DE60114240D1 - Flammhemmende epoxidharzzusammensetzung und damit hergestellte prepregs und faserverstärkte verbundwerkstoffe - Google Patents

Flammhemmende epoxidharzzusammensetzung und damit hergestellte prepregs und faserverstärkte verbundwerkstoffe

Info

Publication number
DE60114240D1
DE60114240D1 DE60114240T DE60114240T DE60114240D1 DE 60114240 D1 DE60114240 D1 DE 60114240D1 DE 60114240 T DE60114240 T DE 60114240T DE 60114240 T DE60114240 T DE 60114240T DE 60114240 D1 DE60114240 D1 DE 60114240D1
Authority
DE
Germany
Prior art keywords
prepregosed
prepregs
therefor
flame
fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60114240T
Other languages
English (en)
Other versions
DE60114240T2 (de
Inventor
Masato Taguchi
Yasushi Suzumura
Tadayoshi Saitou
Akihiro Itou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Rayon Co Ltd
Original Assignee
Mitsubishi Rayon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Rayon Co Ltd filed Critical Mitsubishi Rayon Co Ltd
Publication of DE60114240D1 publication Critical patent/DE60114240D1/de
Application granted granted Critical
Publication of DE60114240T2 publication Critical patent/DE60114240T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/2933—Coated or with bond, impregnation or core
    • Y10T428/2971—Impregnation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
DE2001614240 2000-12-18 2001-12-18 Flammhemmende epoxidharzzusammensetzung und damit hergestellte prepregs und faserverstärkte verbundwerkstoffe Expired - Lifetime DE60114240T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000383891 2000-12-18
JP2000383891 2000-12-18
PCT/JP2001/011109 WO2002050153A1 (fr) 2000-12-18 2001-12-18 Composition de resine epoxy ignifuge, et preimpregnes et materiaux composites renforces par des fibres, fabriques a l'aide de cette composition

Publications (2)

Publication Number Publication Date
DE60114240D1 true DE60114240D1 (de) 2006-03-02
DE60114240T2 DE60114240T2 (de) 2006-07-13

Family

ID=18851462

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2001614240 Expired - Lifetime DE60114240T2 (de) 2000-12-18 2001-12-18 Flammhemmende epoxidharzzusammensetzung und damit hergestellte prepregs und faserverstärkte verbundwerkstoffe

Country Status (6)

Country Link
US (1) US7070861B2 (de)
EP (1) EP1359174B1 (de)
JP (1) JP4154234B2 (de)
DE (1) DE60114240T2 (de)
ES (1) ES2247006T3 (de)
WO (1) WO2002050153A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1731553B1 (de) * 2004-02-27 2019-02-20 Toray Industries, Inc. Epoxidharzzusammensetzung für kohlefaserverstärkten verbundwerkstoff, prepreg, integrierter formkörper, flächengebilde aus faserverstärktem verbundwerkstoff und schrank für elektrische/elektronische geräte
US20080152921A1 (en) * 2006-12-20 2008-06-26 3M Innovative Properties Company Thermally B-Stageable Composition for Rapid Electronic Device Assembly
GB2472423B (en) * 2009-08-05 2012-01-11 Gurit Uk Ltd Fire-retardant composite materials
EP2676983B1 (de) * 2011-02-16 2016-07-20 Mitsubishi Rayon Co., Ltd. Epoxidharzzusammensetzung, prepreg und faserverstärktes verbundmaterial
JP5817206B2 (ja) * 2011-05-09 2015-11-18 横浜ゴム株式会社 繊維強化複合材料用エポキシ樹脂組成物
KR101431903B1 (ko) * 2012-09-04 2014-08-27 주식회사 엘지화학 스티렌계 수지용 난연제 및 난연 조성물
CN102875977B (zh) * 2012-09-20 2014-06-11 常熟市永祥机电有限公司 阻燃的酚醛环氧复合材料的制备方法
WO2014206487A1 (en) 2013-06-28 2014-12-31 Fundacion Imdea Materiales A halogen free flame retardant epoxy resin composition
ES2566567B1 (es) * 2013-06-28 2017-02-16 Fundacion Imdea Materiales Composición de resina epoxi retardante de llama libre de halógenos
US9822227B2 (en) 2014-09-16 2017-11-21 Isola Usa Corp. High Tg epoxy formulation with good thermal properties
TWI591109B (zh) * 2015-06-11 2017-07-11 Mitsubishi Rayon Co Epoxy resin composition, molded article, prepreg, fiber reinforced Composites and structures
KR20180100348A (ko) * 2015-12-30 2018-09-10 사이텍 인더스트리스 인코포레이티드 용락 저항성이 있는 다기능성 표면 재료
CN113544198B (zh) * 2019-02-15 2024-06-11 陶氏环球技术有限责任公司 环氧组合物
CN111978678B (zh) * 2020-08-31 2023-09-19 江苏华海诚科新材料股份有限公司 一种环氧树脂组合物及其制备方法
JPWO2022201890A1 (de) * 2021-03-22 2022-09-29
CN113912982A (zh) * 2021-10-29 2022-01-11 固德电材系统（苏州）股份有限公司 一种高压套管用阻燃环氧树脂组合物及其制备方法和应用

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2747930B2 (ja) * 1989-10-11 1998-05-06 油化シエルエポキシ株式会社 半導体封止用エポキシ樹脂組成物
US5641997A (en) * 1993-09-14 1997-06-24 Kabushiki Kaisha Toshiba Plastic-encapsulated semiconductor device
TW294694B (de) * 1994-09-09 1997-01-01 Siemens Ag
TW294693B (de) * 1994-09-09 1997-01-01 Siemens Ag
TW297034B (de) * 1994-09-09 1997-02-01 Siemens Ag
US6361879B1 (en) * 1998-02-09 2002-03-26 Toray Industries, Inc. Semiconductor device and method for fabricating it, and semiconductor sealing resin composition
JP2000154301A (ja) * 1998-11-20 2000-06-06 Toshiba Chem Corp ガラスエポキシ銅張積層板用樹脂組成物
JP2000159980A (ja) 1998-11-27 2000-06-13 Toshiba Chem Corp エポキシ樹脂組成物、コイル注型物および半導体封止装置
JP2000169672A (ja) 1998-12-09 2000-06-20 Nippon Kayaku Co Ltd プリント配線板用熱硬化性固体状樹脂組成物
US6342309B1 (en) * 1999-08-19 2002-01-29 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition and semiconductor device
JP3412585B2 (ja) * 1999-11-25 2003-06-03 松下電工株式会社 プリント配線板及び多層プリント配線板の製造に用いられるプリプレグ用エポキシ樹脂組成物、プリプレグ、多層プリント配線板
EP1275674B1 (de) * 2000-04-21 2007-04-04 Mitsubishi Rayon Co., Ltd. Epoxyharzzusammensetzung und prepreg hergestellt aus dieser zusammensetzung

Also Published As

Publication number Publication date
EP1359174B1 (de) 2005-10-19
JP4154234B2 (ja) 2008-09-24
JPWO2002050153A1 (ja) 2004-11-11
US7070861B2 (en) 2006-07-04
DE60114240T2 (de) 2006-07-13
ES2247006T3 (es) 2006-03-01
EP1359174A4 (de) 2005-03-16
EP1359174A1 (de) 2003-11-05
US20040034127A1 (en) 2004-02-19
WO2002050153A1 (fr) 2002-06-27

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