JP6085172B2 - 熱硬化性組成物 - Google Patents
熱硬化性組成物 Download PDFInfo
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- JP6085172B2 JP6085172B2 JP2012511667A JP2012511667A JP6085172B2 JP 6085172 B2 JP6085172 B2 JP 6085172B2 JP 2012511667 A JP2012511667 A JP 2012511667A JP 2012511667 A JP2012511667 A JP 2012511667A JP 6085172 B2 JP6085172 B2 JP 6085172B2
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- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 235000009120 camo Nutrition 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 235000005607 chanvre indien Nutrition 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- UQLDLKMNUJERMK-UHFFFAOYSA-L di(octadecanoyloxy)lead Chemical compound [Pb+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O UQLDLKMNUJERMK-UHFFFAOYSA-L 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- LQRUPWUPINJLMU-UHFFFAOYSA-N dioctyl(oxo)tin Chemical compound CCCCCCCC[Sn](=O)CCCCCCCC LQRUPWUPINJLMU-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 125000000816 ethylene group Polymers [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- JMANVNJQNLATNU-UHFFFAOYSA-N glycolonitrile Natural products N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 239000011487 hemp Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- DLAPQHBZCAAVPQ-UHFFFAOYSA-N iron;pentane-2,4-dione Chemical compound [Fe].CC(=O)CC(C)=O DLAPQHBZCAAVPQ-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- GIWKOZXJDKMGQC-UHFFFAOYSA-L lead(2+);naphthalene-2-carboxylate Chemical compound [Pb+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 GIWKOZXJDKMGQC-UHFFFAOYSA-L 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- SGGOJYZMTYGPCH-UHFFFAOYSA-L manganese(2+);naphthalene-2-carboxylate Chemical compound [Mn+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 SGGOJYZMTYGPCH-UHFFFAOYSA-L 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- JDEJGVSZUIJWBM-UHFFFAOYSA-N n,n,2-trimethylaniline Chemical compound CN(C)C1=CC=CC=C1C JDEJGVSZUIJWBM-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 229920009441 perflouroethylene propylene Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002102 polyvinyl toluene Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/04—Epoxynovolacs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/681—Metal alcoholates, phenolates or carboxylates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
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- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
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- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L63/04—Epoxynovolacs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Description
下記式(I)で表されるイミダゾール化合物(A)と、
エポキシ化合物(B)と、
シアネート化合物(C1)またはBT樹脂(C2)と、
を含んでなるものである。
R1およびR2は、それぞれ独立して、炭素数3〜18のアルキル基、炭素数3〜18のアルケニル基、炭素数3〜18のアルコキシル基、または炭素数6〜14の置換もしくは非置換の芳香族置換基を表し、
R3は、水素、炭素数1〜18のアルキル基、炭素数2〜18のアルケニル基、炭素数1〜18のアルコキシル基、炭素数6〜14の置換もしくは非置換の芳香族置換基、またはハロゲン基を表す。)
本発明において用いられるエポキシ化合物(B)は、1分子中に2個以上のエポキシ基を有する化合物であれば特に制限なく、公知のものを使用することができる。本発明において、好ましいエポキシ化合物(B)としては、1分子中に2個以上の水酸基を有する化合物の水酸基の水素原子をグリシジル基に置換した構造のものが挙げられる。また、エポキシ化合物(B)は、芳香族基を有するものが好ましく、グリシジル基が芳香族基に直結した構造のものを好適に使用することができる。このようなエポキシ化合物としては、例えば、ビスフェノールA、ビスフェノールF、ビスフェノールM、ビスフェノールP、ビスフェノールE、フェノールノボラック樹脂、クレゾールノボラック樹脂、ジシクロペンタジエンノボラック樹脂、テトラメチルビスフェノールF、ビスフェノールAノボラック樹脂、臭素化ビスフェノールA、臭素化フェノールノボラック樹脂、3官能フェノール、4官能フェノール、ナフタレン型フェノール、ビフェニル型フェノール、フェノールアラルキル樹脂、ビフェニルアラルキル樹脂、ナフトールアラルキル樹脂、ジシクロペンタジエンアラルキル樹脂、脂環式フェノール、リン含有フェノール等の水酸基の水素原子をグリシジル基に置換した構造の化合物、またはグリシジルアミン、グリシジルエステル、ブタジエンなどの2重結合をエポキシ化した化合物、水酸基含有シリコン樹脂類とエピクロルヒドリン等との反応により得られる化合物等が挙げられる。これらのエポキシ化合物(B)は、単独でまたは2種以上を適宜組み合わせて使用してもよい。また、上記したエポキシ化合物(B)は、モノマー、オリゴマーおよび樹脂のいずれの形態であってもよい。
本発明において用いられるシアネート化合物(C1)は、1分子中に2個以上のシアネート基を有する化合物であれば特に制限なく、公知のものを使用することができる。本発明において、好ましいシアネート化合物(C1)としては、1分子中に2個以上の水酸基を有する化合物の水酸基をシアネート基に置換した構造のものが挙げられる。また、シアネート化合物(C1)は、芳香族基を有するものが好ましく、シアネート基が芳香族基に直結した構造のものを好適に使用することができる。このようなシアネート化合物としては、例えば、ビスフェノールA、ビスフェノールF、ビスフェノールM、ビスフェノールP、ビスフェノールE、フェノールノボラック樹脂、クレゾールノボラック樹脂、ジシクロペンタジエンノボラック樹脂、テトラメチルビスフェノールF、ビスフェノールAノボラック樹脂、臭素化ビスフェノールA、臭素化フェノールノボラック樹脂、3官能フェノール、4官能フェノール、ナフタレン型フェノール、ビフェニル型フェノール、フェノールアラルキル樹脂、ビフェニルアラルキル樹脂、ナフトールアラルキル樹脂、ジシクロペンタジエンアラルキル樹脂、脂環式フェノール、リン含有フェノール等の水酸基をシアネート基に置換した構造のものが挙げられる。これらのシアネート化合物(C1)は、単独でまたは2種以上を適宜組み合わせて使用してもよい。また、上記したシアネート化合物(C1)は、モノマー、オリゴマーおよび樹脂のいずれの形態であってもよい。
本発明において用いられるBT樹脂(C2)とは、上記したシアネート化合物(C1)とマレイミド化合物とを、無溶剤で加熱溶融混合するか、または、適当な有機溶剤に溶解させて加熱混合し、ポリマー化したものを意味する。シアネート化合物(C1)とマレイミド化合物とを混合するのに用いられる有機溶剤としては、メチルエチルケトン、Nメチルピロドリン、ジメチルホルムアミド、ジメチルアセトアミド、トルエン、キシレン等が挙げられる。
本発明による樹脂組成物は、さらにマレイミド化合物(D)を含んでいてもよい。マレイミド化合物(D)としては、上記したものを好適に使用することができる。マレイミド化合物(D)の含有量は、吸湿耐熱性の観点から、樹脂の総量に対して、50質量%以下であることが好ましく、より好ましくは40質量%以下である。なお、ここでの樹脂の総量とは、イミダゾール化合物(A)と、エポキシ化合物(B)と、シアネート化合物(C1)またはBT樹脂(C2)と、マレイミド化合物(D)との合計質量をいうものとする。
本発明による樹脂組成物は、加熱することにより硬化する。硬化条件は、樹脂組成物の組成や硬化促進剤であるイミダゾール化合物(A)の配合量などによって変化する。樹脂組成物を完全に硬化させる場合は、通常、100〜300℃の範囲で、所定時間の加熱を行う。加圧環境下で加熱してもよく、例えば、0.1〜5MPa、好ましくは0.5〜3MPaの加圧下で、樹脂組成物を硬化させる。
プリプレグは、上記した樹脂組成物を、基材に含浸または塗布したものである。基材としては、各種プリント配線板材料等に用いられている公知の無機または有機の繊維質補強材を使用することができる。無機繊維質補強材としては、例えば、E、NE、D、S、Tガラス等のガラス繊維、石英ガラス繊維、カーボン繊維、アルミナファイバー、炭化珪素ファイバー、アスベスト、ロックウール、スラグウール、石膏ウィスカーなどの無機繊維や、その繊布もしくは不繊布、またはこれらの混合物が挙げられる。また、有機繊維質補強材としては、例えば、全芳香族ポリアミド繊維、ポリイミド繊維、液晶ポリエステル、ポリエステル繊維、フッ素繊維、ポリベンゾオキサゾール繊維、綿、麻、セミカーボン繊維などの有機繊維や、その繊布もしくは不繊布、またはこれらの混合物が挙げられる。
2,2−ビス(4−シアナトフェニル)プロパン(CA200、三菱ガス化学(株)製)25質量部、およびビス(3−エチル−5−メチル−4−マレイミドフェニル)メタン(BMI−70、ケイアイ化成製)25質量部を混合し、150℃で溶融させて攪拌しながら6時間反応させた後、これをメチルエチルケトンに溶解させることによりBT樹脂を得た。
加熱条件1:製品温度220℃で20分間保持
加熱条件2:製品温度200℃で60分間保持
加熱条件3:製品温度200℃で60分間保持
2,2−ビス(4−シアナトフェニル)プロパン(CA200、三菱ガス化学(株)製)60質量部を150℃で溶融させて攪拌しながら6時間反応させた後、これをメチルエチルケトンに溶解させることによりプレポリマー得た。
実施例1において2,4,5−トリフェニルイミダゾールに代えて2−フェニル,4−メチルイミダゾール(東京化成工業製)を使用した以外は、実施例1と同様にして、絶縁層厚さ0.2mmの銅張積層板を得た。
実施例1において2,4,5−トリフェニルイミダゾールを使用しなかった以外は、実施例1と同様にして、絶縁層厚さ0.2mmの銅張積層板を得た。
実施例2において2,4,5−トリフェニルイミダゾールに代えて2−フェニル,4−メチルイミダゾール(東京化成工業製)を使用した以外は、実施例2と同様にして、絶縁層厚さ0.2mmの銅張積層板を得た。
実施例2において2,4,5−トリフェニルイミダゾールを使用しなかった以外は、実施例2と同様にして、絶縁層厚さ0.2mmの銅張積層板を得た。
上記のようにして得られた各プリプレグおよび積層板について、下記のようにして、プリプレグゲル化時間測定、ガラス転移温度測定、および吸湿耐熱性評価を行った。
(1)プリプレグゲル化時間
プリプレグを40℃の恒温環境下に0,5,10,15および30日放置し、各ゲル化時間を測定した。ゲル化時間の測定は、JIS C6521(多層プリント配線板用プリプレグ試験法)の硬化時間測定に準拠して行った(JIS C6521の5.7参照)。
サイズ10mm×60mmのサンプルを作製し、DMA装置(TA Instrumen2980型)を用いて、昇温10℃/minの条件下でガラス転移温度の測定を行った。測定は、JIS C6481(プリント配線板用銅張積層板試験方法)のDMA法B法に準拠して行った(JIS C6481の5.17.2参照)。
Claims (12)
- 前記式(I)のR1およびR2が、それぞれ独立して、イソプロピル基、t−ブチル基、イソプロピルアルコキシル基、t−ブチルアルコキシル基、フェニル基、またはナフチル基を表す、請求項1に記載の樹脂組成物。
- 前記式(I)のR1およびR2が、いずれもフェニル基である、請求項2に記載の樹脂組成物。
- 前記イミダゾール化合物(A)が、樹脂の総量に対して、0.1〜10質量%含まれてなる、請求項1〜3のいずれか一項に記載の樹脂組成物。
- 前記エポキシ化合物(B)が、樹脂の総量に対して、25〜95質量%含まれてなる、請求項1〜4のいずれか一項に記載の樹脂組成物。
- 前記シアネート化合物(C1)が、樹脂の総量に対して、5〜75質量%含まれてなる、請求項1〜5のいずれか一項に記載の樹脂組成物。
- 前記BT樹脂(C2)が、樹脂の総量に対して、5〜75質量%含まれてなる、請求項1〜5のいずれか一項に記載の樹脂組成物。
- 請求項1〜7のいずれか一項に記載の樹脂組成物を、基材に含浸または塗布してなるプリプレグ。
- 請求項8に記載のプリプレグを積層成形した、積層板。
- 請求項8に記載のプリプレグと金属箔とを積層成形した、金属箔張積層板。
- 請求項1〜7のいずれか一項に記載の樹脂組成物を用いた構造材料。
- 請求項1〜7のいずれか一項に記載の樹脂組成物を含んでなる注型用樹脂。
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Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104736589B (zh) * | 2012-10-19 | 2017-05-24 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、层压板、覆金属箔层压板以及印刷电路板 |
CN111393854B (zh) * | 2012-10-19 | 2022-02-25 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、层压板、以及印刷电路板 |
CN104837922B (zh) | 2012-11-28 | 2019-05-10 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、层叠板、覆金属箔层叠板、以及印刷电路板 |
JP6249345B2 (ja) * | 2013-03-22 | 2017-12-20 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、積層板及びプリント配線板 |
JP2015207754A (ja) | 2013-12-13 | 2015-11-19 | 日亜化学工業株式会社 | 発光装置 |
JP6639072B2 (ja) * | 2014-02-06 | 2020-02-05 | 三菱瓦斯化学株式会社 | プリント配線板用樹脂組成物、プリプレグ、積層板及びプリント配線板 |
JP6578735B2 (ja) | 2014-05-21 | 2019-09-25 | 日亜化学工業株式会社 | 半導体装置の実装構造、バックライト装置及び実装基板 |
CN104130548A (zh) * | 2014-07-29 | 2014-11-05 | 深圳市惠程电气股份有限公司 | 一种聚酰亚胺纤维预浸料及其制备方法与应用 |
JP2016035038A (ja) * | 2014-08-01 | 2016-03-17 | 日本化薬株式会社 | 炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグ、炭素繊維強化複合材料 |
JP2016034996A (ja) * | 2014-08-01 | 2016-03-17 | 日本化薬株式会社 | エポキシ樹脂組成物、プリプレグ及び金属張積層板、プリント配線基板 |
JP6366136B2 (ja) * | 2014-08-01 | 2018-08-01 | 日本化薬株式会社 | エポキシ樹脂組成物、樹脂シート、プリプレグ及び金属張積層板、プリント配線基板 |
JP6932116B2 (ja) * | 2014-08-01 | 2021-09-08 | 日本化薬株式会社 | エポキシ樹脂含有ワニス、エポキシ樹脂組成物含有ワニス、プリプレグ、樹脂シート、プリント配線板、半導体装置 |
JP6472073B2 (ja) * | 2014-08-01 | 2019-02-20 | 日本化薬株式会社 | エポキシ樹脂含有ワニス、エポキシ樹脂組成物含有ワニス、プリプレグ、樹脂シート、プリント配線板、半導体装置 |
KR101989259B1 (ko) | 2015-01-19 | 2019-06-13 | 가부시키가이샤 도모에가와 세이시쇼 | 열경화성 접착제 조성물, 열경화성 접착 필름, 및 복합 필름 |
KR101762102B1 (ko) * | 2015-02-03 | 2017-08-04 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 및 프린트 배선판 |
JP6648425B2 (ja) * | 2015-06-22 | 2020-02-14 | 味の素株式会社 | 樹脂組成物 |
JP6764582B2 (ja) * | 2015-07-06 | 2020-10-07 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、レジンシート、金属箔張積層板及びプリント配線板 |
EP3178863B1 (de) * | 2015-12-11 | 2019-08-28 | Evonik Degussa GmbH | Epoxidharz-zusammensetzungen zur herstellung von lagerstabilen composites |
CN107253259A (zh) * | 2016-11-29 | 2017-10-17 | 上海晋运实业有限公司 | 一种再生纤维板及其制备方法、用途 |
US20200223998A1 (en) * | 2017-09-29 | 2020-07-16 | Panasonic Intellectual Property Management Co., Ltd. | Prepreg, and metal-clad laminated board and wiring substrate obtained using same |
CN108047718B (zh) * | 2017-12-29 | 2020-07-28 | 广东生益科技股份有限公司 | 马来酰亚胺树脂组合物、预浸料、层压板和印刷电路板 |
JP2020050797A (ja) * | 2018-09-27 | 2020-04-02 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板 |
JP6881552B2 (ja) * | 2019-11-13 | 2021-06-02 | 味の素株式会社 | 樹脂組成物 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02286723A (ja) * | 1989-04-28 | 1990-11-26 | Matsushita Electric Works Ltd | 積層板用樹脂組成物及び積層板 |
JP2000063496A (ja) * | 1998-08-25 | 2000-02-29 | Toshiba Chem Corp | 封止用樹脂組成物および半導体封止装置 |
JP2000239496A (ja) * | 1998-12-24 | 2000-09-05 | Hitachi Chem Co Ltd | シアネート・エポキシ樹脂組成物並びにそれを用いたプリプレグ、金属箔張り積層板及び印刷配線板 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5741879A (en) * | 1995-03-03 | 1998-04-21 | Minnesota Mining And Manufacturing Company | Energy-polymerizable compositions comprising a cyanate ester monomer or oligomer and a polyol |
US5847327A (en) * | 1996-11-08 | 1998-12-08 | W.L. Gore & Associates, Inc. | Dimensionally stable core for use in high density chip packages |
AU728193B2 (en) * | 1997-07-24 | 2001-01-04 | Loctite Corporation | Thermosetting resin compositions useful as underfill sealants |
WO2000039216A1 (fr) * | 1998-12-24 | 2000-07-06 | Hitachi Chemical Company, Ltd. | Composition de cyanate et de resine epoxy, et preimpregne, plaque stratifiee en papier metallique et carte de circuit imprime utilisant cette composition |
US6632893B2 (en) * | 1999-05-28 | 2003-10-14 | Henkel Loctite Corporation | Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners |
JP4783984B2 (ja) * | 2001-02-15 | 2011-09-28 | 日立化成工業株式会社 | 樹脂組成物およびその用途ならびにそれらの製造方法 |
JP5280597B2 (ja) * | 2001-03-30 | 2013-09-04 | サンスター技研株式会社 | 一液加熱硬化型エポキシ樹脂組成物および半導体実装用アンダーフィル材 |
EP1461387B1 (en) * | 2001-12-05 | 2012-02-08 | Isola Laminate Systems, Corp. | Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s) |
JP3821728B2 (ja) * | 2002-03-06 | 2006-09-13 | 住友ベークライト株式会社 | プリプレグ |
JP4784066B2 (ja) * | 2004-10-28 | 2011-09-28 | 三菱瓦斯化学株式会社 | 樹脂組成物及び銅張積層板 |
KR101019738B1 (ko) * | 2006-02-24 | 2011-03-08 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | 수지 조성물, 프리프레그 및 금속-호일-클래드 라미네이트 |
US20080051524A1 (en) * | 2006-08-28 | 2008-02-28 | Henkel Corporation | Epoxy-Based Compositions Having Improved Impact Resistance |
WO2009040921A1 (ja) * | 2007-09-27 | 2009-04-02 | Panasonic Electric Works Co., Ltd. | エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ及び金属張積層板 |
WO2009119046A1 (ja) | 2008-03-26 | 2009-10-01 | 住友ベークライト株式会社 | 銅箔付き樹脂シート、多層プリント配線板、多層プリント配線の板製造方法および半導体装置 |
SG11201404327PA (en) * | 2012-01-31 | 2014-10-30 | Mitsubishi Gas Chemical Co | Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using same |
-
2011
- 2011-04-19 SG SG10201503091TA patent/SG10201503091TA/en unknown
- 2011-04-19 SG SG2012078093A patent/SG184967A1/en unknown
- 2011-04-19 EP EP11772009.4A patent/EP2562196B1/en active Active
- 2011-04-19 US US13/641,985 patent/US20130101863A1/en not_active Abandoned
- 2011-04-19 JP JP2012511667A patent/JP6085172B2/ja active Active
- 2011-04-19 CN CN201180020278.XA patent/CN102939316B/zh active Active
- 2011-04-19 WO PCT/JP2011/059627 patent/WO2011132674A1/ja active Application Filing
- 2011-04-19 KR KR1020127026948A patent/KR101840486B1/ko active IP Right Grant
- 2011-04-21 TW TW100113898A patent/TWI573812B/zh active
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2013
- 2013-08-05 HK HK13109097.8A patent/HK1181796A1/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02286723A (ja) * | 1989-04-28 | 1990-11-26 | Matsushita Electric Works Ltd | 積層板用樹脂組成物及び積層板 |
JP2000063496A (ja) * | 1998-08-25 | 2000-02-29 | Toshiba Chem Corp | 封止用樹脂組成物および半導体封止装置 |
JP2000239496A (ja) * | 1998-12-24 | 2000-09-05 | Hitachi Chem Co Ltd | シアネート・エポキシ樹脂組成物並びにそれを用いたプリプレグ、金属箔張り積層板及び印刷配線板 |
Also Published As
Publication number | Publication date |
---|---|
CN102939316B (zh) | 2016-04-27 |
SG184967A1 (en) | 2012-11-29 |
KR20130079339A (ko) | 2013-07-10 |
EP2562196B1 (en) | 2018-02-21 |
JPWO2011132674A1 (ja) | 2013-07-18 |
KR101840486B1 (ko) | 2018-03-20 |
TWI573812B (zh) | 2017-03-11 |
US20130101863A1 (en) | 2013-04-25 |
HK1181796A1 (zh) | 2013-11-15 |
EP2562196A1 (en) | 2013-02-27 |
TW201204760A (en) | 2012-02-01 |
WO2011132674A1 (ja) | 2011-10-27 |
EP2562196A4 (en) | 2016-09-28 |
SG10201503091TA (en) | 2015-06-29 |
CN102939316A (zh) | 2013-02-20 |
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