BR0012273A - Material de subenchimento para embalagem de semicondutor - Google Patents
Material de subenchimento para embalagem de semicondutorInfo
- Publication number
- BR0012273A BR0012273A BR0012273-4A BR0012273A BR0012273A BR 0012273 A BR0012273 A BR 0012273A BR 0012273 A BR0012273 A BR 0012273A BR 0012273 A BR0012273 A BR 0012273A
- Authority
- BR
- Brazil
- Prior art keywords
- fine powder
- curing agent
- composition
- underfill material
- semiconductor packaging
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/98—Methods for disconnecting semiconductor or solid-state bodies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Abstract
Patente de Invenção: "MATERIAL DE SUBENCHIMENTO PARA EMBALAGEM DE SEMICONDUTOR". A presente invenção refere-se a um material de subenchimento para uma embalagem de semicondutor retendo elementos semicondutores sobre um substrato carreador montado sobre um painel de circuito, contendo uma composição de uretano termoendurecível tipo uma embalagem que preferivelmente compreendo um pré-polímero uretano tendo um grupo isocianato terminal, que é obtido através de reação de um poliol com uma quantidade excessiva de um poliisocianato, e um agente de cura revestido com pulverizado fino compreendendo um agente de cura que está em um estado sólido em temperatura ambiente e sítios tensoativos do qual estão cobertos com um pulverizado fino. Esta composição pode obter ambas as propriedades de cura em baixa temperatura e a estabilidade de armazenagem.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19450199 | 1999-07-08 | ||
PCT/JP2000/004490 WO2001005203A1 (en) | 1999-07-08 | 2000-07-06 | Underfilling material for semiconductor package |
Publications (1)
Publication Number | Publication Date |
---|---|
BR0012273A true BR0012273A (pt) | 2002-04-02 |
Family
ID=16325577
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0012273-4A BR0012273A (pt) | 1999-07-08 | 2000-07-06 | Material de subenchimento para embalagem de semicondutor |
Country Status (13)
Country | Link |
---|---|
US (2) | US6660943B1 (pt) |
EP (1) | EP1195083B1 (pt) |
JP (1) | JP4611588B2 (pt) |
KR (1) | KR100672130B1 (pt) |
CN (1) | CN1198493C (pt) |
AT (1) | ATE315886T1 (pt) |
BR (1) | BR0012273A (pt) |
DE (1) | DE60025489T2 (pt) |
MY (2) | MY126046A (pt) |
NO (1) | NO20020060L (pt) |
PL (1) | PL353034A1 (pt) |
TW (1) | TWI282806B (pt) |
WO (1) | WO2001005203A1 (pt) |
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US20050014313A1 (en) * | 2003-03-26 | 2005-01-20 | Workman Derek B. | Underfill method |
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US7213739B2 (en) * | 2004-04-02 | 2007-05-08 | Fry's Metals, Inc. | Underfill fluxing curative |
KR100662176B1 (ko) * | 2004-12-30 | 2006-12-27 | 제일모직주식회사 | 이방성 도전 필름용 조성물 |
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KR100893024B1 (ko) * | 2007-08-24 | 2009-04-15 | 트리포드 테크놀로지 코포레이션 | 전자소자의 장착에 사용되는 무공동장착방법 |
US8535793B2 (en) * | 2007-12-18 | 2013-09-17 | Dow Global Technologies Llc | Thermosetting compositions comprising silicone polyethers, their manufacture, and uses |
US20120156474A1 (en) * | 2010-12-20 | 2012-06-21 | E. I. Du Pont De Nemours And Company | Article having curable coating comprising imidazolium monocarboxylate salt |
KR20140044867A (ko) * | 2011-07-22 | 2014-04-15 | 에이치. 비. 풀러, 컴퍼니 | 전자장치 상에 사용하기 위한 2파트 이중 경화 접착제 |
JP2013224362A (ja) * | 2012-04-20 | 2013-10-31 | Nitto Denko Corp | 接合シート、電子部品およびそれらの製造方法 |
KR101392441B1 (ko) * | 2012-09-21 | 2014-05-07 | 도레이첨단소재 주식회사 | 몰드 언더필 공정의 마스킹 테이프용 점착제 조성물 및 그를 이용한 마스킹 테이프 |
JP5827203B2 (ja) * | 2012-09-27 | 2015-12-02 | 三ツ星ベルト株式会社 | 導電性組成物 |
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US20170216947A1 (en) * | 2014-07-28 | 2017-08-03 | Xin Yang | Systems and methods for reinforced adhesive bonding |
CN105038137B (zh) * | 2015-08-31 | 2017-03-15 | 四川大学 | 一种兼具结构强度和阻尼性能的复合材料及其制备方法与用途 |
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KR102162495B1 (ko) | 2018-03-28 | 2020-10-07 | 주식회사 엘지화학 | 수지 조성물 |
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KR102157633B1 (ko) | 2018-12-27 | 2020-09-18 | 주식회사 케이씨씨 | 반도체 소자 언더필용 에폭시 수지 조성물 |
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-
2000
- 2000-07-06 EP EP00944284A patent/EP1195083B1/en not_active Expired - Lifetime
- 2000-07-06 KR KR1020017016723A patent/KR100672130B1/ko not_active IP Right Cessation
- 2000-07-06 JP JP2001510284A patent/JP4611588B2/ja not_active Expired - Lifetime
- 2000-07-06 WO PCT/JP2000/004490 patent/WO2001005203A1/en active IP Right Grant
- 2000-07-06 AT AT00944284T patent/ATE315886T1/de not_active IP Right Cessation
- 2000-07-06 PL PL00353034A patent/PL353034A1/xx unknown
- 2000-07-06 DE DE60025489T patent/DE60025489T2/de not_active Expired - Lifetime
- 2000-07-06 CN CNB008099839A patent/CN1198493C/zh not_active Expired - Lifetime
- 2000-07-06 MY MYPI20003088A patent/MY126046A/en unknown
- 2000-07-06 US US10/019,299 patent/US6660943B1/en not_active Expired - Lifetime
- 2000-07-06 MY MYPI20051149A patent/MY140714A/en unknown
- 2000-07-06 BR BR0012273-4A patent/BR0012273A/pt not_active Application Discontinuation
- 2000-07-07 TW TW089113592A patent/TWI282806B/zh not_active IP Right Cessation
-
2002
- 2002-01-07 NO NO20020060A patent/NO20020060L/no not_active Application Discontinuation
-
2003
- 2003-11-26 US US10/721,263 patent/US6881591B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20020036965A (ko) | 2002-05-17 |
ATE315886T1 (de) | 2006-02-15 |
US20040112631A1 (en) | 2004-06-17 |
EP1195083A1 (en) | 2002-04-10 |
JP2003504893A (ja) | 2003-02-04 |
CN1360815A (zh) | 2002-07-24 |
KR100672130B1 (ko) | 2007-01-19 |
WO2001005203A1 (en) | 2001-01-18 |
NO20020060L (no) | 2002-02-22 |
EP1195083B1 (en) | 2006-01-11 |
US6660943B1 (en) | 2003-12-09 |
TWI282806B (en) | 2007-06-21 |
DE60025489D1 (de) | 2006-04-06 |
MY140714A (en) | 2010-01-15 |
NO20020060D0 (no) | 2002-01-07 |
DE60025489T2 (de) | 2006-08-03 |
MY126046A (en) | 2006-09-29 |
CN1198493C (zh) | 2005-04-20 |
US6881591B2 (en) | 2005-04-19 |
PL353034A1 (en) | 2003-10-06 |
JP4611588B2 (ja) | 2011-01-12 |
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