NL8501720A - Werkwijze voor het vervaardigen van een halfgeleiderinrichting waarbij een siliciumplak plaatselijk wordt voorzien van veldoxide met kanaalonderbreker. - Google Patents

Werkwijze voor het vervaardigen van een halfgeleiderinrichting waarbij een siliciumplak plaatselijk wordt voorzien van veldoxide met kanaalonderbreker. Download PDF

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Publication number
NL8501720A
NL8501720A NL8501720A NL8501720A NL8501720A NL 8501720 A NL8501720 A NL 8501720A NL 8501720 A NL8501720 A NL 8501720A NL 8501720 A NL8501720 A NL 8501720A NL 8501720 A NL8501720 A NL 8501720A
Authority
NL
Netherlands
Prior art keywords
layer
field oxide
heat treatment
silicon
oxidation
Prior art date
Application number
NL8501720A
Other languages
English (en)
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL8501720A priority Critical patent/NL8501720A/nl
Priority to US06/869,482 priority patent/US4743566A/en
Priority to CA000511260A priority patent/CA1269593A/en
Priority to EP86201016A priority patent/EP0208356B1/en
Priority to IE1550/86A priority patent/IE57557B1/en
Priority to DE8686201016T priority patent/DE3668396D1/de
Priority to JP61135111A priority patent/JPH07118504B2/ja
Priority to KR1019860004697A priority patent/KR950001151B1/ko
Publication of NL8501720A publication Critical patent/NL8501720A/nl

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • H01L21/76213—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose
    • H01L21/76216—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose introducing electrical active impurities in the local oxidation region for the sole purpose of creating channel stoppers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Element Separation (AREA)
  • Formation Of Insulating Films (AREA)
NL8501720A 1985-06-14 1985-06-14 Werkwijze voor het vervaardigen van een halfgeleiderinrichting waarbij een siliciumplak plaatselijk wordt voorzien van veldoxide met kanaalonderbreker. NL8501720A (nl)

Priority Applications (8)

Application Number Priority Date Filing Date Title
NL8501720A NL8501720A (nl) 1985-06-14 1985-06-14 Werkwijze voor het vervaardigen van een halfgeleiderinrichting waarbij een siliciumplak plaatselijk wordt voorzien van veldoxide met kanaalonderbreker.
US06/869,482 US4743566A (en) 1985-06-14 1986-06-02 Method of manufacturing a semiconductor device, in which a silicon slice is locally provided with field oxide with a channel stopper
CA000511260A CA1269593A (en) 1985-06-14 1986-06-10 Method of manufacturing a semiconductor device, in which a silicon slice is locally provided with field oxide with a channel stopper
EP86201016A EP0208356B1 (en) 1985-06-14 1986-06-11 Method of manufacturing a semiconductor device, in which a silicon slice is locally provided with field oxide with a channel stopper
IE1550/86A IE57557B1 (en) 1985-06-14 1986-06-11 Method of manufacturing a semiconductor device,in which a silicon slice is locally provided with field oxide with a channel stopper
DE8686201016T DE3668396D1 (de) 1985-06-14 1986-06-11 Verfahren zur herstellung einer halbleiteranordnung mit einem halbleiterkoerper mit feldoxid und kanalunterbrecher.
JP61135111A JPH07118504B2 (ja) 1985-06-14 1986-06-12 半導体デバイスの製造法
KR1019860004697A KR950001151B1 (ko) 1985-06-14 1986-06-13 반도체 장치 제조방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8501720 1985-06-14
NL8501720A NL8501720A (nl) 1985-06-14 1985-06-14 Werkwijze voor het vervaardigen van een halfgeleiderinrichting waarbij een siliciumplak plaatselijk wordt voorzien van veldoxide met kanaalonderbreker.

Publications (1)

Publication Number Publication Date
NL8501720A true NL8501720A (nl) 1987-01-02

Family

ID=19846146

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8501720A NL8501720A (nl) 1985-06-14 1985-06-14 Werkwijze voor het vervaardigen van een halfgeleiderinrichting waarbij een siliciumplak plaatselijk wordt voorzien van veldoxide met kanaalonderbreker.

Country Status (8)

Country Link
US (1) US4743566A (ja)
EP (1) EP0208356B1 (ja)
JP (1) JPH07118504B2 (ja)
KR (1) KR950001151B1 (ja)
CA (1) CA1269593A (ja)
DE (1) DE3668396D1 (ja)
IE (1) IE57557B1 (ja)
NL (1) NL8501720A (ja)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8603111A (nl) * 1986-12-08 1988-07-01 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting waarbij een siliciumplak aan zijn oppervlak wordt voorzien van veldoxidegebieden.
US4983537A (en) * 1986-12-29 1991-01-08 General Electric Company Method of making a buried oxide field isolation structure
JP2545527B2 (ja) * 1987-01-23 1996-10-23 沖電気工業株式会社 半導体装置
NL8700541A (nl) * 1987-03-06 1988-10-03 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting waarbij een plak silicium plaatselijk wordt voorzien van veldoxidegebieden.
JP2573218B2 (ja) * 1987-04-17 1997-01-22 シチズン時計株式会社 不揮発性記憶素子の製造方法
US4942449A (en) * 1988-03-28 1990-07-17 General Electric Company Fabrication method and structure for field isolation in field effect transistors on integrated circuit chips
NL8800903A (nl) * 1988-04-08 1989-11-01 Koninkl Philips Electronics Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting met een siliciumsubstraat met geheel of gedeeltelijk verzonken veldoxide-gebieden.
GB2238658B (en) * 1989-11-23 1993-02-17 Stc Plc Improvements in integrated circuits
US5049520A (en) * 1990-06-06 1991-09-17 Micron Technology, Inc. Method of partially eliminating the bird's beak effect without adding any process steps
JPH04247663A (ja) * 1991-02-04 1992-09-03 Mitsubishi Electric Corp 電界効果素子およびその製造方法
US5132241A (en) * 1991-04-15 1992-07-21 Industrial Technology Research Institute Method of manufacturing minimum counterdoping in twin well process
US5134089A (en) * 1991-09-30 1992-07-28 Motorola, Inc. MOS transistor isolation method
US5348910A (en) * 1991-12-24 1994-09-20 Seiko Epson Corporation Method of manufacturing a semiconductor device and the product thereby
US5254495A (en) * 1993-05-07 1993-10-19 United Microelectronics Corporation Salicide recessed local oxidation of silicon
JP2626513B2 (ja) * 1993-10-07 1997-07-02 日本電気株式会社 半導体装置の製造方法
US5672539A (en) * 1994-01-14 1997-09-30 Micron Technology, Inc. Method for forming an improved field isolation structure using ozone enhanced oxidation and tapering
US5374585A (en) * 1994-05-09 1994-12-20 Motorola, Inc. Process for forming field isolation
GB2291261B (en) * 1994-07-06 1999-03-24 Hyundai Electronics Ind Method of forming a field oxide film in a semiconductor device
FR2734403B1 (fr) 1995-05-19 1997-08-01 Sgs Thomson Microelectronics Isolement plan dans des circuits integres
KR100197656B1 (ko) * 1995-12-29 1999-07-01 김영환 반도체 에스.오.아이.소자의 제조방법
US5861339A (en) * 1995-10-27 1999-01-19 Integrated Device Technology, Inc. Recessed isolation with double oxidation
US5672538A (en) * 1995-12-04 1997-09-30 Taiwan Semiconductor Manufacturing Company, Ltd Modified locus isolation process in which surface topology of the locos oxide is smoothed
US5714414A (en) * 1996-08-19 1998-02-03 Micron Technology, Inc. Semiconductor processing method of forming field isolation oxide relative to a semiconductor substrate
US5882993A (en) 1996-08-19 1999-03-16 Advanced Micro Devices, Inc. Integrated circuit with differing gate oxide thickness and process for making same
US6033943A (en) * 1996-08-23 2000-03-07 Advanced Micro Devices, Inc. Dual gate oxide thickness integrated circuit and process for making same
US5962914A (en) * 1998-01-14 1999-10-05 Advanced Micro Devices, Inc. Reduced bird's beak field oxidation process using nitrogen implanted into active region
US6531364B1 (en) 1998-08-05 2003-03-11 Advanced Micro Devices, Inc. Advanced fabrication technique to form ultra thin gate dielectric using a sacrificial polysilicon seed layer

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5286083A (en) * 1976-01-12 1977-07-16 Hitachi Ltd Production of complimentary isolation gate field effect transistor
JPS5529116A (en) * 1978-08-23 1980-03-01 Hitachi Ltd Manufacture of complementary misic
JPS5821842A (ja) * 1981-07-30 1983-02-08 インタ−ナシヨナル・ビジネス・マシ−ンズ・コ−ポレ−シヨン 分離領域の形成方法
US4574465A (en) * 1982-04-13 1986-03-11 Texas Instruments Incorporated Differing field oxide thicknesses in dynamic memory device
JPS5984436A (ja) * 1982-11-04 1984-05-16 Sanyo Electric Co Ltd 半導体装置の製造方法
US4407696A (en) * 1982-12-27 1983-10-04 Mostek Corporation Fabrication of isolation oxidation for MOS circuit
JPS59171138A (ja) * 1983-03-17 1984-09-27 Nec Corp 半導体装置の製造方法
JPS60106142A (ja) * 1983-11-15 1985-06-11 Nec Corp 半導体素子の製造方法
JPS60128635A (ja) * 1983-12-15 1985-07-09 Toshiba Corp 素子分離領域の形成方法
US4569117A (en) * 1984-05-09 1986-02-11 Texas Instruments Incorporated Method of making integrated circuit with reduced narrow-width effect
NL8401711A (nl) * 1984-05-29 1985-12-16 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting met een siliciumlichaam waarin plaatselijk een verzonken oxidelaag is aangebracht.
US4577394A (en) * 1984-10-01 1986-03-25 National Semiconductor Corporation Reduction of field oxide encroachment in MOS fabrication
US4551910A (en) * 1984-11-27 1985-11-12 Intel Corporation MOS Isolation processing

Also Published As

Publication number Publication date
DE3668396D1 (de) 1990-02-22
KR950001151B1 (ko) 1995-02-11
KR870000767A (ko) 1987-02-20
CA1269593A (en) 1990-05-29
IE861550L (en) 1986-12-14
JPS61289644A (ja) 1986-12-19
EP0208356B1 (en) 1990-01-17
EP0208356A1 (en) 1987-01-14
JPH07118504B2 (ja) 1995-12-18
US4743566A (en) 1988-05-10
IE57557B1 (en) 1992-12-16

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