ATE544819T1 - Prepreg und zusammensetzung von epoxidharz(en), sma-copolymer(e) und bismaleimid-triazin-harz(e) - Google Patents
Prepreg und zusammensetzung von epoxidharz(en), sma-copolymer(e) und bismaleimid-triazin-harz(e)Info
- Publication number
- ATE544819T1 ATE544819T1 AT02804513T AT02804513T ATE544819T1 AT E544819 T1 ATE544819 T1 AT E544819T1 AT 02804513 T AT02804513 T AT 02804513T AT 02804513 T AT02804513 T AT 02804513T AT E544819 T1 ATE544819 T1 AT E544819T1
- Authority
- AT
- Austria
- Prior art keywords
- prepreg
- composition
- bismaleimide
- resin
- epoxy resin
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C08L61/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
- C08G59/4261—Macromolecular compounds obtained by reactions involving only unsaturated carbon-to-carbon bindings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L35/06—Copolymers with vinyl aromatic monomers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/08—Copolymers of styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2964—Artificial fiber or filament
- Y10T428/2967—Synthetic resin or polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2971—Impregnation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
- Y10T442/2926—Coated or impregnated inorganic fiber fabric
- Y10T442/2951—Coating or impregnation contains epoxy polymer or copolymer or polyether
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US33732201P | 2001-12-05 | 2001-12-05 | |
PCT/US2002/038949 WO2003048251A1 (en) | 2001-12-05 | 2002-12-05 | Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s) |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE544819T1 true ATE544819T1 (de) | 2012-02-15 |
Family
ID=23320061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT02804513T ATE544819T1 (de) | 2001-12-05 | 2002-12-05 | Prepreg und zusammensetzung von epoxidharz(en), sma-copolymer(e) und bismaleimid-triazin-harz(e) |
Country Status (5)
Country | Link |
---|---|
US (5) | US20030158337A1 (de) |
EP (1) | EP1461387B1 (de) |
AT (1) | ATE544819T1 (de) |
AU (1) | AU2002365609A1 (de) |
WO (1) | WO2003048251A1 (de) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030158337A1 (en) * | 2001-12-05 | 2003-08-21 | Isola Laminate Systems Corp. | Thermosetting resin composition for high performance laminates |
DE60231551D1 (de) * | 2001-12-05 | 2009-04-23 | Isola Laminate Systems Corp | Wärmehärtende harzzusammensetzung für hochleistungslaminate |
US8163830B2 (en) * | 2006-03-31 | 2012-04-24 | Intel Corporation | Nanoclays in polymer compositions, articles containing same, processes of making same, and systems containing same |
GB0622060D0 (en) * | 2006-11-06 | 2006-12-13 | Hexcel Composites Ltd | Improved composite materials |
US8217099B2 (en) * | 2008-05-22 | 2012-07-10 | Iteq (Dongguan) Corporation | Thermosetting resin composition |
US8104148B2 (en) * | 2008-05-22 | 2012-01-31 | Iteq (Dongguan) Corporation | Kind of prepolymer and its product-thermosetting resins composite |
KR101101158B1 (ko) | 2008-12-18 | 2012-01-05 | 제일모직주식회사 | 난연성 에폭시 수지 조성물 |
US20100240811A1 (en) * | 2009-03-18 | 2010-09-23 | He Yufang | Thermosetting Resin Composition and Application Thereof |
US8080313B2 (en) * | 2009-05-28 | 2011-12-20 | Cytec Technology Corp. | Particle-toughened fiber-reinforced polymer composites |
US8268926B2 (en) * | 2009-05-28 | 2012-09-18 | Cytec Technology Corp. | Particle-toughened polymer compositions |
US20110224332A1 (en) * | 2009-06-05 | 2011-09-15 | He Yufang | Thermosetting resin composition and use thereof |
US8658719B2 (en) * | 2009-06-11 | 2014-02-25 | Arlon | Low loss pre-pregs and laminates and compositions useful for the preparation thereof |
US20110014354A1 (en) * | 2009-07-20 | 2011-01-20 | David Christopher Graham | Adhesive compositions and methods for use in failure analysis |
SG184967A1 (en) * | 2010-04-21 | 2012-11-29 | Mitsubishi Gas Chemical Co | Heat curable composition |
TWI406932B (zh) | 2010-11-23 | 2013-09-01 | Ind Tech Res Inst | 無鹵無磷樹脂配方及由該樹脂配方製備之無鹵無磷低介電耐燃複合材料 |
TWI513747B (zh) * | 2011-06-13 | 2015-12-21 | Nanya Plastics Corp | A high frequency copper foil substrate and the composite material used |
TWI465485B (zh) | 2011-09-13 | 2014-12-21 | Ind Tech Res Inst | 含氧化石墨之樹脂配方、組成物及其複合材料與無機粉體的分散方法 |
TWI428390B (zh) | 2011-10-21 | 2014-03-01 | Ind Tech Res Inst | 低介電樹脂配方、預聚合物、組成物及其複合材料與低介電樹脂預聚合物溶液的製備方法 |
SG11201403955SA (en) * | 2012-01-19 | 2014-08-28 | Isola Usa Corp | Synthesized resins and varnishes, prepregs and laminates made thereform |
WO2014028338A1 (en) | 2012-08-13 | 2014-02-20 | Henkel Corporation | Liquid compression molding encapsulants |
US8678555B1 (en) | 2012-11-01 | 2014-03-25 | Funai Electric Co., Ltd. | Encapsulation of inkjet heater chip for ion beam cross-section polishing and method of preparing chip cross-section sample |
EP4140725A1 (de) * | 2014-07-10 | 2023-03-01 | Isola USA Corp. | Dünne kunstharzfolien und deren verwendung in layups |
US9822227B2 (en) | 2014-09-16 | 2017-11-21 | Isola Usa Corp. | High Tg epoxy formulation with good thermal properties |
SG11201900686XA (en) * | 2016-07-25 | 2019-02-27 | Isola Usa Corp | Improved sma resin formulation |
CN107916090B (zh) * | 2017-11-03 | 2020-07-28 | 浙江福斯特新材料研究院有限公司 | 一种低模量、高粘结能力的热塑性聚酰亚胺组合物及其应用和制备方法 |
DE102018201666A1 (de) | 2018-02-05 | 2019-08-08 | Ford Global Technologies, Llc | Speicheranordnung für ein Hybridfahrzeug |
GB201809830D0 (en) * | 2018-06-15 | 2018-08-01 | Hexcel Composties Ltd | Epoxy resin formulations |
WO2021212314A1 (zh) * | 2020-04-21 | 2021-10-28 | 穗晔实业股份有限公司 | 热固性树脂组成物 |
WO2023239831A1 (en) * | 2022-06-09 | 2023-12-14 | Lubrizol Advanced Materials, Inc. | Coupling agents |
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DE1720663C3 (de) * | 1967-06-01 | 1975-09-18 | Bayer Ag, 5090 Leverkusen | Verfahren zur Herstellung von Kunststoffen |
US4456712A (en) * | 1982-06-14 | 1984-06-26 | International Business Machines Corporation | Bismaleimide triazine composition |
JPS62275123A (ja) * | 1986-05-23 | 1987-11-30 | Toray Ind Inc | プリプレグ用樹脂組成物 |
JPH01123848A (ja) * | 1987-11-10 | 1989-05-16 | Asahi Glass Co Ltd | 積層材用樹脂組成物及び金属箔張積層板 |
GB2230785B (en) * | 1989-04-25 | 1993-07-21 | Matsushita Electric Works Ltd | Prepreg for a printed circuit board |
US5008477A (en) * | 1990-03-14 | 1991-04-16 | Ethyl Corporation | Decabromodiphenyl alkane process |
US5789482A (en) * | 1990-03-30 | 1998-08-04 | Ciba Specialty Chemicals Corporation | Epoxy resin with anhydride, toughener and active hydrogen-containing compound |
US5030778A (en) * | 1990-06-04 | 1991-07-09 | Ethyl Corporation | Decabromodiphenyl alkane process |
US5401890A (en) * | 1990-07-30 | 1995-03-28 | Albemarle Corporation | Process and apparatus for heat treating halogenated compounds |
JPH05222163A (ja) * | 1992-02-12 | 1993-08-31 | Toshiba Chem Corp | 耐熱性樹脂組成物 |
US5324874A (en) * | 1992-05-26 | 1994-06-28 | Ethyl Corporation | Process for a decarbromodiphenylethane predominate product having enhanced whiteness |
JPH061830A (ja) * | 1992-06-17 | 1994-01-11 | Meidensha Corp | 耐熱性滴下含浸用樹脂組成物 |
DE69413217T2 (de) * | 1993-04-07 | 1999-02-18 | Great Lakes Chemical Corp | Bromierte diphenylalkane und verfahren |
JPH07216162A (ja) * | 1994-01-11 | 1995-08-15 | Chi Mei Corp | 難燃性スチレン系樹脂組成物 |
US6518468B1 (en) * | 1994-09-16 | 2003-02-11 | Albemarle Corporation | Bromination process |
US6117371A (en) * | 1994-10-05 | 2000-09-12 | Great Lakes Chemical Corporation | Continuous bromination process and products thereof |
JPH10506910A (ja) * | 1994-10-05 | 1998-07-07 | グレート・レークス・ケミカル・コーポレーション | 連続的臭素化法およびその生成物 |
JPH0925393A (ja) * | 1995-05-09 | 1997-01-28 | Toray Ind Inc | 繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
JP3593347B2 (ja) * | 1996-10-29 | 2004-11-24 | アイソラ ラミネート システムズ | エポキシ樹脂組成物と架橋助剤とを含むスチレン及び無水マレイン酸のコポリマー |
TW359642B (en) * | 1997-04-21 | 1999-06-01 | Toray Industries | Resin composition for fiber-reinforced complex material, prepreg and fiber-reinforced complex material |
JP3398310B2 (ja) * | 1997-09-26 | 2003-04-21 | 京セラ株式会社 | 配線基板の製造方法 |
KR100572646B1 (ko) * | 1998-07-17 | 2006-04-24 | 제이에스알 가부시끼가이샤 | 폴리이미드계 복합체 및 이 복합체를 사용한 전자 부품, 및 폴리이미드계 수성 분산액 |
WO2000032690A1 (fr) * | 1998-12-03 | 2000-06-08 | Kaneka Corporation | Composition elastomere et composition de resine thermoplastique la contenant |
DE69935260T3 (de) * | 1998-12-11 | 2010-05-20 | Isola USA Corporation, Chandler | Sichtbares und fluoreszenzfarbstoff enthaltendes laminat |
US6500546B1 (en) * | 2000-05-02 | 2002-12-31 | Resolution Performance Products Llc | Halogen-free phosphorous-containing flame-resistant epoxy resin compositions |
US20030158337A1 (en) * | 2001-12-05 | 2003-08-21 | Isola Laminate Systems Corp. | Thermosetting resin composition for high performance laminates |
MY159048A (en) * | 2005-12-06 | 2016-12-15 | Isola Usa Corp | Laminates for high speed and high frequency printed circuit boards |
-
2002
- 2002-12-05 US US10/310,418 patent/US20030158337A1/en not_active Abandoned
- 2002-12-05 AT AT02804513T patent/ATE544819T1/de active
- 2002-12-05 EP EP02804513A patent/EP1461387B1/de not_active Expired - Lifetime
- 2002-12-05 AU AU2002365609A patent/AU2002365609A1/en not_active Abandoned
- 2002-12-05 WO PCT/US2002/038949 patent/WO2003048251A1/en not_active Application Discontinuation
-
2005
- 2005-07-20 US US11/185,259 patent/US7521494B2/en not_active Expired - Lifetime
-
2009
- 2009-04-02 US US12/417,463 patent/US7713621B2/en not_active Expired - Lifetime
-
2010
- 2010-05-04 US US12/773,480 patent/US8227084B2/en not_active Expired - Lifetime
-
2012
- 2012-07-23 US US13/555,777 patent/US20120289113A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP1461387A1 (de) | 2004-09-29 |
AU2002365609A1 (en) | 2003-06-17 |
EP1461387A4 (de) | 2005-01-12 |
US8227084B2 (en) | 2012-07-24 |
US20050250916A1 (en) | 2005-11-10 |
US7713621B2 (en) | 2010-05-11 |
US20110111662A1 (en) | 2011-05-12 |
US20100009201A1 (en) | 2010-01-14 |
EP1461387B1 (de) | 2012-02-08 |
WO2003048251A1 (en) | 2003-06-12 |
US20120289113A1 (en) | 2012-11-15 |
US7521494B2 (en) | 2009-04-21 |
US20030158337A1 (en) | 2003-08-21 |
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