NL8401774A - Gas voor het selectief etsen van siliciumnitride en werkwijze voor het selectief etsen van siliciumnitride met het gas. - Google Patents
Gas voor het selectief etsen van siliciumnitride en werkwijze voor het selectief etsen van siliciumnitride met het gas. Download PDFInfo
- Publication number
- NL8401774A NL8401774A NL8401774A NL8401774A NL8401774A NL 8401774 A NL8401774 A NL 8401774A NL 8401774 A NL8401774 A NL 8401774A NL 8401774 A NL8401774 A NL 8401774A NL 8401774 A NL8401774 A NL 8401774A
- Authority
- NL
- Netherlands
- Prior art keywords
- gas
- etching
- silicon nitride
- film
- silicon
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/53—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
- C04B41/5338—Etching
- C04B41/5346—Dry etching
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/91—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
- H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
- H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Structural Engineering (AREA)
- Inorganic Chemistry (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58095651A JPH0612765B2 (ja) | 1983-06-01 | 1983-06-01 | エ ッ チ ン グ 方 法 |
| JP9565183 | 1983-06-01 | ||
| JP22207283 | 1983-11-28 | ||
| JP58222072A JPS60115232A (ja) | 1983-11-28 | 1983-11-28 | ドライエッチング用ガス |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL8401774A true NL8401774A (nl) | 1985-01-02 |
Family
ID=26436874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL8401774A NL8401774A (nl) | 1983-06-01 | 1984-06-01 | Gas voor het selectief etsen van siliciumnitride en werkwijze voor het selectief etsen van siliciumnitride met het gas. |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4529476A (oth) |
| DE (1) | DE3420347A1 (oth) |
| NL (1) | NL8401774A (oth) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11437244B2 (en) | 2017-04-06 | 2022-09-06 | Kanto Denka Kogyo Co., Ltd. | Dry etching gas composition and dry etching method |
Families Citing this family (62)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4568410A (en) * | 1984-12-20 | 1986-02-04 | Motorola, Inc. | Selective plasma etching of silicon nitride in the presence of silicon oxide |
| US5180466A (en) * | 1984-12-29 | 1993-01-19 | Fujitsu Limited | Process for dry etching a silicon nitride layer |
| JPS61158143A (ja) * | 1984-12-29 | 1986-07-17 | Fujitsu Ltd | 窒化シリコン膜のエッチング方法 |
| GB2183204A (en) * | 1985-11-22 | 1987-06-03 | Advanced Semiconductor Mat | Nitrogen trifluoride as an in-situ cleaning agent |
| US4680087A (en) * | 1986-01-17 | 1987-07-14 | Allied Corporation | Etching of dielectric layers with electrons in the presence of sulfur hexafluoride |
| DE3725346A1 (de) * | 1987-07-30 | 1989-02-09 | Nukem Gmbh | Verfahren zur wiederverwendung von silizium-basismaterial einer metall-isolator-halbleiter-(mis)-inversionsschicht-solarzelle |
| US4832787A (en) * | 1988-02-19 | 1989-05-23 | International Business Machines Corporation | Gas mixture and method for anisotropic selective etch of nitride |
| EP0406434B1 (en) * | 1988-11-18 | 1996-07-17 | Kabushiki Kaisha Shibaura Seisakusho | Dry-etching method |
| US5188704A (en) * | 1989-10-20 | 1993-02-23 | International Business Machines Corporation | Selective silicon nitride plasma etching |
| US4978420A (en) * | 1990-01-03 | 1990-12-18 | Hewlett-Packard Company | Single chamber via etch through a dual-layer dielectric |
| US5376211A (en) * | 1990-09-29 | 1994-12-27 | Tokyo Electron Limited | Magnetron plasma processing apparatus and processing method |
| US5431772A (en) * | 1991-05-09 | 1995-07-11 | International Business Machines Corporation | Selective silicon nitride plasma etching process |
| EP0541160A1 (en) * | 1991-11-07 | 1993-05-12 | Koninklijke Philips Electronics N.V. | Method of manufacturing a semiconductor device whereby contact windows are provided in an insulating layer comprising silicon nitride in two etching steps |
| US5716494A (en) * | 1992-06-22 | 1998-02-10 | Matsushita Electric Industrial Co., Ltd. | Dry etching method, chemical vapor deposition method, and apparatus for processing semiconductor substrate |
| US5538659A (en) * | 1993-03-29 | 1996-07-23 | E. I. Du Pont De Nemours And Company | Refrigerant compositions including hexafluoropropane and a hydrofluorocarbon |
| US5468342A (en) * | 1994-04-28 | 1995-11-21 | Cypress Semiconductor Corp. | Method of etching an oxide layer |
| USRE39895E1 (en) | 1994-06-13 | 2007-10-23 | Renesas Technology Corp. | Semiconductor integrated circuit arrangement fabrication method |
| DE69508273T2 (de) | 1994-11-18 | 1999-11-04 | Advanced Micro Devices, Inc. | Verfahren zum ätzen von siliziumnitrid mit verstärkung der kritischen abmessung |
| US5922622A (en) * | 1996-09-03 | 1999-07-13 | Vanguard International Semiconductor Corporation | Pattern formation of silicon nitride |
| EP0945896B1 (en) * | 1996-10-11 | 2005-08-10 | Tokyo Electron Limited | Plasma etching method |
| US5972796A (en) * | 1996-12-12 | 1999-10-26 | Texas Instruments Incorporated | In-situ barc and nitride etch process |
| US5786276A (en) * | 1997-03-31 | 1998-07-28 | Applied Materials, Inc. | Selective plasma etching of silicon nitride in presence of silicon or silicon oxides using mixture of CH3F or CH2F2 and CF4 and O2 |
| JPH11186236A (ja) * | 1997-12-24 | 1999-07-09 | Mitsubishi Electric Corp | エッチング方法 |
| JPH11214355A (ja) * | 1998-01-20 | 1999-08-06 | Nec Corp | 異方性ドライエッチング方法 |
| US6656375B1 (en) | 1998-01-28 | 2003-12-02 | International Business Machines Corporation | Selective nitride: oxide anisotropic etch process |
| US7173339B1 (en) | 1998-06-22 | 2007-02-06 | Micron Technology, Inc. | Semiconductor device having a substrate an undoped silicon oxide structure and an overlaying doped silicon oxide structure with a sidewall terminating at the undoped silicon oxide structure |
| US6117791A (en) * | 1998-06-22 | 2000-09-12 | Micron Technology, Inc. | Etchant with selectivity for doped silicon dioxide over undoped silicon dioxide and silicon nitride, processes which employ the etchant, and structures formed thereby |
| US6875371B1 (en) | 1998-06-22 | 2005-04-05 | Micron Technology, Inc. | Etchant with selectivity for doped silicon dioxide over undoped silicon dioxide and silicon nitride, processes which employ the etchant, and structures formed thereby |
| US6069087A (en) * | 1998-08-25 | 2000-05-30 | Micron Technology, Inc. | Highly selective dry etching process |
| TW424278B (en) * | 1999-07-30 | 2001-03-01 | Mosel Vitelic Inc | Method for etching protection layer and anti-reflective layer on a substrate |
| US6656847B1 (en) | 1999-11-01 | 2003-12-02 | Taiwan Semiconductor Manufacturing Company | Method for etching silicon nitride selective to titanium silicide |
| JP2004503082A (ja) * | 2000-07-05 | 2004-01-29 | マイクロン テクノロジー インコーポレイテッド | 無ドープの酸化ケイ素と窒化珪素との上部にあるドープされた酸化ケイ素のための選択性を有するエッチング剤、そのエッチング剤を使用する方法、及びそれにより形成された構造。 |
| JP2002134472A (ja) * | 2000-10-20 | 2002-05-10 | Mitsubishi Electric Corp | エッチング方法、エッチング装置および半導体装置の製造方法 |
| JP2002158213A (ja) * | 2000-11-21 | 2002-05-31 | Sharp Corp | 半導体装置の製造方法 |
| US6670278B2 (en) | 2001-03-30 | 2003-12-30 | Lam Research Corporation | Method of plasma etching of silicon carbide |
| JP2002319574A (ja) * | 2001-04-23 | 2002-10-31 | Nec Corp | 窒化シリコン膜の除去方法 |
| AU2002303842A1 (en) * | 2001-05-22 | 2002-12-03 | Reflectivity, Inc. | A method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants |
| US6645848B2 (en) | 2001-06-01 | 2003-11-11 | Emcore Corporation | Method of improving the fabrication of etched semiconductor devices |
| JP2004055610A (ja) * | 2002-07-16 | 2004-02-19 | Fujitsu Ltd | 半導体装置の製造方法 |
| US7268082B2 (en) * | 2004-04-30 | 2007-09-11 | International Business Machines Corporation | Highly selective nitride etching employing surface mediated uniform reactive layer films |
| US20060011578A1 (en) * | 2004-07-16 | 2006-01-19 | Lam Research Corporation | Low-k dielectric etch |
| KR20070047624A (ko) * | 2005-11-02 | 2007-05-07 | 주성엔지니어링(주) | 박막 패턴 형성 방법 |
| US8252696B2 (en) * | 2007-10-22 | 2012-08-28 | Applied Materials, Inc. | Selective etching of silicon nitride |
| CN101983417B (zh) * | 2008-03-31 | 2013-04-24 | 日本瑞翁株式会社 | 等离子体蚀刻方法 |
| US20110223770A1 (en) * | 2010-03-15 | 2011-09-15 | Lam Research Corporation | Nitride plasma etch with highly tunable selectivity to oxide |
| US8501630B2 (en) * | 2010-09-28 | 2013-08-06 | Tokyo Electron Limited | Selective etch process for silicon nitride |
| KR101962191B1 (ko) | 2011-03-29 | 2019-03-26 | 제온 코포레이션 | 플라즈마 에칭 가스 및 플라즈마 에칭 방법 |
| US9190316B2 (en) * | 2011-10-26 | 2015-11-17 | Globalfoundries U.S. 2 Llc | Low energy etch process for nitrogen-containing dielectric layer |
| US8765613B2 (en) | 2011-10-26 | 2014-07-01 | International Business Machines Corporation | High selectivity nitride etch process |
| US9257293B2 (en) | 2013-03-14 | 2016-02-09 | Applied Materials, Inc. | Methods of forming silicon nitride spacers |
| FR3013895B1 (fr) | 2013-11-25 | 2017-04-14 | Commissariat Energie Atomique | Procede de formation des espaceurs d'une grille d'un transistor |
| FR3023971B1 (fr) | 2014-07-18 | 2016-08-05 | Commissariat Energie Atomique | Procede de formation des espaceurs d'une grille d'un transistor |
| US10217681B1 (en) | 2014-08-06 | 2019-02-26 | American Air Liquide, Inc. | Gases for low damage selective silicon nitride etching |
| EP3107124B1 (fr) | 2015-06-19 | 2018-04-04 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procédé de formation des espaceurs d'une grille d'un transistor |
| FR3037717B1 (fr) | 2015-06-19 | 2017-06-09 | Commissariat Energie Atomique | Procede de formation des espaceurs d'une grille d'un transistor |
| FR3041471B1 (fr) | 2015-09-18 | 2018-07-27 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de formation des espaceurs d'une grille d'un transistor |
| CN107731686A (zh) * | 2016-08-12 | 2018-02-23 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构的形成方法 |
| WO2018044713A1 (en) * | 2016-08-29 | 2018-03-08 | Tokyo Electron Limited | Method of quasi-atomic layer etching of silicon nitride |
| US10879108B2 (en) * | 2016-11-15 | 2020-12-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Topographic planarization method for lithography process |
| WO2018156975A1 (en) | 2017-02-23 | 2018-08-30 | Tokyo Electron Limited | Method of quasi-atomic layer etching of silicon nitride |
| WO2018156985A1 (en) | 2017-02-23 | 2018-08-30 | Tokyo Electron Limited | Method of anisotropic extraction of silicon nitride mandrel for fabrication of self-aligned block structures |
| US11295960B1 (en) * | 2021-03-09 | 2022-04-05 | Hitachi High-Tech Corporation | Etching method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1417085A (en) * | 1973-05-17 | 1975-12-10 | Standard Telephones Cables Ltd | Plasma etching |
| US3975252A (en) * | 1975-03-14 | 1976-08-17 | Bell Telephone Laboratories, Incorporated | High-resolution sputter etching |
| US4181564A (en) * | 1978-04-24 | 1980-01-01 | Bell Telephone Laboratories, Incorporated | Fabrication of patterned silicon nitride insulating layers having gently sloping sidewalls |
| US4283249A (en) * | 1979-05-02 | 1981-08-11 | International Business Machines Corporation | Reactive ion etching |
| US4260649A (en) * | 1979-05-07 | 1981-04-07 | The Perkin-Elmer Corporation | Laser induced dissociative chemical gas phase processing of workpieces |
| EP0049400B1 (en) * | 1980-09-22 | 1984-07-11 | Kabushiki Kaisha Toshiba | Method of smoothing an insulating layer formed on a semiconductor body |
| JPS5834919A (ja) * | 1981-08-27 | 1983-03-01 | Japan Synthetic Rubber Co Ltd | プラズマ化学反応によるエツチング方法 |
-
1984
- 1984-05-30 DE DE19843420347 patent/DE3420347A1/de active Granted
- 1984-06-01 NL NL8401774A patent/NL8401774A/nl not_active Application Discontinuation
- 1984-06-01 US US06/616,114 patent/US4529476A/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11437244B2 (en) | 2017-04-06 | 2022-09-06 | Kanto Denka Kogyo Co., Ltd. | Dry etching gas composition and dry etching method |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3420347C2 (oth) | 1987-08-20 |
| DE3420347A1 (de) | 1984-12-06 |
| US4529476A (en) | 1985-07-16 |
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| A1A | A request for search or an international-type search has been filed | ||
| BB | A search report has been drawn up | ||
| BV | The patent application has lapsed |