CN102939316B - 热固性组合物 - Google Patents
热固性组合物 Download PDFInfo
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- CN102939316B CN102939316B CN201180020278.XA CN201180020278A CN102939316B CN 102939316 B CN102939316 B CN 102939316B CN 201180020278 A CN201180020278 A CN 201180020278A CN 102939316 B CN102939316 B CN 102939316B
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- resin combination
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Abstract
本发明提供树脂组合物,其可在低温且短时间内进行预浸料浸渍涂覆后的干燥工序、层叠压制成形,并且还可以维持预浸料的贮存稳定性。基于发明的树脂组合物含有:下式(I)表示的咪唑化合物(A)、和环氧化合物(B)、和氰酸酯化合物(C1)或BT树脂(C2)。(式中R1及R2分别独立地表示碳原子数3~18的烷基、碳原子数3~18的链烯基、碳原子数3~18的烷氧基或碳原子数6~14的取代或非取代的芳香族取代基,R3表示氢、碳原子数1~18的烷基、碳原子数2~18的链烯基、碳原子数1~18的烷氧基、碳原子数6~14的取代或非取代的芳香族取代基或卤素基团。)
Description
技术领域
本发明涉及树脂组合物,更详细而言涉及可在形成电路的印刷电路板材料等中使用的树脂组合物,对基材浸渍或涂布该树脂组合物的预浸料及使该预浸料固化得到的层叠板。
背景技术
含有氰酸酯化合物的氰酸酯树脂、含有氰酸酯化合物与双马来酰亚胺化合物反应而得到的双马来酰亚胺三嗪树脂(BT树脂)作为高耐热性、介电特性等优异的热固性树脂早已众所周知。近年来,这些树脂被广泛用于半导体塑料封装用等高功能的印刷电路板用材料等中(例如专利文献1,2)。
在上述氰酸酯树脂、BT树脂中,为了提升固化速度使生产率提高,将各种催化剂添加到树脂中。作为这种催化剂,提出了咪唑化合物(专利文献3,4及5)。通过将咪唑化合物添加到树脂中而表现出催化活性,在制造预浸料时,在浸渍涂覆后的干燥工序中,可以使树脂在低温且短时间内固化,另外,预浸料的层叠压制成形也可以在低温且短时间内进行。
然而,将咪唑化合物添加到树脂中时,虽然会提高预浸料、层叠板的生产率,但是存在预浸料的贮存稳定性降低等问题。
现有技术文献
专利文献
专利文献1:日本特开2007-204697号公报
专利文献2:日本特开2008-88400号公报
专利文献3:日本特开2005-281513号公报
专利文献4:日本特许3821797号公报
专利文献5:日本特许3821728号公报
发明内容
本发明人等最近认识到,通过将环氧树脂与特定的咪唑化合物添加到氰酸酯树脂、BT树脂中,可以制成如下树脂组合物:其可以在低温且短时间内进行预浸料浸渍涂覆后的干燥工序、层叠压制成形,并且还可以维持预浸料的贮存稳定性。本发明是基于上述见解而成的。
因此,本发明的目的在于提供一种树脂组合物,其可以在低温且短时间内进行预浸料浸渍涂覆后的干燥工序、层叠压制成形,并且还可以维持预浸料的贮存稳定性。
于是,基于本发明的树脂组合物是含有如下物质而形成的:
下式(I)表示的咪唑化合物(A)、和
环氧化合物(B)、和
氰酸酯化合物(C1)或BT树脂(C2)。
(式(I)中,R1及R2分别独立地表示碳原子数3~18的烷基、碳原子数3~18的链烯基、碳原子数3~18的烷氧基或碳原子数6~14的取代或非取代的芳香族取代基,
R3表示氢、碳原子数1~18的烷基、碳原子数2~18的链烯基、碳原子数1~18的烷氧基、碳原子数6~14的取代或非取代的芳香族取代基或卤素基团。)
根据本发明,可以制成如下的树脂组合物:其可以在低温且短时间内进行预浸料浸渍涂覆后的干燥工序、层叠压制成形,并且还可以维持预浸料的贮存稳定性。因此,可以使含有具有优异的耐热性及吸湿耐热性的氰酸酯化合物的树脂、BT树脂兼具生产率与贮存稳定性。
具体实施方式
基于本发明的树脂组合物含有特定的咪唑化合物(A)、和环氧化合物(B)、和氰酸酯化合物(C1)或BT树脂(C2)作为必需成分。以下对构成基于本发明的树脂组合物的各成分进行说明。
<咪唑化合物(A)>
基于本发明的树脂组合物含有下式(I)表示的咪唑化合物(A)。
上述式(I)中,R1及R2分别独立地表示碳原子数3~18的烷基、碳原子数3~18的链烯基、碳原子数3~18的烷氧基或碳原子数6~14的取代或非取代的芳香族取代基。在芳香族取代基的至少一个氢原子被其他的取代基取代的情况下,作为这种取代基,可列举出碳原子数1~18的烷基、碳原子数2~18的链烯基、碳原子数1~18的烷氧基及卤素基团。
从促进聚合反应的固化及预浸料的贮存稳定性的观点出发,R1及R2分别独立地优选为异丙基、叔丁基、异丙基烷氧基、叔丁基烷氧基、苯基或萘基,特别优选R1及R2均为苯基。
另外,上述式(I)中,R3表示氢、碳原子数1~18的烷基、碳原子数2~18的链烯基、碳原子数1~18的烷氧基、碳原子数6~14的取代或非取代的芳香族取代基或卤素基团。在芳香族取代基的至少一个氢原子被其他的取代基取代的情况下,作为这种取代基,可列举出碳原子数1~18的烷基、碳原子数2~18的链烯基、碳原子数1~18的烷氧基及卤素基团。
本发明中,通过在含有氰酸酯化合物(C1)或BT树脂(C2)的树脂组合物中添加上述这种特定的咪唑化合物(A)作为固化催化剂,可以使含有具有优异的耐热性及吸湿耐热性的氰酸酯化合物的树脂、BT树脂兼具生产率与贮存稳定性。其理由虽然尚不明确,但可认为如以下所述。即,认为,在作为咪唑化合物中的反应活性位点的仲胺附近具有体积大的取代基的特定的咪唑化合物(A)在高温时分子动能高,会表现出基于仲胺的催化活性,在低温时,其分子动能低,会抑制基于仲胺的催化活性,因此可以兼顾生产率(固化速度)与贮存稳定性。
从固化促进效果、贮存稳定性及成形性的观点出发,相对于树脂的总量,优选含有0.1~10质量%的上述咪唑化合物(A),更优选为0.2~5质量%。需要说明的是,除非另有说明,树脂的总量是指咪唑化合物(A)、环氧化合物(B)、和氰酸酯化合物(C1)或BT树脂(C2)的总质量。
基于本发明的树脂组合物在上述咪唑化合物(A)的基础上还可以含有其他公知的固化促进剂。作为这种固化促进剂,例如可列举出:以过氧化苯甲酰、过氧化月桂酰、过氧化乙酰、过氧化对氯苯甲酰、过氧邻苯二甲酸二(三级丁酯)(di-tert-butyldiperoxyphthalate)等为例示的有机过氧化物,偶氮双腈(Azobisnitrile)等偶氮化合物,N,N-二甲基苄胺、N,N-二甲基苯胺、N,N-二甲基甲苯胺、N-乙基-N-羟乙基苯胺、三正丁胺、吡啶、喹啉、N-甲基吗啉、三乙醇胺、三乙烯二胺、四甲基丁二胺、N-甲基哌啶等叔胺类,苯酚、二甲苯酚、甲酚、间苯二酚、邻苯二酚等酚类,环烷酸铅、硬脂酸铅、环烷酸锌、辛酸锌、油酸锡、马来酸二丁基锡、环烷酸锰、环烷酸钴、乙酰丙酮铁等有机金属盐,将这些有机金属盐溶解于苯酚、双酚等含羟基化合物中而得到的物质,氯化锡、氯化锌、氯化铝等无机金属盐、氧化二辛基锡,其他的烷基锡、烷基氧化锡等有机锡化合物等。
<环氧化合物(B)>
在本发明中使用的环氧化合物(B)只要为在一分子中具有两个以上的环氧基的化合物就没有特别限制,可以使用公知的环氧化合物。在本发明中,作为优选的环氧化合物(B),可列举出具有如下结构的环氧化合物:在一分子化合物中具有两个以上的羟基的化合物的羟基的氢原子被缩水甘油基取代的结构。另外,环氧化合物(B)优选为具有芳香族基团的环氧化合物,可以适宜地使用缩水甘油基与芳香族基直接连接的结构的环氧化合物。作为这种环氧化合物,例如可列举出双酚A、双酚F、双酚M、双酚P、双酚E、苯酚酚醛清漆树脂、甲酚酚醛清漆树脂、二环戊二烯酚醛清漆树脂、四甲基双酚F、双酚A酚醛清漆树脂、溴化双酚A、溴化苯酚酚醛清漆树脂、3官能酚类、4官能酚类、萘型酚类、联苯型酚类、苯酚芳烷基树脂、联苯基芳烷基树脂、萘酚芳烷基树脂、二环戊二烯芳烷基树脂、脂环式酚类、含磷酚类等的羟基的氢原子被取代为缩水甘油基的结构的化合物、或将缩水甘油胺、缩水甘油酯、丁二烯等的双键环氧化的化合物,通过含羟基硅树脂类与环氧氯丙烷等的反应得到的化合物等。这种环氧化合物(B)可以单独使用或适当地组合使用两种以上。另外,上述环氧化合物(B)可以为单体、低聚物及树脂中的任意形态。
从吸湿耐热性及耐热性的观点出发,相对于树脂的总量,优选含有25~95质量%的环氧化合物(B),更优选为30~90质量%。
<氰酸酯化合物(C1)>
在本发明中使用的氰酸酯化合物(C1)只要为一分子中具有两个以上氰酸酯基的化合物就没有特别限制,可以使用公知的氰酸酯化合物。在本发明中,作为优选的氰酸酯化合物(C1),可列举出具有如下结构的氰酸酯化合物:一分子中具有两个以上的羟基的化合物的羟基被氰酸酯基取代的结构。另外,氰酸酯化合物(C1)优选为具有芳香族基团的氰酸酯化合物,可以适宜地使用氰酸酯基与芳香族基团直接连接的结构的氰酸酯化合物。作为这种氰酸酯化合物,例如可列举出双酚A、双酚F、双酚M、双酚P、双酚E、苯酚酚醛清漆树脂、甲酚酚醛清漆树脂、二环戊二烯酚醛清漆树脂、四甲基双酚F、双酚A酚醛清漆树脂、溴化双酚A、溴化苯酚酚醛清漆树脂、3官能酚类、4官能酚类、萘型酚类、联苯型酚类、苯酚芳烷基树脂、联苯基芳烷基树脂、萘酚芳烷基树脂、二环戊二烯芳烷基树脂、脂环式酚类、含磷酚类等的羟基被取代为氰酸酯基的结构的化合物。这种氰酸酯化合物(C1)可以单独使用或适当地组合使用两种以上。另外,上述氰酸酯化合物(C1)可以为单体、低聚物及树脂中的任意形态。
上述氰酸酯化合物(C1)可以通过现有公知的方法制造,例如可以通过一分子中具有两个以上的羟基的化合物与卤化铵等的反应得到。
从吸湿耐热性及耐热性的观点出发,相对于树脂的总量,优选含有5~75质量%的氰酸酯化合物(C1),更优选为10~70质量%。
<BT树脂(C2)>
在本发明中使用的BT树脂(C2)是指:将上述氰酸酯化合物(C1)与马来酰亚胺化合物在无溶剂的条件下加热熔融混合或使其溶解于适合的有机溶剂中加热混合而聚合物化的物质。作为用于将氰酸酯化合物(C1)与马来酰亚胺化合物混合而使用的有机溶剂,可列举出甲乙酮、N-甲基吡咯烷酮、二甲基甲酰胺、二甲基乙酰胺、甲苯、二甲苯等。
作为在制造BT树脂(C2)时使用的马来酰亚胺化合物,只要为在一分子中具有一个以上的马来酰亚胺基的化合物就可以没有特别限制地使用。例如可列举出N-苯基马来酰亚胺、N-羟基苯基马来酰亚胺、双(4-马来酰亚胺基苯基)甲烷、2,2-双[4-(4-马来酰亚胺基苯氧基)-苯基]丙烷、双(3,5-二甲基-4-马来酰亚胺基苯基)甲烷、双(3-乙基-5-甲基-4-马来酰亚胺基苯基)甲烷、双(3,5-二乙基-4-马来酰亚胺基苯基)甲烷等。这些马来酰亚胺化合物可以单独使用或适当组合使用两种以上。
从吸湿耐热性及耐热性的观点出发,相对于树脂的总量,优选含有5~75质量%的BT树脂(C2),更优选为10~70质量%。
<其他的成分>
基于本发明的树脂组合物还可以含有马来酰亚胺化合物(D)。作为马来酰亚胺化合物(D),可以适宜地使用上述化合物。从吸湿耐热性的观点出发,相对于树脂的总量,马来酰亚胺化合物(D)的含量优选为50质量%以下,更优选为40质量%以下。需要说明的是,这里树脂的总量是指咪唑化合物(A)、环氧化合物(B)、氰酸酯化合物(C1)或BT树脂(C2)、和马来酰亚胺化合物(D)的总质量。
另外,树脂组合物中还可含有无机填料。通过添加无机填料可以赋予树脂低热膨胀化、阻燃性及激光加工性,并且可以控制预浸料、层叠体的成形时的树脂的流动性。作为在本发明中使用的无机系填料没有特别限制,可使用公知的无机系填料,例如可列举出天然二氧化硅、熔融二氧化硅、无定形二氧化硅、气相二氧化硅(fumedsilica)、中空二氧化硅等的二氧化硅类、氢氧化铝、氢氧化铝加热处理品(加热处理氢氧化铝、减少一部分结晶水而得到的物质)、勃姆石、氢氧化镁等的金属氢氧化物、氧化钼、钼酸锌等钼化合物、氧化钛、钛酸钡、硫酸钡、硼酸锌、锡酸锌、氧化铝、粘土、高岭土、滑石、煅烧粘土、煅烧高岭土、煅烧滑石、云母、玻璃短纤维(E玻璃、D玻璃等的玻璃微粉末类)、中空玻璃等。在它们当中,从阻燃性的观点出发,可以适宜地使用氢氧化铝、氢氧化铝加热处理品(加热处理氢氧化铝、减少一部分结晶水而得到的物质)、勃姆石、氢氧化镁等的金属水合物、氧化钼、钼酸锌等的钼化合物。这些无机填料可以单独使用或适当组合使用两种以上。
从线膨胀率、阻燃性及成形性的观点出发,相对于树脂总量,优选含有10~600质量%的无机填料,更优选为30~500质量%。
基于本发明的树脂组合物除上述成分以外还可以根据需要含有其他的成分。在不损害所期待的特性的范围内,也可以添加其他的热固性树脂、热塑性树脂及其低聚物、弹性体类等各种高分子化合物、其他阻燃性化合物、添加剂等。这些成分只要是通常被使用的成分就可以没有特别限制地使用。例如可列举出磷酸酯、磷酸三聚氰胺等的磷化合物,三聚氰胺、苯并胍胺等的含氮化合物,含噁嗪环化合物、硅系化合物、聚酰亚胺、聚乙烯醇缩醛、苯氧基树脂、丙烯酸树脂、具有羟基或羧基的丙烯酸树脂、醇酸树脂、热塑性聚氨酯树脂、聚丁二烯、丁二烯-丙烯腈共聚物、聚氯丁二烯、丁二烯-苯乙烯共聚物、聚异戊二烯、丁基橡胶、氟橡胶、天然橡胶等的弹性体类,苯乙烯-异戊二烯橡胶、丙烯酸橡胶、它们的核壳橡胶、环氧化丁二烯、马来酸化丁二烯(maleatedbutadiene)、聚乙烯、聚丙烯、聚乙烯-丙烯共聚物、聚-4-甲基-1-戊烯、聚氯乙烯、聚偏二氯乙烯、聚苯乙烯、聚乙烯基甲苯、聚乙烯基苯酚、AS树脂、ABS树脂、MBS树脂、聚-4-氟化乙烯、氟化乙烯-丙烯共聚物、4-氟化乙烯-6-氟化乙烯共聚物、偏二氟乙烯等乙烯化合物聚合物类,聚碳酸酯、聚酯碳酸酯、聚苯醚、聚砜、聚酯、聚醚砜、聚酰胺、聚酰胺酰亚胺、聚酯酰亚胺、聚苯硫醚等的热塑性树脂类及它们的低分子量聚合物类、(甲基)丙烯酸酯、环氧(甲基)丙烯酸酯、二(甲基)丙烯酰氧基-双酚等聚甲基丙烯酸酯类,苯乙烯、乙烯基吡咯烷酮、邻苯二甲酸二丙烯酸酯(di-acrylphthalate)、二乙烯基苯、二烯丙基苯、双酚二烯丙基醚、三烯基异氰脲酸酯等聚烯丙基化合物及其预聚物类,二环戊二烯及其预聚物类,酚醛树脂、不饱和聚酯等含聚合双键单体类及其预聚物类,多异氰酸酯类等的热固性单体或其预聚物类等。作为添加剂,可列举出紫外线吸收剂、抗氧化剂、光聚合引发剂、荧光增白剂、光敏剂、染料、颜料、增稠剂、润滑剂、消泡剂、分散剂、流平剂、光亮剂、阻聚剂等,这些添加剂可以根据需要单独使用或适当组合两种以上使用。
<树脂组合物的用途>
基于本发明的树脂组合物通过加热而固化。固化条件随树脂组合物的组成、作为固化促进剂的咪唑化合物(A)的配混量等而变化。使树脂组合物完全地固化时,通常在100~300℃的范围内进行规定时间的加热。也可以在加压环境下加热,例如在0.1~5MPa、优选为0.5~3MPa的加压下使树脂组合物固化。
如上所述得到的固化物从其优异的物性、操作性出发可以在各种用途中利用。作为基于本发明的树脂组合物的适宜的用途,可列举出预浸料、覆铜层叠板等印刷电路板用材料、结构材料、浇铸成型用树脂等。
<预浸料及层叠板>
预浸料是对基材浸渍或涂布上述的树脂组合物而成的。可以使用在各种印刷电路板材料等中使用且公知的无机或有机的纤维质增强材料作为基材。作为无机纤维质增强材料,例如可列举出E、NE、D、S、T玻璃等的玻璃纤维、石英玻璃纤维、碳纤维、氧化铝纤维、碳化硅纤维、石棉、岩棉、渣棉(slagwool)、石膏晶须等的无机纤维、其织布或无纺布、或它们的混合物。另外,作为有机纤维质增强材料,例如可列举出全芳香族聚酰胺纤维、聚酰亚胺纤维、液晶聚酯、聚酯纤维、氟纤维、聚苯并噁唑纤维、棉、麻、半碳纤维(Semi-carbonfiber)等有机纤维、其织布或无纺布、或它们的混合物。
上述无机或有机的纤维质增强材料可以根据需要单独使用或适当组合使用两种以上。例如可以是玻璃纤维与全芳香族聚酰胺纤维、玻璃纤维与碳纤维、玻璃纤维与聚酰胺纤维、玻璃纤维与液晶性芳香族聚酯等混纺布、玻璃纸、云母纸、氧化铝纸等的无机质纸、牛皮纸、棉纤维纸、纸-玻璃混造纸等的组合,它们两种以上的组合。
为了使上述基材与树脂的密合性提高,可以实施表面处理。作为表面处理,可以使用在预浸料或层叠板中应用的现有公知的方法。另外,作为在薄物用途中使用的基材,可以适宜地使用聚酰亚胺薄膜、全芳香族聚酰胺薄膜、聚苯并噁唑薄膜、液晶聚酯薄膜等。
预浸料可以通过对基材浸渍或涂布上述树脂组合物而制造。例如,对基材浸渍或涂布由上述树脂组合物和有机溶剂形成的树脂清漆后,在100~200℃的干燥器中加热1~60分钟,使树脂半固化,从而制造。相对于基材的树脂组合物(含有无机填料)的含量优选在相对于预浸料总量为20~90质量%的范围。
通过将上述预浸料层叠、使其成形(固化),可以形成层叠板。层叠板是通过将一片或两片以上的上述预浸料重叠,根据期望在其单面或双面上配置并层叠铜、铝等金属箔,进行成形(固化)而制造的。作为使用的金属箔,只要是能够在印刷电路板材料中使用的材料就可以没有特别限制地使用。另外,在层叠成形中可以采用通常的印刷电路板用层叠板及多层板的方法。例如作为层叠成形的条件,使用多段压制、多段真空压制、连续成形、高压釜成形机、真空层压机等,温度为100~300℃、压力为2~100kgf/cm2、加热时间为0.05~5小时的范围是常见的。另外,在本发明中,也可以通过将上述预浸料与另行准备的内层用电路板组合层叠成形来制成多层板。
实施例
以下示出实施例及比较例来详细地说明本发明、但本发明不受这些实施例及比较例的限定。
实施例1
混合25质量份2,2-双(4-氰氧苯基)丙烷(CA200、MitsubishiGasChemicalCompany,Inc.制造)和25质量份双(3-乙基-5-甲基-4-马来酰亚胺基苯基)甲烷(BMI-70、K.IChemicalIndustryCo.,Ltd.制造),在150℃下熔融,边搅拌边反应6小时之后,使其溶解在甲乙酮中,从而得到BT树脂。
混合得到的50质量份BT树脂(以固体成分换算的份数)、25质量份苯酚酚醛清漆型环氧树脂(N770、DICCorporation制造)、25质量份联苯基芳烷基型环氧树脂(NC-3000-FH、NipponKayakuCo.,Ltd.制造)、0.02质量份辛酸锌及1质量份2,4,5-三苯基咪唑(TokyoChemicalIndustryCo.,Ltd.制造)、制备清漆。将得到的清漆浸渍在厚度0.1mm的E玻璃布(E10T、UnitikaGlassFiberCo.,Ltd.制造)上,在165℃下干燥至凝胶化时间为90秒,从而制作树脂量为50质量%的预浸料。将得到的预浸料两片重叠,在其上下配置厚度12μm的电解铜箔(JTC-LP箔、NipponMining&MetalsCo.,Ltd.制造),在压力3MPa下,以下述3种加热条件进行层叠成形,得到绝缘层厚度为0.2mm的各覆铜层叠板。
加热条件1:制品温度在220℃条件下保持20分钟
加热条件2:制品温度在220℃条件下保持60分钟
加热条件3:制品温度在200℃条件下保持60分钟
实施例2
使60质量份2,2-双(4-氰氧苯基)丙烷(CA200、MitsubishiGasChemicalCompany,Inc.制造)在150℃下熔融,边搅拌边反应6小时之后,使其溶解在甲乙酮中,从而得到预聚物。
混合得到的60质量份预聚物(以固体成分换算的份数)、40质量份甲酚酚醛清漆型环氧树脂(N680、DICCorporation制造)、0.02质量份辛酸锌及1质量份2,4,5-三苯基咪唑(TokyoChemicalIndustryCo.,Ltd.制造),制备清漆。使得到的清漆浸渍在厚度0.1mm的E玻璃布(E10T、UnitikaGlassFiberCo.,Ltd.制造)上,在170℃下进行8分钟干燥,从而制作树脂量为50质量%的预浸料。将得到的预浸料两片重叠,在其上下配置厚度12μm的电解铜箔(JTC-LP箔、NipponMining&MetalsCo.,Ltd.制造),与在实施例1相同的条件下进行层叠成形,从而得到绝缘层厚度为0.2mm的覆铜层叠板。
比较例1
除了使用2-苯基-4-甲基咪唑(TokyoChemicalIndustryCo.,Ltd.制造)代替实施例1中的2,4,5-三苯基咪唑以外与实施例1同样地操作,得到绝缘层厚度为0.2mm的覆铜层叠板。
比较例2
除了不使用实施例1中的2,4,5-三苯基咪唑以外与实施例1同样地操作,得到绝缘层厚度为0.2mm的覆铜层叠板。
比较例3
除了使用2-苯基-4-甲基咪唑(TokyoChemicalIndustryCo.,Ltd.制造)代替实施例2中的2,4,5-三苯基咪唑以外与实施例2同样地操作,得到绝缘层厚度为0.2mm的覆铜层叠板。
比较例4
除了不使用实施例2中的2,4,5-三苯基咪唑以外与实施例2同样地操作,得到绝缘层厚度为0.2mm的覆铜层叠板。
评价试验
对于如上操作得到的各预浸料及层叠板,按照如下方式进行预浸料凝胶化时间测定、玻璃化转变温度测定及进行吸湿耐热性评价。
(1)预浸料凝胶化时间
将预浸料在40℃的恒温环境下放置0、5、10、15及30天,测定各凝胶化时间。凝胶化时间的测定是基于JISC6521(多层印刷电路板用预浸料试验法)的固化时间测定而进行的(参照JISC6521的5.7)。
(2)玻璃化转变温度
制作尺寸10mm×60mm的样品,使用DMA设备(TAInstrumen2980型),在升温10℃/min的条件下进行玻璃化转变温度的测定。测定是基于JISC6481(印刷电路板用覆铜层叠板试验方法)的DMA法B法而进行的(参照JISC6481的5.17.2)。
[表1]
由表1中可知,在使用属于除上述式(I)表示的咪唑化合物以外的咪唑化合物的2-苯基-4-甲基咪唑的树脂组合物的层叠板(比较例1及3)中,预浸料的固化时间短,但预浸料凝胶化时间的经时变化大。另外,在使用不含有作为效果促进剂的咪唑化合物的树脂组合物的层叠板(比较例2及4)中,预浸料凝胶化时间的经时变化小,但预浸料的固化时间长。与此相对,在使用属于上述式(I)表示的咪唑化合物的2,4,5-三苯基咪唑的树脂组合物的层叠板(实施例1及2)中,预浸料的固化时间短、并且预浸料凝胶化时间的经时变化小。
Claims (10)
1.一种树脂组合物,其是含有如下物质而形成的:
下式(I)表示的咪唑化合物(A)、和
环氧化合物(B)、和
氰酸酯化合物(C1)或BT树脂(C2),
所述树脂组合物是含有相对于树脂的总量为10~70质量%的所述氰酸酯化合物(C1)或BT树脂(C2)而形成的;
式(I)中,R1及R2分别独立地表示碳原子数3~18的烷基、碳原子数3~18的链烯基、碳原子数3~18的烷氧基或碳原子数6~14的取代或非取代的芳香族取代基,
R3表示氢、碳原子数1~18的烷基、碳原子数2~18的链烯基、碳原子数1~18的烷氧基、碳原子数6~14的取代或非取代的芳香族取代基或卤素基团。
2.根据权利要求1所述的树脂组合物,其中,所述式(I)的R1及R2分别独立地表示异丙基、叔丁基、异丙基烷氧基、叔丁基烷氧基、苯基或萘基。
3.根据权利要求2所述的树脂组合物,其中,所述式(I)的R1及R2均为苯基。
4.根据权利要求1~3中的任一项所述的树脂组合物,其是含有相对于树脂的总量为0.1~10质量%的所述咪唑化合物(A)而形成的。
5.根据权利要求1~3中的任一项所述的树脂组合物,其是含有相对于树脂的总量为25~95质量%的所述环氧化合物(B)而形成的。
6.一种预浸料,其是对基材浸渍或涂布权利要求1~5中的任一项所述的树脂组合物而形成的。
7.一种层叠板,其是将权利要求6所述的预浸料层叠成形而成的。
8.一种覆有金属箔的层叠板,其是将权利要求6所述的预浸料与金属箔层叠成形而成的。
9.一种结构材料,其是使用权利要求1~5中的任一项所述的树脂组合物而形成的。
10.一种浇铸成型用树脂,其是含有权利要求1~5中的任一项所述的树脂组合物而形成的。
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