HK1181796A1 - 熱固性組合物 - Google Patents

熱固性組合物

Info

Publication number
HK1181796A1
HK1181796A1 HK13109097.8A HK13109097A HK1181796A1 HK 1181796 A1 HK1181796 A1 HK 1181796A1 HK 13109097 A HK13109097 A HK 13109097A HK 1181796 A1 HK1181796 A1 HK 1181796A1
Authority
HK
Hong Kong
Prior art keywords
thermosetting composition
thermosetting
composition
Prior art date
Application number
HK13109097.8A
Other languages
English (en)
Inventor
馬渕義則
十龟政伸
有井健治
大塚
深澤繪美
Original Assignee
三菱瓦斯化學株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱瓦斯化學株式會社 filed Critical 三菱瓦斯化學株式會社
Publication of HK1181796A1 publication Critical patent/HK1181796A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C09D163/04—Epoxynovolacs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/681—Metal alcoholates, phenolates or carboxylates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
HK13109097.8A 2010-04-21 2013-08-05 熱固性組合物 HK1181796A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010097778 2010-04-21
PCT/JP2011/059627 WO2011132674A1 (ja) 2010-04-21 2011-04-19 熱硬化性組成物

Publications (1)

Publication Number Publication Date
HK1181796A1 true HK1181796A1 (zh) 2013-11-15

Family

ID=44834193

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13109097.8A HK1181796A1 (zh) 2010-04-21 2013-08-05 熱固性組合物

Country Status (9)

Country Link
US (1) US20130101863A1 (zh)
EP (1) EP2562196B1 (zh)
JP (1) JP6085172B2 (zh)
KR (1) KR101840486B1 (zh)
CN (1) CN102939316B (zh)
HK (1) HK1181796A1 (zh)
SG (2) SG10201503091TA (zh)
TW (1) TWI573812B (zh)
WO (1) WO2011132674A1 (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014061812A1 (ja) * 2012-10-19 2014-04-24 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、積層板、及びプリント配線板
US10030141B2 (en) * 2012-10-19 2018-07-24 Mitsubishi Gas Chemical Company, Inc. Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board
SG11201503925QA (en) * 2012-11-28 2015-06-29 Mitsubishi Gas Chemical Co Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board
JP6249345B2 (ja) * 2013-03-22 2017-12-20 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、積層板及びプリント配線板
JP2015207754A (ja) 2013-12-13 2015-11-19 日亜化学工業株式会社 発光装置
JP6639072B2 (ja) * 2014-02-06 2020-02-05 三菱瓦斯化学株式会社 プリント配線板用樹脂組成物、プリプレグ、積層板及びプリント配線板
JP6578735B2 (ja) 2014-05-21 2019-09-25 日亜化学工業株式会社 半導体装置の実装構造、バックライト装置及び実装基板
CN104130548A (zh) * 2014-07-29 2014-11-05 深圳市惠程电气股份有限公司 一种聚酰亚胺纤维预浸料及其制备方法与应用
JP6366136B2 (ja) * 2014-08-01 2018-08-01 日本化薬株式会社 エポキシ樹脂組成物、樹脂シート、プリプレグ及び金属張積層板、プリント配線基板
JP6472073B2 (ja) * 2014-08-01 2019-02-20 日本化薬株式会社 エポキシ樹脂含有ワニス、エポキシ樹脂組成物含有ワニス、プリプレグ、樹脂シート、プリント配線板、半導体装置
JP2016035038A (ja) * 2014-08-01 2016-03-17 日本化薬株式会社 炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグ、炭素繊維強化複合材料
JP6932116B2 (ja) * 2014-08-01 2021-09-08 日本化薬株式会社 エポキシ樹脂含有ワニス、エポキシ樹脂組成物含有ワニス、プリプレグ、樹脂シート、プリント配線板、半導体装置
JP2016034996A (ja) * 2014-08-01 2016-03-17 日本化薬株式会社 エポキシ樹脂組成物、プリプレグ及び金属張積層板、プリント配線基板
KR101989259B1 (ko) * 2015-01-19 2019-06-13 가부시키가이샤 도모에가와 세이시쇼 열경화성 접착제 조성물, 열경화성 접착 필름, 및 복합 필름
SG11201700803VA (en) * 2015-02-03 2017-03-30 Mitsubishi Gas Chemical Co Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board
JP6648425B2 (ja) * 2015-06-22 2020-02-14 味の素株式会社 樹脂組成物
US10815349B2 (en) * 2015-07-06 2020-10-27 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
ES2750595T3 (es) 2015-12-11 2020-03-26 Evonik Operations Gmbh Composiciones de resina epoxi para la producción de materiales compuestos estables en almacenamiento
CN107253259A (zh) * 2016-11-29 2017-10-17 上海晋运实业有限公司 一种再生纤维板及其制备方法、用途
US20200223998A1 (en) * 2017-09-29 2020-07-16 Panasonic Intellectual Property Management Co., Ltd. Prepreg, and metal-clad laminated board and wiring substrate obtained using same
CN108047718B (zh) * 2017-12-29 2020-07-28 广东生益科技股份有限公司 马来酰亚胺树脂组合物、预浸料、层压板和印刷电路板
JP2020050797A (ja) * 2018-09-27 2020-04-02 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板
JP6881552B2 (ja) * 2019-11-13 2021-06-02 味の素株式会社 樹脂組成物

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02286723A (ja) * 1989-04-28 1990-11-26 Matsushita Electric Works Ltd 積層板用樹脂組成物及び積層板
US5741879A (en) * 1995-03-03 1998-04-21 Minnesota Mining And Manufacturing Company Energy-polymerizable compositions comprising a cyanate ester monomer or oligomer and a polyol
US5847327A (en) * 1996-11-08 1998-12-08 W.L. Gore & Associates, Inc. Dimensionally stable core for use in high density chip packages
JP2001506313A (ja) * 1997-07-24 2001-05-15 ロックタイト コーポレーション アンダーフィル密封材として有用な熱硬化性樹脂組成物
JP2978164B1 (ja) * 1998-08-25 1999-11-15 東芝ケミカル株式会社 封止用樹脂組成物および半導体封止装置
JP3485169B2 (ja) * 1998-12-24 2004-01-13 日立化成工業株式会社 シアネート・エポキシ樹脂組成物並びにそれを用いたプリプレグ、金属箔張り積層板及び印刷配線板
EP1142953A4 (en) * 1998-12-24 2002-03-27 Hitachi Chemical Co Ltd COMPOSITION OF CYANATE AND EPOXY RESIN, AND PREPREGNE, METAL PAPER LAMINATE PLATE AND PRINTED CIRCUIT BOARD USING THE SAME
US6632893B2 (en) * 1999-05-28 2003-10-14 Henkel Loctite Corporation Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners
JP4783984B2 (ja) * 2001-02-15 2011-09-28 日立化成工業株式会社 樹脂組成物およびその用途ならびにそれらの製造方法
JP5280597B2 (ja) * 2001-03-30 2013-09-04 サンスター技研株式会社 一液加熱硬化型エポキシ樹脂組成物および半導体実装用アンダーフィル材
ATE544819T1 (de) * 2001-12-05 2012-02-15 Isola Laminate Systems Corp Prepreg und zusammensetzung von epoxidharz(en), sma-copolymer(e) und bismaleimid-triazin-harz(e)
JP3821728B2 (ja) * 2002-03-06 2006-09-13 住友ベークライト株式会社 プリプレグ
JP4784066B2 (ja) * 2004-10-28 2011-09-28 三菱瓦斯化学株式会社 樹脂組成物及び銅張積層板
KR101019738B1 (ko) * 2006-02-24 2011-03-08 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 수지 조성물, 프리프레그 및 금속-호일-클래드 라미네이트
US20080051524A1 (en) * 2006-08-28 2008-02-28 Henkel Corporation Epoxy-Based Compositions Having Improved Impact Resistance
WO2009040921A1 (ja) * 2007-09-27 2009-04-02 Panasonic Electric Works Co., Ltd. エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ及び金属張積層板
US8318292B2 (en) * 2008-03-26 2012-11-27 Sumitomo Bakelite Co., Ltd. Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device
EP2810971B1 (en) * 2012-01-31 2018-09-19 Mitsubishi Gas Chemical Company, Inc. Metal foil-clad laminate and printed wiring board using a resin composition

Also Published As

Publication number Publication date
EP2562196A1 (en) 2013-02-27
US20130101863A1 (en) 2013-04-25
CN102939316A (zh) 2013-02-20
JPWO2011132674A1 (ja) 2013-07-18
JP6085172B2 (ja) 2017-02-22
SG10201503091TA (en) 2015-06-29
TWI573812B (zh) 2017-03-11
EP2562196B1 (en) 2018-02-21
KR20130079339A (ko) 2013-07-10
SG184967A1 (en) 2012-11-29
WO2011132674A1 (ja) 2011-10-27
TW201204760A (en) 2012-02-01
CN102939316B (zh) 2016-04-27
KR101840486B1 (ko) 2018-03-20
EP2562196A4 (en) 2016-09-28

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