NL191912C - Geïntegreerd circuit. - Google Patents

Geïntegreerd circuit.

Info

Publication number
NL191912C
NL191912C NL8400132A NL8400132A NL191912C NL 191912 C NL191912 C NL 191912C NL 8400132 A NL8400132 A NL 8400132A NL 8400132 A NL8400132 A NL 8400132A NL 191912 C NL191912 C NL 191912C
Authority
NL
Netherlands
Prior art keywords
integrated circuit
integrated
circuit
Prior art date
Application number
NL8400132A
Other languages
English (en)
Dutch (nl)
Other versions
NL8400132A (nl
NL191912B (nl
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of NL8400132A publication Critical patent/NL8400132A/nl
Publication of NL191912B publication Critical patent/NL191912B/xx
Application granted granted Critical
Publication of NL191912C publication Critical patent/NL191912C/xx

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/003—Modifications for increasing the reliability for protection
    • H03K19/00346—Modifications for eliminating interference or parasitic voltages or currents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H01L23/5286—Arrangements of power or ground buses
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/0175—Coupling arrangements; Interface arrangements
    • H03K19/017545—Coupling arrangements; Impedance matching circuits
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K5/00—Manipulating of pulses not covered by one of the other main groups of this subclass
    • H03K5/125—Discriminating pulses
    • H03K5/1252—Suppression or limitation of noise or interference
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geometry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Manipulation Of Pulses (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
NL8400132A 1983-01-18 1984-01-16 Geïntegreerd circuit. NL191912C (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/458,769 US4514749A (en) 1983-01-18 1983-01-18 VLSI Chip with ground shielding
US45876983 1983-01-18

Publications (3)

Publication Number Publication Date
NL8400132A NL8400132A (nl) 1984-08-16
NL191912B NL191912B (nl) 1996-06-03
NL191912C true NL191912C (nl) 1996-10-04

Family

ID=23822007

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8400132A NL191912C (nl) 1983-01-18 1984-01-16 Geïntegreerd circuit.

Country Status (6)

Country Link
US (1) US4514749A (fr)
JP (1) JPS59136948A (fr)
DE (1) DE3401181C2 (fr)
FR (1) FR2547676B1 (fr)
GB (1) GB2134708B (fr)
NL (1) NL191912C (fr)

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US4649417A (en) * 1983-09-22 1987-03-10 International Business Machines Corporation Multiple voltage integrated circuit packaging substrate
JPS60134440A (ja) * 1983-12-23 1985-07-17 Hitachi Ltd 半導体集積回路装置
US4885628A (en) * 1984-08-22 1989-12-05 Hitachi, Ltd. Semiconductor integrated circuit device
JPH0728365B2 (ja) * 1984-11-05 1995-03-29 株式会社東芝 密着型イメ−ジセンサ
CA1246755A (fr) * 1985-03-30 1988-12-13 Akira Miyauchi Dispositif semiconducteur
JPS6341048A (ja) * 1986-08-06 1988-02-22 Mitsubishi Electric Corp 標準セル方式大規模集積回路
JPS6448035U (fr) * 1987-09-18 1989-03-24
JP2653099B2 (ja) * 1988-05-17 1997-09-10 セイコーエプソン株式会社 アクティブマトリクスパネル，投写型表示装置及びビューファインダー
JPH021928A (ja) * 1988-06-10 1990-01-08 Toshiba Corp 半導体集積回路
US5428242A (en) * 1988-11-22 1995-06-27 Seiko Epson Corporation Semiconductor devices with shielding for resistance elements
US5301349A (en) * 1988-12-28 1994-04-05 Kabushiki Kaisha Toshiba Single chip computer having ground wire formed immediately parallel a data bus and drivers formed directly under the data bus for high speed data transfer
US4947235A (en) * 1989-02-21 1990-08-07 Delco Electronics Corporation Integrated circuit shield
JPH02263462A (ja) * 1989-04-03 1990-10-26 Mitsubishi Electric Corp 半導体装置
DE3941679A1 (de) * 1989-12-18 1991-06-27 Telefunken Electronic Gmbh Fotomodul
US5027183A (en) * 1990-04-20 1991-06-25 International Business Machines Isolated semiconductor macro circuit
JPH04267586A (ja) * 1991-02-22 1992-09-24 Nec Corp 同軸配線パターンおよびその形成方法
JPH05136125A (ja) * 1991-11-14 1993-06-01 Hitachi Ltd クロツク配線及びクロツク配線を有する半導体集積回路装置
KR940008132B1 (ko) * 1991-11-28 1994-09-03 삼성전자 주식회사 신호선간의 잡음을 억제하는 메모리 소자
US5329188A (en) * 1991-12-09 1994-07-12 Cray Research, Inc. Clock pulse measuring and deskewing system and process
JPH0629393A (ja) * 1992-05-12 1994-02-04 Nec Corp 半導体集積回路
US5629840A (en) * 1992-05-15 1997-05-13 Digital Equipment Corporation High powered die with bus bars
JP2854757B2 (ja) * 1992-06-17 1999-02-03 三菱電機株式会社 半導体パワーモジュール
JPH0677403A (ja) * 1992-08-26 1994-03-18 Mitsubishi Electric Corp 半導体集積回路装置及びその設計方法
DE69306919T2 (de) * 1992-11-18 1997-05-15 Fuji Electric Co Ltd Halbleiter-Umwandlungsvorrichtung
JPH0758301A (ja) * 1993-08-13 1995-03-03 Oki Electric Ind Co Ltd 半導体集積回路装置
GB2286286B (en) * 1993-12-31 1998-05-27 Hyundai Electronics Ind Improvements in or relating to the fabrication of semiconductor devices
IT1272933B (it) * 1994-01-28 1997-07-01 Fujitsu Ltd Dispositivo a circuito integrato di semiconduttore
US5896055A (en) * 1995-11-30 1999-04-20 Matsushita Electronic Industrial Co., Ltd. Clock distribution circuit with clock branch circuits connected to outgoing and return lines and outputting synchronized clock signals by summing time integrals of clock signals on the outgoing and return lines
JP2921463B2 (ja) * 1996-01-30 1999-07-19 日本電気株式会社 半導体集積回路チップ
US6087728A (en) * 1996-06-27 2000-07-11 Intel Corporation Interconnect design with controlled inductance
JP3501620B2 (ja) * 1997-05-26 2004-03-02 株式会社 沖マイクロデザイン 半導体集積回路
US6480548B1 (en) 1997-11-17 2002-11-12 Silicon Graphics, Inc. Spacial derivative bus encoder and decoder
US6307252B1 (en) 1999-03-05 2001-10-23 Agere Systems Guardian Corp. On-chip shielding of signals
KR20010009697A (ko) 1999-07-13 2001-02-05 윤종용 차폐선을 구비한 반도체 집적회로
US6775339B1 (en) 1999-08-27 2004-08-10 Silicon Graphics, Inc. Circuit design for high-speed digital communication
US6574711B2 (en) * 1999-12-27 2003-06-03 Matsushita Electric Industrial Co., Ltd. Semiconductor integrated circuit
US6417713B1 (en) 1999-12-30 2002-07-09 Silicon Graphics, Inc. Programmable differential delay circuit with fine delay adjustment
US7031420B1 (en) 1999-12-30 2006-04-18 Silicon Graphics, Inc. System and method for adaptively deskewing parallel data signals relative to a clock
US6831924B1 (en) 2000-07-20 2004-12-14 Silicon Graphics, Inc. Variable mode bi-directional and uni-directional computer communication system
US6518812B1 (en) 2000-07-20 2003-02-11 Silicon Graphics, Inc. Discrete delay line system and method
US7333516B1 (en) 2000-07-20 2008-02-19 Silicon Graphics, Inc. Interface for synchronous data transfer between domains clocked at different frequencies
US6496048B1 (en) 2000-07-20 2002-12-17 Silicon Graphics, Inc. System and method for accurate adjustment of discrete integrated circuit delay lines
US6839856B1 (en) 2000-07-20 2005-01-04 Silicon Graphics, Inc. Method and circuit for reliable data capture in the presence of bus-master changeovers
US7248635B1 (en) 2000-07-20 2007-07-24 Silicon Graphics, Inc. Method and apparatus for communicating computer data from one point to another over a communications medium
US6779072B1 (en) 2000-07-20 2004-08-17 Silicon Graphics, Inc. Method and apparatus for accessing MMR registers distributed across a large asic
US6703908B1 (en) 2000-07-20 2004-03-09 Silicon Graphic, Inc. I/O impedance controller
US6441666B1 (en) 2000-07-20 2002-08-27 Silicon Graphics, Inc. System and method for generating clock signals
US6681293B1 (en) 2000-08-25 2004-01-20 Silicon Graphics, Inc. Method and cache-coherence system allowing purging of mid-level cache entries without purging lower-level cache entries
US6538304B1 (en) * 2000-11-16 2003-03-25 Texas Instruments Incorporated Corner bonding to lead frame
JP4083977B2 (ja) * 2000-12-20 2008-04-30 富士通株式会社 半導体集積回路及び配線決定方法
US6657285B1 (en) * 2002-07-08 2003-12-02 Alcor Micro, Corp. Semiconductor anti-interference band for integrated circuit
US6919619B2 (en) * 2003-02-28 2005-07-19 The Regents Of The University Of Michigan Actively-shielded signal wires
US7015569B1 (en) * 2004-08-26 2006-03-21 Lsi Logic Corporation Method and apparatus for implementing a co-axial wire in a semiconductor chip
US7327167B2 (en) * 2005-04-28 2008-02-05 Silicon Graphics, Inc. Anticipatory programmable interface pre-driver

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5255881A (en) * 1975-11-04 1977-05-07 Matsushita Electronics Corp Semiconductor integrated circuit
DE2616975C3 (de) * 1976-04-17 1981-07-09 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Anordnung von Nutzsignal- und Steuersignalleitungen zum kopplungsarmen Verdrahten von Halbleiterschaltern
JPS537181A (en) * 1976-07-09 1978-01-23 Hitachi Ltd Semiconductor integrated circuit
JPS6056307B2 (ja) * 1976-12-08 1985-12-09 日本電気株式会社 半導体装置
US4308421A (en) * 1978-01-18 1981-12-29 Virginia Plastics Company EMF Controlled multi-conductor cable
JPS5587462A (en) * 1978-12-25 1980-07-02 Fujitsu Ltd Integrated circuit package
GB2060266B (en) * 1979-10-05 1984-05-31 Borrill P L Multilayer printed circuit board
JPS56137666A (en) * 1980-03-31 1981-10-27 Hitachi Ltd Integrated circuit for combustion control
JPS5840344B2 (ja) * 1980-06-10 1983-09-05 富士通株式会社 半導体記憶装置
JPS5784149A (en) * 1980-11-14 1982-05-26 Hitachi Ltd Semiconductor integrated circuit device

Also Published As

Publication number Publication date
GB2134708A (en) 1984-08-15
FR2547676B1 (fr) 1987-07-24
FR2547676A1 (fr) 1984-12-21
US4514749A (en) 1985-04-30
NL8400132A (nl) 1984-08-16
JPS59136948A (ja) 1984-08-06
NL191912B (nl) 1996-06-03
GB8400967D0 (en) 1984-02-15
JPH0572744B2 (fr) 1993-10-12
DE3401181C2 (de) 1996-05-15
GB2134708B (en) 1986-03-12
DE3401181A1 (de) 1984-07-19

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Legal Events

Date Code Title Description
A1A A request for search or an international-type search has been filed
A85 Still pending on 85-01-01
BB A search report has been drawn up
BC A request for examination has been filed
V1 Lapsed because of non-payment of the annual fee

Effective date: 20020801