermoset epoxidharzzusammensetzung und unterfüllungsmaterial für halbleitermontageInfo
- Publication number
- DE60227433D1 DE60227433D1 DE60227433T DE60227433T DE60227433D1 DE 60227433 D1 DE60227433 D1 DE 60227433D1 DE 60227433 T DE60227433 T DE 60227433T DE 60227433 T DE60227433 T DE 60227433T DE 60227433 D1 DE60227433 D1 DE 60227433D1
- Authority
- DE
- Germany
- Prior art keywords
- epoxy resin
- resin composition
- semiconductor assembly
- type epoxy
- thermoset epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 3
- 239000000463 material Substances 0.000 title abstract 3
- 239000000203 mixture Substances 0.000 title abstract 3
- 229920000647 polyepoxide Polymers 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 229920001187 thermosetting polymer Polymers 0.000 title abstract 3
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000004615 ingredient Substances 0.000 abstract 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000003973 paint Substances 0.000 abstract 1
- 239000003566 sealing material Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001099479A JP5280597B2 (ja) | 2001-03-30 | 2001-03-30 | 一液加熱硬化型エポキシ樹脂組成物および半導体実装用アンダーフィル材 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60227433D1 true DE60227433D1 (de) | 2008-08-14 |
Family
ID=18953017
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60227433T Expired - Lifetime DE60227433D1 (de) | 2001-03-30 | 2002-03-29 | Einkomponentige thermoset epoxidharzzusammensetzung und unterfüllungsmaterial für halbleitermontage |
DE60217095T Expired - Lifetime DE60217095T2 (de) | 2001-03-30 | 2002-03-29 | Einkomponentige heisshärtende epoxidharzzusammensetzung und halbleitermontage-unterfüllungsmaterial |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60217095T Expired - Lifetime DE60217095T2 (de) | 2001-03-30 | 2002-03-29 | Einkomponentige heisshärtende epoxidharzzusammensetzung und halbleitermontage-unterfüllungsmaterial |
Country Status (6)
Country | Link |
---|---|
US (1) | US7449362B2 (de) |
EP (2) | EP1754735B1 (de) |
JP (1) | JP5280597B2 (de) |
AT (2) | ATE349475T1 (de) |
DE (2) | DE60227433D1 (de) |
WO (1) | WO2002079294A1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4556631B2 (ja) * | 2004-11-17 | 2010-10-06 | 住友ベークライト株式会社 | 液状樹脂組成物、それを用いた半導体装置の製造方法及び半導体装置 |
JP2007162001A (ja) | 2005-11-21 | 2007-06-28 | Shin Etsu Chem Co Ltd | 液状エポキシ樹脂組成物 |
US20080036097A1 (en) * | 2006-08-10 | 2008-02-14 | Teppei Ito | Semiconductor package, method of production thereof and encapsulation resin |
KR20100022960A (ko) | 2007-04-27 | 2010-03-03 | 스미토모 베이클리트 컴퍼니 리미티드 | 반도체 웨이퍼의 접합 방법 및 반도체 장치의 제조 방법 |
JP6085172B2 (ja) * | 2010-04-21 | 2017-02-22 | 三菱瓦斯化学株式会社 | 熱硬化性組成物 |
KR101319493B1 (ko) * | 2010-12-30 | 2013-10-22 | 주식회사 삼양사 | 감광성 수지 조성물 및 이로부터 제조되는 절연막 |
JP5467469B2 (ja) | 2011-01-04 | 2014-04-09 | 山栄化学株式会社 | プリント配線基板に表面実装する方法 |
JP5739372B2 (ja) * | 2012-04-25 | 2015-06-24 | 信越化学工業株式会社 | 接着剤組成物、並びにこれを用いた接着シート、半導体装置保護用材料、及び半導体装置 |
CN108587385A (zh) * | 2018-05-30 | 2018-09-28 | 安徽润晟建设有限公司 | 一种耐冲击防水环氧涂料 |
CN110649241B (zh) * | 2019-09-27 | 2021-01-26 | 东北大学 | 硅基Si-B-C负极材料及其电化学合成方法和应用 |
CN114051647B (zh) * | 2020-01-29 | 2023-02-03 | 株式会社村田制作所 | 带电极的无源部件和带电极的无源部件的集合体 |
Family Cites Families (45)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5418675A (en) * | 1977-07-13 | 1979-02-10 | Hitachi Ltd | Sealing method for semiconductor element |
US4652398A (en) * | 1985-09-12 | 1987-03-24 | Stauffer Chemical Company | Rapid curing, thermally stable adhesive composition comprising epoxy resin, polyimide, reactive solvent, and crosslinker |
JPS62124113A (ja) * | 1985-11-25 | 1987-06-05 | Matsushita Electric Works Ltd | エポキシ樹脂組成物 |
JPS62124115A (ja) * | 1985-11-25 | 1987-06-05 | Matsushita Electric Works Ltd | 一液性エポキシ樹脂封止剤 |
JPS62172014A (ja) * | 1986-01-25 | 1987-07-29 | Matsushita Electric Works Ltd | 一液性エポキシ樹脂組成物 |
JPH0657741B2 (ja) * | 1986-09-25 | 1994-08-03 | 味の素株式会社 | 一液性エポキシ樹脂組成物 |
JP2724499B2 (ja) * | 1989-05-25 | 1998-03-09 | 新日本理化株式会社 | エポキシ樹脂組成物 |
JPH0660232B2 (ja) * | 1989-09-29 | 1994-08-10 | 信越化学工業株式会社 | 液状エポキシ樹脂組成物 |
US5089440A (en) * | 1990-03-14 | 1992-02-18 | International Business Machines Corporation | Solder interconnection structure and process for making |
JP3198473B2 (ja) * | 1993-06-30 | 2001-08-13 | ソマール株式会社 | レーザービームマーキング可能なエポキシ樹脂組成物 |
CA2144330A1 (en) | 1993-07-27 | 1995-02-09 | Fumio Suzuki | A therapeutic agent for parkinson's disease |
US5466302A (en) * | 1994-05-09 | 1995-11-14 | Regents Of The University Of California | Solar cell array interconnects |
KR0181615B1 (ko) * | 1995-01-30 | 1999-04-15 | 모리시다 요이치 | 반도체 장치의 실장체, 그 실장방법 및 실장용 밀봉재 |
US5985043A (en) * | 1997-07-21 | 1999-11-16 | Miguel Albert Capote | Polymerizable fluxing agents and fluxing adhesive compositions therefrom |
JP3543902B2 (ja) * | 1997-01-17 | 2004-07-21 | ヘンケル ロックタイト コーポレイション | 半導体装置の実装構造および実装方法 |
US6274389B1 (en) * | 1997-01-17 | 2001-08-14 | Loctite (R&D) Ltd. | Mounting structure and mounting process from semiconductor devices |
JP3613367B2 (ja) | 1997-01-17 | 2005-01-26 | ヘンケル コーポレイション | 熱硬化性樹脂組成物 |
US6180696B1 (en) * | 1997-02-19 | 2001-01-30 | Georgia Tech Research Corporation | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant |
DE69820866T2 (de) | 1997-03-24 | 2004-12-30 | Kyowa Hakko Kogyo Co., Ltd. | [1,2,4]TRIAZOLO[1,5-c]PYRIMIDIN-DERIVATE |
DE1025587T1 (de) * | 1997-07-21 | 2001-02-08 | Aguila Technologies Inc | Halbleiter-flipchippackung und herstellungsverfahren dafür |
US6335571B1 (en) * | 1997-07-21 | 2002-01-01 | Miguel Albert Capote | Semiconductor flip-chip package and method for the fabrication thereof |
US5985456A (en) * | 1997-07-21 | 1999-11-16 | Miguel Albert Capote | Carboxyl-containing polyunsaturated fluxing adhesive for attaching integrated circuits |
JPH11140165A (ja) * | 1997-11-05 | 1999-05-25 | Shikoku Chem Corp | エポキシ樹脂組成物 |
EP1300147A1 (de) | 1998-01-05 | 2003-04-09 | Eisai Co. Ltd | Purinderivate und Adenosin-A2 Rezeptorantagonist als vorbeugendes oder therapeutisches Mittel für Zuckerkrankheitsmellitus |
WO1999035187A1 (en) * | 1998-01-07 | 1999-07-15 | Georgia Tech Research Corporation | Reworkable epoxy underfill encapsulants |
US6653371B1 (en) * | 1998-01-16 | 2003-11-25 | Barry E. Burns | One-part curable composition of polyepoxide, polythiol, latent hardener and solid organic acid |
US6059894A (en) * | 1998-04-08 | 2000-05-09 | Hewlett-Packard Company | High temperature flip chip joining flux that obviates the cleaning process |
GB2353528A (en) * | 1998-04-22 | 2001-02-28 | Multicore Solders Ltd | Adhesive and encapsulating material with fluxing properties |
JP3570229B2 (ja) * | 1998-07-13 | 2004-09-29 | 松下電器産業株式会社 | 半田接合方法および半田接合用の熱硬化性樹脂 |
JP3719855B2 (ja) * | 1998-09-03 | 2005-11-24 | 住友ベークライト株式会社 | 半導体用樹脂ペースト |
WO2000017201A1 (fr) | 1998-09-22 | 2000-03-30 | Kyowa Hakko Kogyo Co., Ltd. | DERIVES DE [1,2,4]TRIAZOLO[1,5-c]PYRIMIDINE |
JP2000141084A (ja) * | 1998-10-02 | 2000-05-23 | Sophia Systems & Technology | はんだをその場所でカプセルに包むための重合性フラックス組成物 |
JP2000216300A (ja) * | 1999-01-22 | 2000-08-04 | Fuji Electric Co Ltd | 樹脂封止形プリント回路板の製造方法 |
JP2000297201A (ja) * | 1999-02-12 | 2000-10-24 | Shin Etsu Chem Co Ltd | フリップチップ型半導体装置用封止材及びフリップチップ型半導体装置 |
US6194788B1 (en) * | 1999-03-10 | 2001-02-27 | Alpha Metals, Inc. | Flip chip with integrated flux and underfill |
US6376100B1 (en) * | 1999-06-09 | 2002-04-23 | Shin Etsu-Chemical Co., Ltd. | Flip-chip type semiconductor device underfill material and flip-chip type semiconductor device |
US6395124B1 (en) * | 1999-07-30 | 2002-05-28 | 3M Innovative Properties Company | Method of producing a laminated structure |
US6746896B1 (en) * | 1999-08-28 | 2004-06-08 | Georgia Tech Research Corp. | Process and material for low-cost flip-chip solder interconnect structures |
JP3736611B2 (ja) * | 2000-02-01 | 2006-01-18 | 信越化学工業株式会社 | フリップチップ型半導体装置用封止材及びフリップチップ型半導体装置 |
WO2001072898A1 (en) * | 2000-03-29 | 2001-10-04 | Georgia Tech Research Corporation | Thermally degradable epoxy underfills for flip-chip applications |
JP2002031187A (ja) | 2000-07-13 | 2002-01-31 | Ebara Corp | 磁気浮上装置を用いた除振装置 |
US7108920B1 (en) * | 2000-09-15 | 2006-09-19 | Henkel Corporation | Reworkable compositions incorporating episulfide resins |
JP4656269B2 (ja) * | 2000-09-22 | 2011-03-23 | 信越化学工業株式会社 | 液状エポキシ樹脂組成物及び半導体装置 |
US6458472B1 (en) * | 2001-01-08 | 2002-10-01 | Henkel Loctite Corporation | Fluxing underfill compositions |
US7192997B2 (en) * | 2001-02-07 | 2007-03-20 | International Business Machines Corporation | Encapsulant composition and electronic package utilizing same |
-
2001
- 2001-03-30 JP JP2001099479A patent/JP5280597B2/ja not_active Expired - Fee Related
-
2002
- 2002-03-29 DE DE60227433T patent/DE60227433D1/de not_active Expired - Lifetime
- 2002-03-29 US US10/472,191 patent/US7449362B2/en not_active Expired - Fee Related
- 2002-03-29 EP EP06090201A patent/EP1754735B1/de not_active Expired - Lifetime
- 2002-03-29 AT AT02708720T patent/ATE349475T1/de not_active IP Right Cessation
- 2002-03-29 DE DE60217095T patent/DE60217095T2/de not_active Expired - Lifetime
- 2002-03-29 EP EP02708720A patent/EP1384738B1/de not_active Expired - Lifetime
- 2002-03-29 AT AT06090201T patent/ATE399806T1/de not_active IP Right Cessation
- 2002-03-29 WO PCT/JP2002/003151 patent/WO2002079294A1/ja active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP1384738A1 (de) | 2004-01-28 |
EP1384738A4 (de) | 2005-08-10 |
US20040209403A1 (en) | 2004-10-21 |
ATE349475T1 (de) | 2007-01-15 |
WO2002079294A1 (fr) | 2002-10-10 |
ATE399806T1 (de) | 2008-07-15 |
DE60217095D1 (de) | 2007-02-08 |
JP5280597B2 (ja) | 2013-09-04 |
DE60217095T2 (de) | 2007-10-31 |
EP1384738B1 (de) | 2006-12-27 |
JP2002293883A (ja) | 2002-10-09 |
US7449362B2 (en) | 2008-11-11 |
EP1754735B1 (de) | 2008-07-02 |
EP1754735A1 (de) | 2007-02-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |